MULTICHIP INTERCONNECT MODULE INCLUDING SUPERCONDUCTIVE MATERIALS - Patent 0586558

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EP 0 586 558 A1

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(43)	Date of publication:
	16.03.1994 Bulletin 1994/11

(21)	Application number: 92913021.0

(22)	Date of filing: 08.05.1992

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International Patent Classification (IPC):

H01L 23/ 498^{( . )}

(86)	International application number:
	PCT/US1992/004032

(87)	International publication number:
	WO 1992/020108 (12.11.1992 Gazette 1992/28)

(84)	Designated Contracting States:
	DE FR GB IT

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Priority:

08.05.1991 US 19910697939

(71)	Applicant: SUPERCONDUCTOR TECHNOLOGIES INC.
	Santa Barbara California 93111-2310 (US)

(72)	Inventors:
	JAMES, Timothy, Walton Goleta, CA 93117 (US) FORSE, Roger, James Soluang, CA 93463 (US)

(74)	Representative: Senior, Alan Murray, et al
	J.A. KEMP & CO., 14 South Square, Gray's Inn London WC1R 5LX London WC1R 5LX (GB)

(54)	MULTICHIP INTERCONNECT MODULE INCLUDING SUPERCONDUCTIVE MATERIALS