(19)
(11) EP 0 600 436 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
01.10.1997 Bulletin 1997/40

(43) Date of publication A2:
08.06.1994 Bulletin 1994/23

(21) Application number: 93119271.0

(22) Date of filing: 30.11.1993
(51) International Patent Classification (IPC)5H01L 21/76, H01L 21/90
(84) Designated Contracting States:
DE FR GB IT NL

(30) Priority: 30.11.1992 US 985095

(71) Applicant: TEXAS INSTRUMENTS INCORPORATED
Dallas Texas 75265 (US)

(72) Inventors:
  • Malhi, Satwinder
    Garland, TX 75044 (US)
  • Shen, Chi-Cheong
    Richardson, TX 75080 (US)
  • Kwon, Oh-Kyong
    Plano, TX 75075 (US)

(74) Representative: Schwepfinger, Karl-Heinz, Dipl.-Ing. 
Prinz & Partner, Manzingerweg 7
D-81241 München
D-81241 München (DE)

   


(54) Semiconductor device, circuit and method of manufacture


(57) A monolithic integrated circuit capable of operation in the microwave range which is fabricated using silicon technology wherein transmission line interconnects are fabricated along with active devices on the same substrate. The transmission line is provided using polycrystalline silicon since it can have much higher resistivity than single crystal silicon. Accordingly, a circuit is provided wherein active devices are provided in single crystal silicon and interconnects are formed overlying polycrystalline silicon to provide transmission line interconnects between devices and obtain the desired high frequency response.
This is accomplished by providing a highly doped silicon substrate of predetermined conductivity type having a less highly doped silicon layer thereon of the same conductivity type with an oxide layer over the less highly doped layer, forming mesas for formation therein of active elements in the structure having valleys between the mesas extending into the substrate, filling the valleys with very high resistivity polysilicon, forming an electrically insulating layer over the polysilicon, forming active elements with contacts thereto in the mesas and forming interconnects between contacts of the active elements extending over the high resistivity polysilicon regions and the electrically insulating material thereover.







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