[0001] The present invention is related to co-filed European Patent Application No. (Our
ref: L.10276) "Electronic Ballast Arrangement for a Compact Fluorescent Lamp".
FIELD OF THE INVENTION
[0002] This invention relates to a compact discharge lamp which exhibits improved thermal
management properties.
[0003] In the field of discharge lamps and their associated ballast circuits which are used
to convert a line current into a high frequency operating signal for the discharge
lamp, there have been significant design advances made in the use of electronic circuitry
for developing such high frequency operating signal. The advantage of providing a
high frequency operating signal is significant because it is known that a discharge
lamp exhibits greater efficacy when operated by a high frequency signal rather than
one that is merely at the line current frequency of 60 hz. An example of such an electronic
ballast circuit can be found in the copending application referenced above in which
an operating frequency of between 40 and 100 khz can be achieved by use of power MOSFET
switching devices.
[0004] Along with the benefits that such a high frequency operation provides, one must consider
the certain side effects, most notably, that such an electronic circuit that achieves
a high frequency operation inherently generates an amount of heat that must be dissipated
in order to allow the discharge lamp to operate efficiently. Of course, thermal considerations
are of significance to any ballast circuit arrangement whether electronic or magnetic
devices such as an auto-transformer device for instance are utilized. Moreover, it
can be appreciated that although the thermal management properties of any type of
discharge lamp ballast arrangement play a significant role in the overall lighting
design in which the discharge lamp is intended for use, in the field of a compact
fluorescent type of discharge lamp in which the ballast circuit is disposed within
a plastic housing having a standard Edison screw base for insertion in a typical light
socket, temperature performance is a major concern. Given the structural considerations
such as size and materials utilized for a compact fluorescent product and the fact
that such a product can be used in most standard light sockets as a replacement for
an incandescent lamp, it is important that the temperature generated by the ballast
circuit be controlled such that lamp efficiency is maintained and product integrity
is not compromised. It is known that for a compact fluorescent product utilizing an
electronic ballast circuit, the circuit board can be mounted horizontally relative
to an upright mounted lamp and that such board mounting occurs at the topmost portion
of the housing base, that is, such mounting occurs at the point furthest from the
electrical connection to the screw base. It can be appreciated that with this illustrated
orientation of the circuit board within the housing base, the thermal performance
characteristics of the ballast will be affected by spacing around the circuit board
as well as the placement of the board relative to bottom portion of the housing base.
An example of a horizontal ballast mounting arrangement for a compact fluorescent
lamp can be found in U.S. Patent No. 4,695,767 issued to Wittmann on September 22,
1987. Accordingly, it would be advantageous if an arrangement for controlling the
temperature performance characteristics of an electronic or electrical ballast circuit
for a discharge type of lamp were provided.
[0005] For the particular application of an electronic ballast circuit in the housing base
of a compact fluorescent discharge lamp, in addition to the requirement of managing
the thermal performance characteristics of the ballast circuit in view of the fact
that the device operates at a high frequency, one must also consider the space limitations
that must be met in order for the ballast circuit to actually fit within the housing
base. In fact, component placement within the housing base not only impacts the overall
size consideration of the compact fluorescent lamp but, if in laying out components
within the size constraints of the housing base, one were to look primarily to using
any space within the housing base, the resultant arrangement would leave little space
if any for the purpose of improving thermal convection currents within such housing
base. Accordingly, it would be advantageous that in a compact fluorescent type of
discharge lamp having an electronic ballast circuit disposed in a housing base adaptable
for insertion in a standard light socket, that the electronic components that comprise
the ballast circuit are arranged in as compact a space as possible and yet still allow
for space around such components to achieve adequate flow of thermal convection currents.
SUMMARY OF THE INVENTION
[0006] The present invention provides in one aspect a discharge lamp having a lamp base
and being operable using power line current, said discharge lamp comprising: a lamp
member extending from said lamp base; a ballast circuit disposed within said lamp
base and having circuit means including a group of circuit elements effective to energize
said lamp member to a discharge state; and mounting means disposed within said lamp
base and having mounted thereon, at least two of said group of circuit elements, said
mounting means contacting said lamp base in a manner such that said lamp base acts
as a heat sink for said ballast circuit.
