| (19) |
 |
|
(11) |
EP 0 604 131 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
13.12.1995 Bulletin 1995/50 |
| (43) |
Date of publication A2: |
|
29.06.1994 Bulletin 1994/26 |
| (22) |
Date of filing: 17.12.1993 |
|
|
| (84) |
Designated Contracting States: |
|
DE ES FR GB IT NL |
| (30) |
Priority: |
24.12.1992 JP 357430/92
|
| (71) |
Applicant: GE PLASTICS JAPAN LIMITED |
|
Chuo-Ku,
Tokyo (JP) |
|
| (72) |
Inventors: |
|
- Myojo, Koji
Sunto-gun,
Shizuoka Prefecture (JP)
- Uohashi, Hiromichi
Shizuoka Prefecture (JP)
- Funada, Kiyotaka
Kanagawa Prefecture (JP)
- Amaya, Yoshinori
Shizuoka Prefecture (JP)
- Aoki, Eiji
Kanagawa Prefecture (JP)
|
| (74) |
Representative: Pratt, Richard Wilson et al |
|
London Patent Operation
G.E. Technical Services Co. Inc.
Essex House
12/13 Essex Street
London WC2R 3AA
London WC2R 3AA (GB) |
|
| |
|
| (54) |
Coating method for molded resin |
(57) This invention provides a coating method for a molded resin that is effective for
achieving satisfactory adhesion of the coating material, good contact properties;
inexpensive production; and good coating appearance. The method comprises forming
an electroless plating film to provide a specific surface resistance on the surface
of a molded resin then applying a top coat without applying a conductive primer. The
coating method of this invention is suitable for any type of molded resin, especially
for a molded resin containing a polyamide resin and polyphenylene ether resin or polypropylene
resin.