THERMAL STRESS-RELIEVED COMPOSITE MICROELECTRONIC DEVICE - Patent 0551395

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EP 0 551 395 A1

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(43)	Date of publication:
	21.07.1993 Bulletin 1993/29

(21)	Application number: 91918553.0

(22)	Date of filing: 18.09.1991

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International Patent Classification (IPC):

H01L 23/ 12^{( . )}
H01L 23/ 15^{( . )}
H05K 1/ 05^{( . )}

H01L 23/ 13^{( . )}
H05K 1/ 02^{( . )}

(86)	International application number:
	PCT/US1991/006627

(87)	International publication number:
	WO 1992/006495 (16.04.1992 Gazette 1992/09)

(84)	Designated Contracting States:
	DE DK FR GB

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Priority:

27.09.1990 US 19900588930

(71)	Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
	Wilmington Delaware 19898 (US)

(72)	Inventor:
	YOUNG, James, C. Newark, DE 19711 (US)

(74)	Representative: von Kreisler, Alek, Dipl.-Chem., et al
	Patentanwälte von Kreisler-Selting-Werner Postfach 10 22 41 D-50462 Köln D-50462 Köln (DE)

(54)	THERMAL STRESS-RELIEVED COMPOSITE MICROELECTRONIC DEVICE