ELECTRONIC ASSEMBLY WITH IMPROVED GROUNDING AND EMI SHIELDING - Patent 0598028

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EP 0 598 028 A1

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(43)	Date of publication:
	25.05.1994 Bulletin 1994/21

(21)	Application number: 92917712.0

(22)	Date of filing: 06.08.1992

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International Patent Classification (IPC):

H01R 13/ 10^{( . )}
H01R 13/ 658^{( . )}
H05K 7/ 14^{( . )}

H01R 4/ 64^{( . )}
H01R 43/ 00^{( . )}
H05K 9/ 00^{( . )}

(86)	International application number:
	PCT/US1992/006463

(87)	International publication number:
	WO 1993/003594 (18.02.1993 Gazette 1993/05)

(84)	Designated Contracting States:
	DE FR GB IE IT SE

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Priority:

09.08.1991 US 19910742994

(71)	Applicant: TANDEM COMPUTERS INCORPORATED
	Cupertino, California 95014-0709 (US)

(72)	Inventors:
	FERCHAU, Joerg, U. Morgan Hill, CA 95037 (US) KOTYUK, Kenneth, A. Morgan Hill, CA 95037-3534 (US) DIAZ, Randall, J. Gilroy, CA 95020 (US)

(74)	Representative: Ayers, Martyn Lewis Stanley, et al
	J.A. KEMP & CO. 14 South Square Gray's Inn London WC1R 5LX London WC1R 5LX (GB)

(54)	ELECTRONIC ASSEMBLY WITH IMPROVED GROUNDING AND EMI SHIELDING