(19)
(11) EP 0 673 547 A1

(12)

(43) Date of publication:
27.09.1995 Bulletin 1995/39

(21) Application number: 94901644.0

(22) Date of filing: 22.11.1993
(51) International Patent Classification (IPC): 
H01L 21/ 56( . )
H01L 23/ 02( . )
H01L 21/ 50( . )
H01L 23/ 10( . )
(86) International application number:
PCT/US1993/011337
(87) International publication number:
WO 1994/014193 (23.06.1994 Gazette 1994/14)
(84) Designated Contracting States:
DE FR GB IT NL

(30) Priority: 09.12.1992 US 19920987867

(71) Applicant: OLIN CORPORATION
Cheshire, CT 06410-0586 (US)

(72) Inventors:
  • LIANG, Dexin
    Modesto, CA 95356 (US)
  • BRATHWAITE, George, Anthony
    Hayward, CA 94544 (US)
  • HOFFMAN, Paul, Robert
    Modesto, CA 95356 (US)
  • RAMIREZ, German, Jamlig
    Antioch, CA 94509 (US)
  • STRAUMAN, Linda, E.
    Oakdale, CA 95361 (US)
  • MAHULIKAR, Deepak
    Madison, CT 06443 (US)
  • PASQUALONI, Anthony, M.
    Hamden, CT 06514 (US)

(74) Representative: Schmitt-Nilson, Gerhard, Dr. 
Klunker Schmitt-Nilson Hirsch Winzererstrasse 106
D-80797 München
D-80797 München (DE)

   


(54) ELECTRONIC PACKAGE SEALED WITH A DISPENSABLE ADHESIVE