[0001] The present invention relates to a positive resist composition sensitive to radiations
such as ultraviolet rays, far ultraviolet rays including excimer laser, electron beams,
ion beams, X rays, etc.
[0002] Recently, with a rise in the integration level of integrated circuits, formation
of pattern of submicron order is required. As its result, a positive resist composition
free from scum (undeveloped residue) and further excellent in properties such as sensitivity,
resolution, profile, depth of focus, heat resistance, etc. is demanded. Particularly
in the production of 16-64 MDRAMs (Mega-bit dynamic randam access memory), it is necessary
to resolve a pattern having a line width of 0.5 µm or less with a good profile and
a good depth of focus.
[0003] In JP-A-2-84414, particularly Claim 5 of the application, there is described a positive
photoresist which comprises a novolac resin and a photo sensitizer wherein the novolac
resin is a condensation product of (a)a phenol, a phenol derivative or a mixture thereof
and (b)an aldehyde which is a condensation product of a mixture of formaldehyde or
a formaldehyde precursor and an aldehyde containing a monohydroxy aromatic aldehyde.
The positive photoresist, however, is not yet satisfactory in resolution, profile,
depth of focus, etc.
[0004] It is the object of the present invention to provide a positive resist composition
excellent in the balance among properties such as sensitivity, resolution, profile,
depth of focus and heat resistance, and free from scum.
[0005] As a solution, the present invention provides a positive resist composition(i) which
comprises;
an o-quinonediazide compound; and
a novolac resin(1) which is obtained by allowing aldehydes containing
an aromatic aldehyde represented by the following formula (I)

wherein R₄ to R₆ each independently represents hydrogen, alkyl having 6 or less carbon
atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon atoms,
alkenyl having 6 or less carbon atoms or aryl having 10 or less carbon atoms, k' represents
the integer 0, 1, 2 or 3
and p represents 1, 2 or 3, provided that k' and p satisfy

,
to react with a phenol compound represented by the following formula (II)

wherein R₇ to R₉ each independently represents hydrogen, hydroxy, alkyl having 6 or
less carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less
carbon atoms, alkenyl having 6 or less carbon atoms or aryl having 10 or less carbon
atoms, provided that at least one of R₇ to R₉ is cycloalkyl having 6 or less carbon
atoms, in the presence of an acid catalyst
to obtain a reaction product(1) containing low molecular weight ingredients (hereinafter
this reaction step is referred to as "Condensation 1");
and, then, allowing the reaction product(1) or the low molecular weight ingredients
isolated from the reaction product(1) to further react with a phenol compound(1) and
formaldehyde (hereinafter this reaction step is referred to as "Condensation 2") in
the presence of an acid catalyst.
[0006] The present invention also provides a positive resist composition (ii) which comprises;
an o-quinonediazide compound; and
a novolac resin(2) which is obtained by allowing a compound represented by the
following formula (III)

wherein R₁₀ to R₁₂ each independently represents hydrogen, alkyl having 6 or less
carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon
atoms or alkenyl having 6 or less carbon atoms, provided that at least one of R₁₀
to R₁₂ is cycloalkyl having 6 or less carbon atoms, and n is 1 or 2; or
a compound represented by the following formula(IV)

wherein R₁₃ to R₁₈ each independently represents hydrogen, alkyl having 6 or less
carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon
atoms or alkenyl having 6 or less carbon atoms, R₁₉ represents hydrogen, alkyl having
6 or less carbon atoms or aryl having 10 or less carbon atoms, p and q each independently
represents 1 or 2 and r represents 0 or 1, provided that at least one of R₁₃ to R₁₅
is cycloalkyl having 6 or less carbon atoms;
to react with a phenol compound represented by the following formula(V)

wherein R₂₀ to R₂₂ each independently represents hydrogen, alkyl having 6 or less
carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon
atoms or alkenyl having 6 or less carbon atoms and k represents 1 or 2; and
an aldehyde (1) (hereinafter this reaction step is referred to as "Condensation 3").
In formula (I), k' is preferably 1 or 2.
[0007] As preferred examples of the aromatic aldehyde compound represented by the formula(I),
benzaldehyde, methylaldehydes such as 4-methylaldehyde, polyaldehydes such as terephthalaldehyde,
hydroxybenzaldehydes such as o-, m- or p-hydroxybenzaldehyde, methoxybenzaldehydes
such as o-, m- or p-methoxybenzaldehyde can be mentioned. Among them, hydroxybenzaldehydes
are more preferred. In Condensation 1, these aromatic aldehyde can be used independently
or in the form of a mixture of two or more. These aromatic aldehydes can be used in
a combination with one or more kinds of aliphatic aldehydes other than formaldehyde
such as acetaldehyde or glyoxal.
[0008] In the mixture of the aromatic aldehyde and the aliphatic aldehyde, the content of
the aromatic aldehyde is preferably 50% by weight or more, more preferably 85% or
more, based on the total amount of the mixture.
[0009] As preferable examples of the phenol compound represented by the formula(II), 2-cyclohexyl-5-methylphenol,
2-cyclopentyl-5-methylphenol and a mixture thereof can be mentioned.
[0010] In the Condensation 1, the molar ratio of the aromatic aldehyde compound represented
by the formula(I) to the phenol compound represented by the formula(II) is preferably
from 1:2 to 1:10. Condensation 1 is preferably carried out in the presence of an organic
solvent. As preferred examples of the organic solvent, a poor solvent can be mentioned
in which it is relatively difficult to dissolve the aromatic aldehyde compound of
the formula (I) and the phenol compound of the formula (II). Examples of the poor
solvent includes methanol, toluene, hexane, heptane or cyclohexane. Among the organic
solvents usable for the condensation 1, organic solvents having boiling points of
50-160°C are preferred and organic solvents having boiling points of 60-120 °C are
more preferred. Therefore, the above mentioned poor solvents having boiling points
of 60-120°C are particularly preferred As the acid catalyst used for the condensation
1, for example, inorganic acids such as hydrochloric acid, sulfuric acid and phosphoric
acid, organic acids such as oxalic acid, acetic acid and p-toluenesulfonic acid, and
divalent metal salts such as zinc acetate can be used.
[0011] In Condensation 1, the reaction temperature is usually 60 to 120 °C, and the reaction
time is usually 2 to 30 hours. According to Condensation 1 explained above, a reaction
product(1) which contains low molecular weight ingredients is obtained.
[0012] As example of the low molecular weight ingredients contained in the reaction product(1),
a compound represented by the following formula:

