Field of the Invention
[0001] This invention generally relates to an electrical connector for mounting on a surface
of a circuit substrate and, particularly, to mounting means between the circuit substrate
and the receptacle of an IC card.
Background of the Invention
[0002] Generally, IC cards or packs, such as memory cards, are data input devices which
are electrically connected to an underlying electronic apparatus or storage device,
such as a word processor, personal computer or other electronic apparatus. Upon insertion
of the IC card into the underlying apparatus and electrical connection thereto, the
data stored in the IC card is transferred to the electronic apparatus. The IC or memory
cards are typically portable instruments which may be readily inserted and extracted
from a connector apparatus as required, and are used with such connector apparatus
for removably coupling the card to a printed circuit board of the underlying apparatus,
for instance.
[0003] An IC card conventionally includes a rectangular frame which receives a circuit substrate,
and on or around which is mounted a panel or cover that encloses the circuit substrate
therewithin. The circuit substrate of an IC card conventionally comprises a generally
planar support with at least one electrical component mounted thereon. The electrical
component(s) may include semi-conductor devices, integrated circuits, batteries or
the like. A surface mounted receptacle connector is electrically and mechanically
coupled to an edge of the circuit substrate. The receptacle connector includes receptacle
terminals mounted therein having surface mount tails with contact portions adapted
to be surface mounted to corresponding circuit traces on one or both sides of the
circuit substrate. Each receptacle terminal also includes a receptacle portion for
mating with contacts of the main electronic apparatus, such as mating with the contacts
of a header connector mounted on a printed circuit board of the main electronic apparatus.
[0004] Since the receptacle connector is surface mounted to the circuit substrate, and since
subsequent to such processing the circuit substrate is assembled to the frame and
cover, it is important that the connector be positioned correctly with respect to
the substrate, that is, the surface mount tails of the receptacle terminals must be
accurately positioned and the contact portions connected to their corresponding circuit
traces, so that proper electrical connection is made and so that the connector/substrate
assembly fits within the frame. Furthermore, it is often desirable, if not necessary,
to hold the connector in place prior to and during the surface mounting process, so
that movement prior to or surface tension during the process does not result in an
inaccurately positioned connector.
[0005] Care must be taken, however, when holding the receptacle connector to the substrate.
Too little retention to the substrate is of no use, and may result in open circuit
conditions or intermittencies should the surface mount tails and their respective
contact portions "float" off the circuit traces or move off their requisite positions.
On the other hand, too much retention can cause excessive insertion force and make
assembly of the connector to the substrate difficult, if not impossible. Furthermore,
in the case of robotic or automated assembly of the connector, the substrate or components
on the substrate may be damaged if excessive force is used to insert and assemble
an improperly aligned connector.
[0006] One type of memory card receptacle connector configuration utilizes single-sided
receptacle terminals wherein the contact portions of the surface mount tails are adapted
to be coupled to circuit traces on only one side of the circuit substrate. This configuration
allows a "top-to-bottom" direction of assembly of the connector to the substrate,
thereby facilitating robotic "pick-and-place" assembly. One way of processing a connector
having a single-sided terminal configuration is to simply place it on top of the substrate.
Often a connector of this type will include a locating peg or other similar feature
to correctly position the connector with respect to the substrate. However, since
"perfect" coplanarity of the surface mount tails and/or contact portions is generally
not attainable, connectors of this type will rest on the substrate supported only
by the lowest contact portions, resulting in a gap between the substrate and the higher
contact portions. The greater this gap, the greater the risk of a poor or non-existent
solder connection between the connector and the substrate.
[0007] Another processing method overcomes this dependence on manufacturing control of coplanarity
by using a single press-fit or retention peg on each side of the housing to hold the
connector to the substrate, which, by design, presses the contact portions of the
surface mount tails to the board, or "preloads" the contact portions. However, since
these contact portions exert a force on the substrate, and since by the nature of
memory card receptacle connectors the surface mount tails are outboard of the housing
along only a single edge of the housing, the force exerted by the tails acts to rock
or rotate the housing from its desired position, pivoting about the retention peg.
[0008] However, due to the small size of a memory card receptacle connector, press-fit or
retention pegs are correspondingly small and, therefore, integrally molded compliant
pegs or complicated peg shapes are generally not manufacturable. Furthermore, the
miniature nature of the pegs magnifies the manufacturing tolerances, i.e. the change
in peg diameter or size is a larger percentage of the peg size itself. Accordingly,
an undersized peg may not provide any interference fit in an oversized substrate hole,
and an oversized peg may provide too much interference in an undersized hole, resulting
in ineffective and excessive insertion forces, respectively, as discussed above.
