(19)
(11)
EP 0 609 432 A1
(12)
(43)
Date of publication:
10.08.1994
Bulletin 1994/32
(21)
Application number:
93920317.0
(22)
Date of filing:
24.08.1993
(51)
International Patent Classification (IPC):
H01L
23/
467
( . )
H01L
25/
07
( . )
H01L
25/
16
( . )
H01L
25/
065
( . )
H01L
25/
11
( . )
(86)
International application number:
PCT/US1993/007974
(87)
International publication number:
WO 1994/005040
(
03.03.1994
Gazette 1994/06)
(84)
Designated Contracting States:
DE FR GB IT
(30)
Priority:
24.08.1992
US 19920934938
(71)
Applicants:
IVERSEN, Arthur H.
Saratoga, CA 95070 (US)
GEORGE, Gabor
Lafayette, CA 94549 (US)
(72)
Inventors:
IVERSEN, Arthur H.
Saratoga, CA 95070 (US)
GEORGE, Gabor
Lafayette, CA 94549 (US)
(74)
Representative:
UEXKÜLL & STOLBERG
Patentanwälte Beselerstrasse 4
D-22607 Hamburg
D-22607 Hamburg (DE)
(54)
POWER SEMICONDUCTOR PACKAGING