(19)
(11) EP 0 462 586 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
13.01.1993 Bulletin 1993/02

(43) Date of publication A2:
27.12.1991 Bulletin 1991/52

(21) Application number: 91110039.4

(22) Date of filing: 19.06.1991
(51) International Patent Classification (IPC)5B27N 3/06, B27D 1/00
(84) Designated Contracting States:
DE FR GB IT SE

(30) Priority: 19.06.1990 JP 160399/90

(71) Applicant: KABUSHIKI KAISHA JUKEN SANGYO
Hiroshima-ken (JP)

(72) Inventor:
  • Nakamoto, Yusho
    Hiroshima-ken (JP)

(74) Representative: Füchsle, Klaus, Dipl.-Ing. et al
Hoffmann, Eitle & Partner, Patentanwälte, Postfach 81 04 20
81904 München
81904 München (DE)


(56) References cited: : 
   
       


    (54) Woody board


    (57) Disclosed is a woody board, in which a molded layer of a woody material of a wood powder or woody fibers is provided on one surface or both surfaces of a woody substrate of a molded sheet of a coniferous tree plywood or coniferous tree LVL, and a method of preparing said woody board. The woody board is prepared by molding a woody material mix comprising an adhesive and a woody material of a wood powder or woody fibers on at least one surface of a woody substrate. The woody board has a flat and smooth surface and has a high mechanical strength and a high screw-drawing resistance.





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