(19)
(11) EP 0 492 776 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
07.07.1993 Bulletin 1993/27

(43) Date of publication A2:
01.07.1992 Bulletin 1992/27

(21) Application number: 91308902.5

(22) Date of filing: 27.09.1991
(51) International Patent Classification (IPC)5G06F 12/08, G11C 7/00
(84) Designated Contracting States:
DE FR GB IT

(30) Priority: 25.12.1990 JP 406040/90
08.02.1991 JP 17677/91
16.04.1991 JP 84248/91

(71) Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
Tokyo (JP)

(72) Inventors:
  • Konishi, Yasuhiro, c/o Mitsubishi Denki
    Itami-shi, Hyogo-ken (JP)
  • Dosaka, Katsumi, c/o Mitsubishi Denki
    Itami-shi, Hyogo-ken (JP)
  • Hayano, Kouji, c/o Mitsubishi Denki Kabushiki K.
    Itami-shi, Hyogo-ken (JP)
  • Kumanoya, Masaki, c/o Mitsubishi Denki
    Itami-shi, Hyogo-ken (JP)
  • Yamazaki, Akira, c/o Mitsubishi Denki
    Itami-shi, Hyogo-ken (JP)
  • Iwamoto, Hisashi, c/o Mitsubishi Denki
    Itami-shi, Hyogo-ken (JP)

(74) Representative: Beresford, Keith Denis Lewis et al
BERESFORD & Co. 2-5 Warwick Court High Holborn
London WC1R 5DJ
London WC1R 5DJ (GB)


(56) References cited: : 
   
       


    (54) A semiconductor memory device with a large storage capacity memory and a fast speed memory


    (57) A semiconductor memory device containing a cache includes a SRAM (2) as a cache memory, and a DRAM (1) as a main memory. Collective transfer of data blocks is possible between the DRAM array (1) and the SRAM array (2) through a bi-directional transfer gate circuit (3) and through an internal data line (SBL and 16a and 16b). A DRAM row decoder (14) and a DRAM column decoder (15) are provided in the DRAM array (1). A SRAM zow decoder (21) and an SRAM column decoder (22) are provided in the SRAM array (2). Addresses of the SRAM array 2 and DRAM array 1 can be independently applied. The data transfer gate includes a latch circuit (1811) for latching data from the SRAM (2) as a high speed memory, an amplifier circuit (1814) and a gate circuit (1815) for amplifying data from the DRAM (1) as a large capacity memory and for transmitting the same to the SRAM, and a gate circuit (1813) responsive to a DRAM write enable signal (AWDE) for transmitting write data to corresponding memory cells of the DRAM. After the data of the SRAM has been latched by a latch circuit (1811), write data is transmitted from the gate circuit (1813) to the DRAM, and the write data is transmitted to the SRAM through the amplifier circuit (1814) and the gate circuit (1815). This structure realizes a high speed semiconductor memory device which can be applied to a desired mapping method with a small area of occupation.







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