[0007] The present invention provides in a further aspect a compact fluorescent discharge
lamp having an electronic ballast disposed within a housing base and operable using
power line current, said compact fluorescent discharge lamp comprising: a tubular
lamp member extending from said housing base; circuit means including a group of circuit
elements for driving said tubular lamp member to a discharge state; and means for
mounting said circuit means within said housing base in a vertical orientation relative
to said discharge lamp being mounted in an upright position.
[0008] The present invention provides in a further aspect a discharge lamp operable using
power line current, comprising: a discharge lamp member; a housing base from which
said discharge lamp extends on one end and further having secured thereto, means for
connecting to said power line current; a ballast circuit having elements effective
so as to produce a resonant operating signal for driving said discharge lamp member
to a discharge state; and mounting means disposed within said housing base and being
effective for supporting thereon, at least some of said elements of said ballast circuit,
said mounting means further being in thermal contact with said connecting means of
said housing base such that heat generated by said ballast circuit can be at least
partially dissipated by said connecting means.
[0009] The present invention provides for a thermal management arrangement for the ballasting
circuit of a discharge lamp, particularly when such discharge lamp is a compact fluorescent
type in which an electronic ballast is disposed within a housing base adaptable for
use in a standard type of light socket and wherein the electronic ballast circuit
is designed so as to operate at a high operating frequency. The thermal management
properties of the present invention further allow for the spacing of the necessary
components of the ballast circuit in an arrangement that provides as compact a profile
for the housing base as possible and at the same time provides necessary spacing within
the housing base so that thermal convection currents can flow around the components
of the ballast circuit.
[0010] In accordance with the principles of the present invention, there is provided herein
a discharge lamp having a ballast circuit associated therewith which during operation,
generates heat that is dissipated in a more efficient manner as a result of the improved
thermal management properties of the present invention. The discharge lamp includes
an electronic ballast circuit arrangement which is disposed on a printed circuit board
positioned within the ballast housing in a manner whereby the ballast housing itself,
and more particularly, the portion of the ballast housing furthest from the lamp is
utilized for purposes of dissipating heat. Additionally, the printed circuit board
is configured in substantially the same design as a crosswise section of the housing
base such that the printed circuit board contacts and is supported by the sides of
the housing base when the printed circuit board is mounted in a vertical orientation
relative to the discharge lamp being installed in an upright manner. The crosswise
design of the circuit board further includes a bottom extending portion which conforms
in shape to the portion of the housing base on which the screw base is disposed.
[0011] In a variation of the present invention, it is possible to specify that the positioning
of the highest heat generating components occur at the lowermost portion of the circuit
board and gradually spacing the next highest heat generating components in a hierarchal
manner further up on the circuit board. It is also possible that, although the previous
discussion has been directed to the use of the thermal properties improvements of
the present invention being applied in a compact fluorescent product situation, the
present invention in its basic-format can be applied to any ballast circuit for a
discharge lamp in which it is desirable to control the thermal performance characteristics
in a close quartered environment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In the following detailed description of the invention, reference will be made to
the attached drawings in which:
[0013] Fig. 1 is an elevational view partly in sectional form of a discharge lamp exhibiting
improved thermal properties and constructed in accordance with the present invention.
[0014] Fig. 2 is an elevational view of a circuit board configuration on which an electronic
ballast circuit can be mounted for improved thermal management purposes according
to the present invention.
[0015] Fig. 3 is a sectional view of a discharge lamp and circuit board arrangement achieving
the improved thermal management properties of the present invention.
DESCRIPTION AND OPERATION
[0016] As seen in figure 1, the discharge lamp having improved thermal management properties
is shown in the form of a compact fluorescent type of discharge lamp 10 having a housing
base 12 in which a ballast circuit (not shown) is disposed. Although shown in the
form of a compact fluorescent discharge product, the subject matter disclosed and
claimed as follows applies equally as well to other types of discharge lamps utilizing
ballast circuits for which thermal management is an important design consideration.
Moreover, the actual circuit and operation of the lamp ballast for which the improved
thermal management properties of the present invention are directed can be achieved
by a variety of techniques one of which is the above cross-referenced co-filed application
No. (L10276). Additionally, for a detailed discussion of the operation of
a high frequency discharge lamp ballast circuit, which, in operation generates an
amount of heat that must be dissipated, reference is hereby made to Application Note
AN-973 entitled "HEXFETs, Improve Efficiency, Expand Life of Electronic Lighting Ballasts"
written by Peter N. Wood and published by International Rectifier of E1 Segunda, CA.