[0009] This invention is directed to solving the problems identified above by providing
an improved receptacle mounting peg as described and claimed.
Summary of the Invention
[0010] An object, therefore, of the invention is to provide a new and improved electrical
receptacle connector for mounting on a surface of a circuit substrate at an edge thereof.
[0011] Another object of the invention is to provide an improved mounting peg system between
a circuit substrate and a receptacle connector of an IC card or pack, such as a memory
card.
[0012] In the exemplary embodiment of the invention, the connector includes a dielectric
housing having a forward mating face, a rearward terminating face, and a plurality
of terminal-receiving passages therethrough. A plurality of conductive terminals are
received in the passages. Each terminal includes a surface mount tail projecting outwardly
from the housing from the rearward terminating face and having a surface mount contact
portion at a distal end thereof for resiliently engaging an appropriate circuit trace
on the substrate. The surface mount contact portions are disposed in a generally coplanar
elongate array. A mounting arm is provided on each side of the housing for mounting
to the surface of the circuit substrate. Generally, mounting pegs project from a bottom
mounting face of the mounting arms.
[0013] Specifically, the invention is directed to an improvement in the mounting pegs. In
particular, a pair of mounting pegs having a generally rectangular cross-section project
from the bottom mounting face of the mounting arm for insertion into corresponding
round mounting holes in the circuit substrate. Each pair of mounting pegs straddles
the elongate array of surface mount contact portions to balance the uneven forces
created by the single-sided receptacle connector and to prevent the "rocking" that
may occur in the case of a single mounting peg configuration. Furthermore, each peg
has a transverse dimension between diagonal corners of the rectangular peg configuration
greater than the diameter of the respective round hole in the circuit substrate while
the transverse dimension between adjacent corners of the peg is less than the diameter
of the round holes, thereby establishing an interference or press fit between the
receptacle connector and the circuit substrate. The rectangular peg configuration
permits an acceptable interference fit within the round holes of the substrate for
a wide range of dimensional tolerances, and holds or "pre-loads" the surface mount
contact portions to their respective circuit traces to ensure a good electrical connection.
[0014] In the preferred embodiment of the invention, the dielectric housing is molded of
plastic material, and the mounting pegs are molded integrally therewith. The pegs
have a square cross section, and the corners of the plastic pegs are compliant or
deformable for insertion into the generally round holes of the circuit substrate.
[0015] Other objects, features and advantages of the invention will be apparent from the
following detailed description taken in connection with the accompanying drawings.
Brief Description of the Drawings
[0016] The features of this invention which are believed to be novel are set forth with
particularity in the appended claims. The invention, together with its objects and
the advantages thereof, may be best understood by reference to the following description
taken in conjunction with the accompanying drawings, in which like reference numerals
identify like elements in the figures and in which:
FIGURE 1 is an exploded perspective view of the elements of an IC card in which the
invention is applicable;
FIGURE 2 is a perspective view of the receptacle connector of the card elevated above
an edge of the circuit substrate at which the connector is surface mounted;
FIGURE 3 is a bottom plan view of the receptacle connector;
FIGURE 4 is an elevational view of the terminating side of the connector;
FIGURE 5 is a fragmented vertical section through the connector;
FIGURE 6 is an end elevational view of the connector;
FIGURE 7 is an enlarged fragmented view of the right-hand end of the connector as
viewed in Figure 3;
FIGURE 8 is a somewhat schematic, composite representation of different size mounting
pegs with respect to different size mounting holes;
FIGURE 9 is a view similar to that of Figure 5, with the connector mounted to the
circuit substrate;
FIGURE 10 is a view similar to that of Figure 6, with the connector mounted to the
circuit substrate; and
FIGURE 11 is a view similar to that of Figure 7, with the connector mounted to the
circuit substrate.
Detailed Description of the Preferred Embodiment
[0017] Referring to the drawings in greater detail, and first to Figure 1, the invention
is embodied in an IC card, generally designated 10, which is provided as a data input
device, such as a memory card, for connection to an electronic apparatus or storage
device, such as a word processor, personal computer or other electronic apparatus
(not shown). The data stored in memory card 10 is transferred to the electronic apparatus
through the terminals within a receptacle connector, generally designated 12, which
is edge mounted to a circuit substrate, generally designated 14, on which data storage
units are mounted or stored.
