LOW INDUCTANCE ENCAPSULATED PACKAGE INCLUDING A SEMICONDUCTOR CHIP - Patent 0470210

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EP 0 470 210 A1

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(43)	Date of publication:
	12.02.1992 Bulletin 1992/07

(21)	Application number: 90917818.0

(22)	Date of filing: 12.06.1990

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International Patent Classification (IPC):

H01L 21/ 60^{( . )}
H01L 23/ 485^{( . )}

H01L 23/ 48^{( . )}

(86)	International application number:
	PCT/US1990/003330

(87)	International publication number:
	WO 1991/000617 (10.01.1991 Gazette 1991/02)

(84)	Designated Contracting States:
	DE FR GB IT

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Priority:

03.07.1989 US 19890375640

(71)	Applicant: GENERAL ELECTRIC COMPANY
	Schenectady, NY 12345 (US)

(72)	Inventors:
	NEUGEBAUER, Constantine, Alois Schenectady, NY 12309 (US) SATRIANO, Robert, Joseph Hackettstown, NJ 07840 (US) BURGESS, James, Francis Schenectady, NY 12309 (US) WATROUS, Donald, Leland Clifton Park, NY 12065 (US)

(74)	Representative: Pratt, Richard Wilson, et al
	London Patent Operation G.E. Technical Services Co. Inc. Essex House 12/13 Essex Street London WC2R 3AA London WC2R 3AA (GB)

(54)	LOW INDUCTANCE ENCAPSULATED PACKAGE INCLUDING A SEMICONDUCTOR CHIP