(19)
(11) EP 0 516 436 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
31.03.1993 Bulletin 1993/13

(43) Date of publication A2:
02.12.1992 Bulletin 1992/49

(21) Application number: 92304870.6

(22) Date of filing: 28.05.1992
(51) International Patent Classification (IPC)5H01J 37/34, C23C 14/34
(84) Designated Contracting States:
AT BE CH DE ES FR GB GR IT LI LU NL SE

(30) Priority: 31.05.1991 US 709035

(71) Applicant: DEPOSITION SCIENCES, INC.
Santa Rosa California 95401 (US)

(72) Inventors:
  • Bartolomei, Leroy A.
    Santa Rosa, CA 95404 (US)
  • Read, Thomas
    Santa Rosa, CA 95403 (US)
  • Shevlin, Craig
    Rohnert Park, CA 94928 (US)

(74) Representative: Pendlebury, Anthony et al
PAGE, WHITE & FARRER 54 Doughty Street
London WC1N 2LS
London WC1N 2LS (GB)


(56) References cited: : 
   
       


    (54) Sputtering device


    (57) A sputter coating system (10) employing a vacuum chamber. A movable surface is provided within the chamber which is adapted for mounting substrates (3) and moving them thereon. At least one magnetron sputtering device (5) is positioned at a work station adjacent to the substrate holder and adapted for sputtering at least a selected material onto the substrate. At least a second device (6) is positioned adjacent the first device for providing a plasma for enhancing the plasma formed by the first device.







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