[0018] More specifically, receptacle connector 12 is elongated and mounts a plurality of
input terminals 16. The terminals mechanically and electrically engage contact pads
18 on a surface 20 of circuit substrate 14. Various electrical components or circuit
elements 22 are surface mounted on surface 20, along with circuit traces 24 leading
to contact pads 18 at the leading or front edge of the substrate. This edge is coupled
to elongate receptacle connector 12, and the receptacle connector is interconnectable
with an electrical connector, such as a header connector, mounted on a printed circuit
board of the electronic apparatus to which data stored on circuit substrate 14 is
transferred.
[0019] The above description of circuit substrate 14 is generally conventional, and, consequently,
the depiction of the circuit substrate is somewhat schematic. However, it should be
understood that, although electrical components 22 are shown in the drawings as being
of uniform shape and size, the components will generally vary, and may comprise semi-conductor
devices, batteries, and other parts of integrated circuits, all mounted on surface
20 of the circuit substrate.
[0020] Still referring to Figure 1, memory card 10 includes a frame, generally designated
30, which includes an opening 32 in a top surface 33 thereof for receiving circuit
substrate 14. The frame includes support means, generally designated 34, facing opening
32 for supporting circuit substrate 14 within the frame in the orientation of Figure
1. A top panel or cover 36 is adapted to be fixably secured to top surface 33 for
closing opening 32 and enclosing circuit substrate 14 within the frame 30. The frame
is unitarily molded of dielectric material, such as plastic, and a plurality of cross
braces 35 join the sides of the frame to provide integrity to the frame structure.
In the illustrated embodiment, the frame also defines a bottom opening 37 in a bottom
surface 39 of frame 30, which is closed by a bottom panel or cover 38.
[0021] Generally, the invention is directed to an improved mounting means between receptacle
connector 12 and circuit substrate 14. More particularly, referring to Figure 2, receptacle
connector 12 includes a dielectric housing 40 having a forward mating face 42, a rearward
terminating face 43, and a plurality of terminal-receiving passages 44 arranged in
two generally parallel rows and extending between the forward mating face and the
rearward terminating face therethrough for receiving receptacle terminals 16. An end
wing or mounting arm 46 is located at each end of the housing 40 and includes a bottom
mounting face 47 which mounts on the top surface 20 of circuit substrate 14 adjacent
an edge 48 thereof. Each receptacle terminal 16 includes a receptacle portion proximate
the forward mating face of the housing, and a surface mount tail 50 which projects
from rearward terminating face 43 and extends outwardly therefrom. The surface mount
tails 50 each include a surface mount contact portion 52 for mechanically and electrically
engaging contact pads 18 on the top surface 20 of the circuit substrate, adjacent
edge 48. As will be seen hereinafter, in their "unumounted" or undeflected condition,
contact portions 52 of surface mount tails 50 project below bottom mounting face 47
of receptacle connector 12. As can be seen quite clearly in Figure 2, surface mount
tails 50 extend in a generally parallel elongate array outwardly of housing 40 of
the receptacle connector. Correspondingly, the contact portions 52 form a generally
coplanar elongate array, as will be seen hereinafter.
[0022] The improved mounting means of the invention is incorporated in a pair of mounting
pegs 54 formed on each mounting arm, which are press fit or force fit into a respective
pair of mounting holes 56 (Fig. 2) in circuit substrate 14. As seen in Figures 3 and
4, one pair of pegs depend from the bottom mounting face 47 of each mounting arm 46
of housing 40. The parallel array of the surface mount tails 50 of terminals 16 also
are clearly seen in Figures 3 and 4.
[0023] Referring to Figures 5-7, it can be seen particularly in Figures 5 and 6 that the
contact portions 52 of the surface mount tails 50 project below the bottom mounting
face 42 of mounting arms 46 of the connector housing. The terminals are conventionally
formed of stamped and formed sheet metal material, whereby the surface mount tails
50 are flexible and contact portions 52 exert forces against their respective contact
pads when the connector is surface mounted to the circuit substrate. Receptacle portions
58 of the terminals are shown disposed in the two row arrangement described above.