In this ballast circuit arrangement, MOSFETs are switched at a very high speed in
response to a speed-up pulse injected to the gate terminals of the respective MOSFETs.
It can be appreciated that high speed switching ballasts which are effective for achieving
the higher frequency of operation that a discharge lamp operates best under, inherently
generate an amount of heat that, given the small confines of a compact fluorescent
housing base, must be thermally managed such that a thermal runaway condition does
not occur.
[0017] The housing base 12 for the compact discharge lamp 10 is in a generally conical shape
which is of a general size and configuration that allows for the insertion of the
compact fluorescent lamp 10 into a standard light socket; other shapes such as a tapered
cylindrical configuration would also be appropriate. Disposed at the bottom portion
of the housing base 12 is a standard Edison type screw base 14. Because of the manufacturing
advantages of using an automated injection molding process, the housing base 12 will
be constructed typically of a plastic material. A top cap member 16 made of the same
material as the housing base 12 secures to the housing base 12 by means of a snap
or other type of closure arrangement and is further effective for closing off the
inner cavity region 18 of the housing base 12. The top cap member 16 also serves to
support the tubular lamp member 20 which extends upward therefrom. Although illustrated
as a two-axis lamp 20 in fig. 1, it can be appreciated that any multiple axis compact
fluorescent lamp can be utilized such as for instance, a quad (4-axis) or hex (6-axis)
product.
[0018] Disposed within the cavity 18 of the housing base 12 is a ballast circuit mounting
member 22 which is configured in a shape substantially in conformance with the shape
of the housing base 12. The ballast circuit mounting member 22, or circuit board 22
as it will be described in the discussion of fig. 2, includes a bottom extending portion
22a which is essentially square shaped and is sized so as to fit securely within the
bottom portion of the housing base 12 on which the screw base 14 is secured. In this
manner, the circuit board extends down into the bottommost portion of the housing
so as to be in thermal contact with the screw base thereby allowing the screw base
to act as a heat sink for the electronic ballast circuit of the present invention.
In order to achieve the maximum dimension of the circuit board within the housing
when such circuit board is disposed in a vertical manner, it is necessary to place
such board at or near the diameter of the housing base given that such housing base
is of a circular configuration. By so disposing the circuit board centrally of the
housing base, the amount of space on the circuit board that can be allocated for the
mounting of the electrical components of the ballast circuit are maximized. Additionally,
if centrally disposed, the amount of space on either side of the circuit board that
could be utilized for purposes of allowing the flow of thermal convection currents
thereover, has also been maximized. Moreover, in addition to the thermal advantages
that the present circuit board presents, there are benefits gained in terms of the
support of the circuit board within the housing base. For instance, the vertically
oriented printed circuit board can be supported on its side periphery by contacting
the inside portion of the housing base and on its top portion as well by way of a
circular support member secured in a horizontal manner within the housing base. Of
course, it can be appreciated that the support of the circuit board in the horizontal
direction can be accomplished by attaching the circuit board to the upper portion
of the housing base thus avoiding the need for the separate circular support member.
[0019] It will be noted that during the discussion of the thermal management properties
of the present invention, reference will be made to the orientation of the ballast
circuit mounting member 22 as it is mounted within the housing base 12. Such orientation
is made relative to the discharge lamp 10 being mounted in an upright position; that
is, the discharge lamp 10 will be mounted such that the tubular lamp member 20 will
extend upright and the screw base 14 will be disposed in the downward direction. Of
course, it can be appreciated that the discharge lamp 10 can be oriented in other
directions rather than merely an upright one, in such an instance, the ballast circuit
mounting member 22 will change in orientation along with the discharge lamp 10.
[0020] In order to attain the vertical orientation of the circuit board 22, it is desirable
to support the circuit board 22 in a horizontal direction as well as merely a vertical
one. As seen in fig. 1, a circularly shaped support member 24 is disposed in the top
cap member 16 of the housing base 12 and the circuit board 22 is attached thereto
for such horizontal support. Once the lamp electrodes (not shown) are electrically
connected to the ballast circuit (not shown), top cap member 16 is inserted into the
housing base 12 so that the circuit board 22 will then be in contact with the inner
wall of the cavity 18. In this manner, the circuit board 22 is supported both in the
vertical direction by contacting the housing base 12 and in the horizontal direction
by the support gained in the connection to the circular support member 24. Of course,
it can be appreciated that the horizontal support provided to the circuit board 22
by way of the circular support member 24 can also be provided by a direct connection
of the circuit board 22 to a portion of the top cap member 16 and thereby preclude
the need for a separate support member 24.
