(19)
(11) EP 0 596 236 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
18.05.1994 Bulletin 1994/20

(43) Date of publication A2:
02.08.1995 Bulletin 1995/31

(21) Application number: 93115317.5

(22) Date of filing: 27.09.1993
(51) International Patent Classification (IPC)5: H03B 5/12
(84) Designated Contracting States:
DE FR GB

(30) Priority: 06.11.1992 US 19920972347

(71) Applicant: MOTOROLA, INC.
Schaumburg, IL 60196 (US)

(72) Inventors:
  • Anderson, Samuel J.
    Tempe, Arizona 85283 (US)
  • Romero, Guillermo L.
    Phoenix, Arizona 85008 (US)

(74) Representative: Hudson, Peter David 
Motorola, European Intellectual Property Operations, Midpoint Alencon Link
Basingstoke, Hampshire RG21 7PL
Basingstoke, Hampshire RG21 7PL (GB)

   


(54) Method for forming a power circuit package


(57) A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a second surface of the the dielectric material (29) whereas the first porous die mount (21), and the second porous die mount (22) are bonded to a first surface of the dielectric material (29). Simultaneous with the bonding step, the porous base structure (20), the first porous die mount (21), and the second porous die mount (22) are impregnated with a conductive material. Semiconductor die (32, 33, 34, and 35) are bonded to the impregnated die mounts. The semiconductor die (32, 33, 34, and 35) are then encapsulated by a molding compound.







Search report