(19)
(11) EP 0 493 016 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
13.01.1993 Bulletin 1993/02

(43) Date of publication A2:
01.07.1992 Bulletin 1992/27

(21) Application number: 91311864.2

(22) Date of filing: 20.12.1991
(51) International Patent Classification (IPC)5H05K 13/08, G05B 19/04, H05B 33/08, H01L 21/00
(84) Designated Contracting States:
DE FR GB

(30) Priority: 21.12.1990 JP 413173/90

(71) Applicant: ROHM CO., LTD.
Kyoto-shi Kyoto 615 (JP)

(72) Inventors:
  • Sawase, Kensuke
    Ukyo-ku, Kyoto-shi, Kyoto (JP)
  • Ogata, Hiromi
    Ukyo-ku, Kyoto-shi, Kyoto (JP)

(74) Representative: Cross, Rupert Edward Blount et al
BOULT, WADE & TENNANT 27 Furnival Street
London EC4A 1PQ
London EC4A 1PQ (GB)


(56) References cited: : 
   
       


    (54) Wire bonding system


    (57) The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.





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