[0021] Additionally, by the vertical orientation of the circuit board 22 within the housing
base, it can be further appreciated that the manufacturing step of connecting the
lamp 20 to the circuit board 22 and then the circuit board 22 to the screw base 14
has been simplified. For an automated manufacturing process, it would be advantageous
to achieve these two connections using inlead wires which are bare thereby avoiding
the step of stripping a portion of insulation from these wires. In a horizontally
disposed circuit board arrangement, it can be appreciated that a significant length
of bare wire would be needed to connect the circuit board to the socket and such an
arrangement may be prone to experiencing a short circuit condition when the lamp is
finally assembled. With a vertically disposed circuit board 22, it is possible to
use short lengths of bare inlead wires to make the connection from the circuit board
22 to the lamp 20 and from the circuit board 22 to the screw base 14 thereby avoiding
the risk,of experiencing a short circuit condition during final lamp assembly.
[0022] Referring now to fig. 2, it can be seen that the ballast circuit shown generally
as reference 26, is disposed on the circuit board 22 in a manner such that the various
components 28 are all electrically interconnected by circuit board runs 30. It is
to be understood that the component representation 28 of fig. 2 is of a general nature
and is meant to include as being covered thereby, an electronic ballast arrangement
using high frequency switching devices, a rectifier circuit, a resonance circuit and
a circuit for generating the control signal which controls the switching operation
of the high speed switching devices. The high speed switching devices, for purposes
to be discussed hereinafter in further detail, are designated reference 32 and can
be disposed on the opposite side of the circuit board 22 as other components 28.
[0023] It is significant to note that by disposing the circuit board 22 in a vertical orientation
within the housing base 12, there is sufficient space on either side of the circuit
board for mounting ballast circuit components 28. As such, the need to interconnect
various components by means of an inlead wire arrangement wherein the component is
disposed off of the circuit board and an inlead wire is added to couple that component
into the ballast circuit 26, is largely avoided. Additionally as seen in fig. 2, with
some components 28 mounted on one side of the circuit board 22, it is possible to
mount other components 32 (shown in phantom) on the opposite side of the board and
still maintain the ability to interconnect all components 28 and 32 without the need
for lengths of inlead wire within the housing base and yet, still maintain the space
around the various components 28 and 32 through which thermal convection currents
can flow. Extending from the bottom portion of the circuit board 22 and from along
the side of the bottom portion 22a of the circuit board 22, are connectors 34 which
connect to the screw base 14 so that power line current can be coupled to the ballast
circuit 26. Circuit board 22 has formed at the upper or widest portion thereof, respective
tab members 36 which can contact either the circular support member 24 or a portion
of the top cap member 16 so that the horizontal support of the circuit board 22 as
previously discussed, can be accomplished.
[0024] In addition to the improved thermal management characteristics achieved by the vertical
orientation of the circuit board 22 within the housing base 12, which orientation
allows for sufficient space along either side of the circuit board 22 to accommodate
thermal convection currents to flow over such components 28, it is of further significance
that the components 28 which comprise the ballast circuit 26 can be selectively located
in a hierarchal manner on the circuit board 22 according to the heat generating capabilities
of the specific components. In other words, with a vertically oriented circuit board
22, given that certain components 28 of the ballast circuit 26 are higher heat generating
devices which require more dissipation capabilities than other components and because
heat can be more readily dissipated at the lowermost portion of the housing base 12,
it would be thermally advantageous to place the highest heat generating components
28 at the bottom of the circuit board 22. Similarly, it is possible to assign the
positions of the various components 28 and 32 on the circuit board in order of their
respective heat generating characteristics wherein the highest heat generating components
are disposed in descending order from the lowermost portion of the circuit board 22
to the topmost portion of the circuit board 22. For instance, it is known that a typical
resonance circuit for a discharge lamp will employ a relatively large electrolytic
capacitor and that such device generates an amount of heat that requires additional
consideration. By placing such element at the bottom portion 22a of the circuit board
22, the heat sinking capabilities of thermally connecting the circuit board 22 to
the screw base 14 are efficiently utilized.
[0025] A further thermal management consideration is achieved by the present invention in
that, as previously noted, certain electronic ballast circuits for discharge lamps
employ high speed switching devices which can generate a noticeable amount of heat,
noise or other interference that affects other components in the ballast circuit 26.
