(57) A process and related apparatus for welding the components on printed circuit plates
by means of a bath of solder in the melted state, using wave, weir, vibration, static
techniques etc., comprising in succession the following phases: fluxing (2), pre-heating
(3), at least one washing (4, 5), the possible replacement of solvents (6), additional
fluxing (7), possible pre-heating (8), welding (9) and possible mild washing (10),
in which the phases from (4) to (8) are carried out in a controlled atmosphere or
in a vacuum.
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