SEMICONDUCTOR INTERCONNECT STRUCTURE UTILIZING A POLYIMIDE INSULATOR - Patent 0507881

(19)

(11)

EP 0 507 881 A1

(12)

(43)	Date of publication:
	14.10.1992 Bulletin 1992/42

(21)	Application number: 91903482.0

(22)	Date of filing: 13.12.1990

(51)

International Patent Classification (IPC):

H01L 21/ 8234^{( . )}
H01L 21/ 768^{( . )}

H01L 21/ 336^{( . )}
H01L 27/ 088^{( . )}

(86)	International application number:
	PCT/US1990/007401

(87)	International publication number:
	WO 1991/010261 (11.07.1991 Gazette 1991/15)

(84)	Designated Contracting States:
	DE FR GB

(30)

Priority:

04.01.1990 US 19900460695

(71)	Applicant: International Business Machines Corporation
	Armonk, N.Y. 10504 (US)

(72)	Inventors:
	ANTHONY, Maureen, A. Poughkeepsie, NY 12603 (US) CHOW, Melanie Poughkeepsie, NY 12603 (US) HSU, Louis, L-C Fishkill, NY 12524 (US) JOSHI, Rajiv, V. Yorktown Heights, NY 10598 (US) WHITE, James, F. Newburgh, NY 12550 (US)

(74)	Representative: de Pena, Alain, et al
	Compagnie IBM France Département de Propriété Intellectuelle F-06610 La Gaude F-06610 La Gaude (FR)

(54)	SEMICONDUCTOR INTERCONNECT STRUCTURE UTILIZING A POLYIMIDE INSULATOR