(19)
(11) EP 0 598 564 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
31.08.1994 Bulletin 1994/35

(43) Date of publication A2:
25.05.1994 Bulletin 1994/21

(21) Application number: 93309059.9

(22) Date of filing: 12.11.1993
(51) International Patent Classification (IPC)5B41J 2/17
(84) Designated Contracting States:
DE FR GB IT

(30) Priority: 19.11.1992 US 978846

(71) Applicant: Hewlett-Packard Company
Palo Alto, California 94304 (US)

(72) Inventors:
  • Lim, Chuin Kiat
    Singapore 1335 (SG)
  • Chan, James Loke Kie
    Singapore 2573 (SG)

(74) Representative: Colgan, Stephen James et al
CARPMAELS & RANSFORD 43 Bloomsbury Square
London WC1A 2RA
London WC1A 2RA (GB)


(56) References cited: : 
   
       


    (54) System and method for drying ink on a printing medium


    (57) A system and method is provided for drying ink deposited onto an printing medium (12) by a printer. The printer includes therewithin primary heat generating modules (126,30) which generate excess heat within the printer when the ink is printed onto the printing medium (12), a thermally conductive platen (22) over which the printing medium moves within the printer during the printing of the ink onto the printing medium (12), and heat conductive contacts (24). It also includes heat conductive contacts for conductively attaching the primary heat generating modules (26,30) to the thermally conductive platen (22). The primary heat generating modules are conductively attached to the thermally conductive platen through heat conductive contacts. The primary heat generating modules (26,30) generate excess heat for conductively heating the thermally conductive platen. Then, the printing medium is moved into contact with the heated thermally conductive platen (22) thereby heating the printing medium (12). Next, the printing ink is deposited by the printer onto the heated printing medium. The ink on the heated printing medium is dried by effects of the elevated temperature imparted to the printing medium (12) by the heated thermally conductive platen (22). In this way, faster printing throughput and improved print quality are provided.







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