(57) An organic resin multi-layer wiring substrate comprises a plurality of lamination
blocks with a plurality of holes. Each lamination block is made by alternately laminating
a plurality of electrically conductive wiring layers and insulation layers of organic
resin. The holes penetrate the insulation blocks and also electrically interconnect
the lamination blocks. A method of making an organic resin multi-layer wiring substrate
comprising the steps of forming a plurality of lamination blocks (1,2) by alternately
laminating a plurality of electrically conductive wiring layers (13a, 13b, 23a, 23b)
and insulation layers (15, 26) of organic resin on hard plates (10, 20), adhering
the two lamination blocks with the laminated layers abutting against each other, removing
the hard plate (10) of one of the lamination blocks using appropriate solvent, and
forming holes (3) through the one lamination block and extending into the other lamination
block.
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