MULTICHIP INTEGRATED CIRCUIT MODULE AND METHOD OF FABRICATION - Patent 0577779

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EP 0 577 779 A1

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(43)	Date of publication:
	12.01.1994 Bulletin 1994/02

(21)	Application number: 92917353.0

(22)	Date of filing: 26.03.1992

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International Patent Classification (IPC):

H01L 23/ 28^{( . )}
H01L 23/ 538^{( . )}
H05K 1/ 18^{( . )}

H01L 21/ 98^{( . )}
H01L 25/ 065^{( . )}
H05K 3/ 28^{( . )}

(86)	International application number:
	PCT/US1992/002623

(87)	International publication number:
	WO 1992/017901 (15.10.1992 Gazette 1992/26)

(84)	Designated Contracting States:
	AT BE CH DE DK ES FR GB GR IT LI LU MC NL SE

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Priority:

27.03.1991 US 19910676937

(71)	Applicant: INTEGRATED SYSTEM ASSEMBLIES CORPORATION
	Wobourn, MA 01801 (US)

(72)	Inventor:
	EICHELBERGER, Charles, W. Schenectady, NY 12309 (US)

(74)	Representative: Schüler, Horst, Dr.
	Patentanwalt, Kaiserstrasse 69 D-60329 Frankfurt D-60329 Frankfurt (DE)

(54)	MULTICHIP INTEGRATED CIRCUIT MODULE AND METHOD OF FABRICATION