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(11) | EP 0 481 454 A3 |
(12) | EUROPEAN PATENT APPLICATION |
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(54) | Lateral MOS FET and manufacturing method thereof |
(57) In a lateral MOS FET, a back gate region a part of whose surface is a channel region
is formed to surround the drain region, while being in contact with a part of the
periphery of the drain region. With this configuration, if a high voltage electrostatic
surge invades the drain electrode, a surge current will disperse from the drain region
toward the surrounding back gate region. As a result, a rise in the electric potential
at the drain region is suppressed smaller. Thus the electric potential hardly exceed
the dielectric strength of the gate insulating film, thereby suppressing a breakdown
of the gate insulating film and an electrostatic breakdown of the device. |