The present invention, by allowing the placement of some components on opposite sides
of the circuit board 22 as other components, allows an amount of isolation between
such noise or interference generating components and those components which may be
adversely affected by such noise/interference. As shown by the phantom representation
of a component 32 of the ballast circuit 26 being disposed on opposite sides as components
28, a further thermal advantage is attained.
[0026] As seen in fig. 3, the discharge lamp 10 of the present invention which exhibits
improved thermal management properties is illustrated wherein the circuit board 22
is in thermal contact with the screw base 14. In this manner, the heat sinking capabilities
of the metallic screw base 14 are utilized more directly than would a circuit board
arrangement disposed in a circumferential manner near the top portion of a housing
base for a compact fluorescent or other type of discharge lamp.
[0027] Although the previously described embodiment of the invention constitutes a preferred
embodiment, it should be understood that modifications can be made thereto without
departing from the scope of the invention as set forth in the appended claims. For
instance, the principles of the present invention apply equally as well to a discharge
lamp ballast configuration that is disposed in a housing separate from but in close
proximity to the actual discharge lamp.
1. A discharge lamp having a lamp base and being operable using power line current, said
discharge lamp comprising:
a lamp member extending from said lamp base;
a ballast circuit disposed within said lamp base and having circuit means including
a group of circuit elements effective to energize said lamp member to a discharge
state; and
mounting means disposed within said lamp base and having mounted thereon, at least
two of said group of circuit elements, said mounting means contacting said lamp base
in a manner such that said lamp base acts as a heat sink for said ballast circuit.
2. A discharge lamp as set forth in claim 1 wherein said mounting means includes a circuit
board and said circuit board is disposed within said lamp base so as to allow space
on either side thereof for mounting said group of elements and for air flow thermal
management purposes.
3. A discharge lamp as set forth in claim 2 wherein said lamp base includes a metallic
screw base portion and said circuit board is mounted vertically within said lamp base
in relation to said lamp base being mounted in an upright position.
4. A discharge lamp as set forth in claim 3 wherein said circuit board is attached at
its topmost portion to a support member mounted horizontally within said lamp base,
said circuit board thereby being supported in three dimensions by way of attachment
to said horizontally disposed support member and by said vertically mounted circuit
board contacting and being supported by an inner portion of said lamp base.
5. A discharge lamp as set forth in claim 3 wherein said group of elements mounted on
said mounting means are mounted on said circuit board in a manner such that those
elements of said group capable of generating the highest amount of heat are mounted
closest to said metallic screw base.
6. A compact fluorescent discharge lamp having an electronic ballast disposed within
a housing base and operable using power line current, said compact fluorescent discharge
lamp comprising:
a tubular lamp member extending from said housing base;
circuit means including a group of circuit elements for driving said tubular lamp
member to a discharge state; and
means for mounting said circuit means within said housing base in a vertical orientation
relative to said discharge lamp being mounted in an upright position.
7. A compact fluorescent discharge lamp as set forth in claim 6 wherein said mounting
means is a circuit board mounted within said housing base in a manner such that said
circuit board is thermally coupled to a metallic screw base portion of said housing
base thereby allowing said screw base portion to act as a heat sink for said circuit
board and any elements mounted thereon.
8. A compact fluorescent discharge lamp as set forth in claim 7 wherein said circuit
means includes at least two power transistor switching devices and wherein said power
transistor switching devices are mounted on one side of said circuit board in an isolated
manner from other components of said ballast circuit.
9. A discharge lamp operable using power line current, comprising:
a discharge lamp member;
a housing base from which said discharge lamp extends on one end and further having
secured thereto, means for connecting to said power line current;
a ballast circuit having elements effective so as to produce a resonant operating
signal for driving said discharge lamp member to a discharge state; and
mounting means disposed within said housing base and being effective for supporting
thereon, at least some of said elements of said ballast circuit, said mounting means
further being in thermal contact with said connecting means of said housing base such
that heat generated by said ballast circuit can be at least partially dissipated by
said connecting means.
10. A discharge lamp as set forth in claim 9 wherein said mounting means is a circuit
board and said ballast circuit is comprised primarily of electronic components which
are secured to said circuit board, and further wherein said circuit board is disposed
in said housing in a vertical orientation relative to said discharge lamp being mounted
in an upright position.