(19)
(11) EP 0 638 100 A1

(12)

(43) Date of publication:
15.02.1995 Bulletin 1995/07

(21) Application number: 93907275.0

(22) Date of filing: 09.03.1993
(51) International Patent Classification (IPC): 
C03C 25/ 24( . )
C03C 25/ 10( . )
C04B 41/ 83( . )
C08F 299/ 06( . )
C08G 18/ 67( . )
C03C 17/ 32( . )
C04B 41/ 48( . )
C08F 290/ 00( . )
C08G 18/ 48( . )
G02B 6/ 44( . )
(86) International application number:
PCT/US1993/002037
(87) International publication number:
WO 1993/021248 (28.10.1993 Gazette 1993/26)
(84) Designated Contracting States:
BE DE FR GB IT NL SE

(30) Priority: 20.04.1992 JP 19920099596

(71) Applicant: DSM DESOTECH, INC.
Elgin, IL 60120 (US)

(72) Inventors:
  • OHTAKA, Tohru
    Kawasaki City, Kanagawa 215 (JP)
  • IWANAGA, Shinichirou, JSR Apartment 14-101
    Yokkaichi City, Mie 510 (JP)
  • WATANABE, Tsuyoshi
    Hattiesburg, MS 39401 (US)
  • IGARASHI, Katutoshi, JSR Apartment 2-201
    Yokohama City, Kanagawa 227 (JP)

(74) Representative: Kleiborn, Paul Erik, et al 
Octrooibureau DSM P.O. Box 9
NL-6160 MA Geleen
NL-6160 MA Geleen (NL)

   


(54) LIQUID CURABLE RESIN COMPOSITION