(19)
(11) EP 0 446 934 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
30.06.1993 Bulletin 1993/26

(43) Date of publication A2:
18.09.1991 Bulletin 1991/38

(21) Application number: 91103974.1

(22) Date of filing: 14.03.1991
(51) International Patent Classification (IPC)5: B22F 3/26, B22F 3/10, F28F 13/00
// C23C4/02, C23C4/18
(84) Designated Contracting States:
DE FR GB

(30) Priority: 15.03.1990 JP 65197/90
28.02.1991 JP 59545/91

(71) Applicant: KABUSHIKI KAISHA TOSHIBA
Kawasaki-shi, Kanagawa-ken 210 (JP)

(72) Inventors:
  • Takahashi, Masashi, c/o Intellectual Property Div.
    Minato-ku, Tokyo 105 (JP)
  • Itoh, Yoshiyasu, c/o Intellectual Property Div.
    Minato-ku, Tokyo 105 (JP)

(74) Representative: Henkel, Feiler, Hänzel & Partner 
Möhlstrasse 37
81675 München
81675 München (DE)


(56) References cited: : 
   
       


    (54) Fabricating method of composite material, and heat conductive material and fabricating method of heat conductive material


    (57) In order to obtain a composite material excellent in the bonding strength (adhesion) of two materials and thermal conductivity, the invention presents a fabricating method of a composite material by compounding a high melting material W and a low melting material Cu, which comprises, a first step (1, 2, 3) of forming pores in the high melting material W, having the porosity distribution so that the porosity may be large at least in part of the surface thereof and that the porosity may gradually increase toward that part, and a second step (4) of infiltrating the low melting material Cu from the large porosity part of the material obtained in the first step (1, 2, 3), wherein the composition ratio of the high melting material and low melting material is in a gradient distribution.






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