Method for forming a defect-free surface on a porous ceramic substrate

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(11)

EP 0 421 054 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	21.08.1991 Bulletin 1991/34

(43)	Date of publication A2:
	10.04.1991 Bulletin 1991/15

(21)	Application number: 90110404.2

(22)	Date of filing: 01.06.1990

(51)	International Patent Classification (IPC)⁵: H05K 3/02, B23P 6/00, H05K 3/38

(84)	Designated Contracting States:
	DE FR GB

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Priority:

05.10.1989 US 417365

(71)	Applicant: International Business Machines Corporation
	Armonk, N.Y. 10504 (US)

(72)	Inventors:
	Humenik, James Noel LaGrangeville, New York 12540 (US) Miersch, Ekkehard Fritz D-7036 Schönaich (DE) Perry, Charles Hampton Poughkeepsie, New York 12603 (US) Wilczynski, Janusz Stanislaw Ossining, New York 10562 (US)

(74)	Representative: Schäfer, Wolfgang, Dipl.-Ing.
	IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht D-70548 Stuttgart D-70548 Stuttgart (DE)

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References cited: :

(54)	Method for forming a defect-free surface on a porous ceramic substrate

(57) An object of the present invention is to provide a process for hermetically sealing defects (12) in a porous ceramic substrate (10) comprising the steps of evaporating or sputtering a malleable metal layer (14) onto the defective porous ceramic surface, swaging or smearing the malleable metal layer over the defects and depositing a second metal film (16) over the swagged first film to provide a smooth defect free surface.

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