<?xml version="1.0" encoding="UTF-8"?><!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd"><!-- Disclaimer: This ST.36 XML data has been generated from A2/A1 XML data enriched with the publication date of the A3 document - March 2013 - EPO - Directorate Publication - kbaumeister@epo.org --><ep-patent-document id="EP91110039A3" file="EP91110039NWA3.xml" lang="en" doc-number="0462586" date-publ="19930113" kind="A3" country="EP" status="N" dtd-version="ep-patent-document-v1-4"><SDOBI lang="en"><B000><eptags><B001EP>......DE....FRGB..IT......SE......................</B001EP><B005EP>R</B005EP></eptags></B000><B100><B110>0462586</B110><B120><B121>EUROPEAN PATENT APPLICATION</B121></B120><B130>A3</B130><B140><date>19930113</date></B140><B190>EP</B190></B100><B200><B210>91110039.4</B210><B220><date>19910619</date></B220><B240 /><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>160399/90</B310><B320><date>19900619</date></B320><B330><ctry>JP</ctry></B330></B300><B400><B405><date>19930113</date><bnum>199302</bnum></B405><B430><date>19911227</date><bnum>199152</bnum></B430></B400><B500><B510><B516>5</B516><B511> 5B 27N   3/06   A</B511><B512> 5B 27D   1/00   B</B512></B510><B540><B541>de</B541><B542>Holzähnliches Brett</B542><B541>en</B541><B542>Woody board</B542><B541>fr</B541><B542>Planche ressemblant à du bois</B542></B540><B560 /></B500><B700><B710><B711><snm>KABUSHIKI KAISHA JUKEN SANGYO</snm><iid>01383200</iid><irf>54 592 a/ip</irf><syn>JUKEN SANGYO, KABUSHIKI KAISHA</syn><syn>SANGYO, KABUSHIKI KAISHA JUKEN</syn><adr><str>1-1, Mokuzaiko-Minami,
Hatsukaichi-shi</str><city>Hiroshima-ken</city><ctry>JP</ctry></adr></B711></B710><B720><B721><snm>Nakamoto, Yusho</snm><adr><str>4-19-18,  Ajina,
Hatsukaichi-shi</str><city>Hiroshima-ken</city><ctry>JP</ctry></adr></B721></B720><B740><B741><snm>Füchsle, Klaus, Dipl.-Ing.</snm><sfx>et al</sfx><iid>00003971</iid><adr><str>Hoffmann, Eitle &amp; Partner,
Patentanwälte,
Postfach 81 04 20</str><city>81904 München</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>DE</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>IT</ctry><ctry>SE</ctry></B840><B880><date>19930113</date><bnum>199302</bnum></B880></B800></SDOBI><abstract id="abst" lang="en"><p id="pa01" num="0001">Disclosed is a woody board, in which a molded layer of a woody material of a wood powder or woody fibers is provided on one surface or both surfaces of a woody substrate of a molded sheet of a coniferous tree plywood or coniferous tree LVL, and a method of preparing said woody board. The woody board is prepared by molding a woody material mix comprising an adhesive and a woody material of a wood powder or woody fibers on at least one surface of a woody substrate. The woody board has a flat and smooth surface and has a high mechanical strength and a high screw-drawing resistance.</p></abstract><search-report-data id="srep" srep-office="EP" date-produced="" lang=""><doc-page id="srep0001" file="srep0001.tif" type="tif" orientation="portrait" he="297" wi="210" /></search-report-data></ep-patent-document>