As can be seen in Figure 5, the top row of terminals 16 have different surface mount
tail configurations than the bottom row terminals in order to effect a single parallel
array of surface mount tails 50 while at the same time using a two row array of receptacle
portions 58.
[0024] According to one aspect of the invention, it can be seen clearly in Figures 5 and
6 that each pair of mounting pegs 54 at each opposite end of the connector "straddles"
the elongate array of contact portions of the surface mount tails. That is, one of
the pair of mounting pegs 54 at each opposite end of the connector is positioned forward
of the contact portions 52 of the surface mount tails 50 toward the forward mating
face 42 of the housing, and the other of the pair of pegs is positioned rearward of
the contact portions 52 of the surface mount tails 50 away from the forward mating
face 42 of the housing. By providing mounting pegs which straddle the elongate array,
the "rocking" problem discussed in the Background, above, is very simply and efficiently
solved by balancing or supporting the uneven forces created by the single-sided configuration.
[0025] Furthermore, and according to another aspect of the invention, mounting pegs 54 have
generally rectangularly-shaped cross-sections to provide an interference fit within
a round hole, which serves to hold the connector and, in particular, the contact portions
52 of the surface mount tails 50 to the substrate to assure a good solder connection.
In the preferred embodiment as illustrated, the mounting pegs are square in cross-section.
Therefore, the generally rectangular configuration defines four corners 60 for each
peg (see Fig. 8). The square pegs are forced into the round mounting holes 56 of circuit
substrate 14. In essence, the transverse dimension between the diagonal corners of
mounting pegs 54 is greater than the transverse dimension or diameter of the round
holes 56, while the transverse dimension between adjacent corners is less than the
diameter of the round holes, thus providing an interference fit between the receptacle
connector and the circuit substrate generally at each corner of the square-shaped
peg.
[0026] As stated in the Background, above, receptacle connector 12 of memory card 10 can
be very small in size, and, therefore, manufacturing tolerances for tiny mounting
pegs, such as pegs 54, and for mounting holes 56, are considerably magnified. In other
words, any change in the transverse dimension or diameter of a mounting peg or hole
is a large percentage of the size of the peg or hole, itself. However, due to the
square shape of the peg, the corners of the peg are outside the hole in almost any
undersize or oversize condition, i.e. within a given tolerance range of both peg size
and hole size. Therefore, since only the corners 60 of the peg 54 are outside the
hole, the corners deform when force-fit into round holes 56. This is particularly
true when dielectric housing 40, including end wings 46 and pegs 54, is molded of
plastic material. Figure 8 shows a variance in the size of a given mounting peg with
respect to a round hole 56. In other words, peg 54' and hole 56' in Figure 8 represent
minimal interference between a mounting peg and a round hole, peg 54 and hole 56 represent
a nominal condition, and peg 54'' and hole 56'' represent maximum interference. However,
the corners of the pegs can deform, or at least become compliant, upon force fitting
any of the pegs into any of the round mounting holes. Most other cross-sectional peg
shapes would cause either too little interference, if the hole diameter is on the
high end of the tolerance range and the transverse dimension of the peg is on the
low end of the tolerance range, or too much interference, if the hole diameter is
on the low end of the tolerance range and the transverse dimension of the peg is on
the high end of the tolerance range. The rectangular cross section of the peg, as
shown particularly in Fig. 8, provides adequate, yet not excessive, interference of
any size peg, within a given tolerance range, with respect to any size hole, within
a given tolerance range.
[0027] Lastly, Figures 9-11 are similar to Figures 5-7, except that the receptacle connector
is shown surface mounted to circuit substrate 14, with rectangular mounting pegs 54
press fit into mounting holes 56. Again, it can be seen particularly in Figure 9 how
each pair of pegs straddle the elongate array of contact portions 52 of surface mount
tails 50. Figure 9 also shows how the contact portions have been biased upwardly or
"pre-loaded" in the direction of arrow "A" to create forces against the substrate
and to assure connection between the contact portion 52 and the appropriate contact
pad 18 of circuit substrate 14. Without the provision of both mounting pegs straddling
or supporting the elongate array of contact portions 52, the receptacle connector
12 would have a tendency to "rock", and the connector would be unstable prior to and
during processing.
[0028] It will be understood that the invention may be embodied in other specific forms
without departing from the spirit or central characteristics thereof. The present
examples and embodiments, therefore, are to be considered in all respects as illustrative
and not restrictive, and the invention is not to be limited to the details given herein.