wherein R₄ to R₆, R₇ to R₉ and k' are as defined above, and a compound represented
by the following formula:

wherein R₄ to R₉, k' and p are as defined above provided that P-2 ≧ 0, can be mentioned.
[0013] The low molecular weight ingredients produced by Condensation 1 can be used for the
condensation reaction with formaldehyde and a phenol compound(1) (i.e. Condensation
2) after being isolated from the reaction product(1). However, the reaction product(1)
itself can also be used for the Condensation 2 without isolating the low molecular
weight ingredients from it. Carrying out Condensation 2 without isolating the low
molecular weight ingredients is more preferred than carrying out Condensation 2 after
isolating them. The isolation of the low molecular weight ingredients can be carried
out according to a conventional method such as concentration, crystallization, filtration
and drying.
[0014] Condensation 2 is carried out after mixing the reaction product(1) or the isolated
low molecular weight ingredients, the phenol compound(1) and formaldehyde. Condensation
2 can also be carried out while adding formaldehyde to a mixture of the reaction product(1)
or the isolated low molecular weight ingredients and the phenol compound(1).
[0015] As phenol compound (1), at least one phenol compound selected from phenol, m-cresol,
p-cresol, 2,5-xylenol, 3,5-xylenol, 3,4-xylenol, 2,3,5-trimethylphenol, 2-cyclohexyl-5-methylphenol,
2-cyclopentyl-5-methylphenol and 3-methyl-6-t-butylphenol is used in Condensation
reaction (2).
[0016] The amount of the formaldehyde used in Condensation 2 is usually 0.4 - 1 mole, preferably
0.6 - 0.95 mole per 1 mole of the total of the low molecular weight ingredients and
the phenol compound(1). The molar ratio of the low molecular weight ingredients to
the phenol compound(1) is preferably from 100:10 to 100:50.
[0017] In Condensation 2, the reaction temperature is usually 60 to 120 °C . Condensation
2 is preferably carried out in the presence of an organic solvent. Among the organic
solvents usable for the condensation 2, organic solvents having boiling points of
50-160°C are preferred and organic solvents having boiling points of 60-120 °C are
more preferred. Examples of the particularly preferred organic solvent include ketones
having boiling points of 60-120°C such as methylisobutylketone. As the acid catalyst
used for the condensation 2, for example, inorganic acids such as hydrochloric acid,
sulfuric acid and phosphoric acid, organic acids such as oxalic acid, acetic acid
and p-touenesulfonic acid, and divalent metal salts such as zinc acetate can be used.
[0018] Preferably, the novolac resin(1) formed by Condensation 2 is made, by a method such
as fractionation, into a novolac resin in which the areal ratio of the GPC pattern
of a range in that a molecular weight as converted to polystyrene is not higher than
900 is 25% or less, and more preferably 20% or less, based on the total pattern area
excluding the pattern area of unreacted phenol compounds, as measured by using UV
254 nm detector. The novolac resin(1) can also be made into a novolac resin of which
weight average molecular weight as converted to polystyrene is 2000 - 20000, which
is the preferred weight average molecular weight range of the novolac resin(1) as
converted to polystyrene.
[0019] As preferable examples of the o-quinonediazide compound, o-naphthoquinonediazide
compound can be mentioned. Examples of the o-naphthoquinonediazide compound include
the compounds obtained by subjecting a phenol compound having two or more hydroxyl
groups, preferably three or more hydroxyl groups, and 1,2-naphthoquinone-diazide-4-sulfonic
acid halide or 1,2-naphthoquinone-diazide-5-sulfonic acid halide to a condensation
reaction in the presence of weak alkali such as triethylamine or sodium carbonate.
This o-quinonediazide is used as a photo sensitizer for the positive photo resist
in the production of semiconductors.
[0020] As preferred examples of said phenol compound having two or more hydroxyl groups,
the compounds mentioned in Page 3 of JP-A-2-103543 as a general formula, the compounds
mentioned in JP-A-2-32352 as the general formula (I) or (II), the compounds mentioned
in JP-A-2-269351 as the general formula (I), the compounds mentioned in Page 4 of
JP-A-4-50851, the compounds mentioned in JP-A-3-185447 as the general formula (I),
oxyflavans including the compounds mentioned in JP-A-4-295472 as the general formula
(I), etc. can be referred to.
[0021] The positive resist composition(i) of the present invention may contain other ingredients
in addition to the novolac resin and the o-quinonediazide compound. Examples of the
other ingredients include an alkali-soluble polyhydric phenol compound of which molecular
weight is lower than 900. As examples of said alkali-soluble polyhydric phenol compound
of which molecular weight is lower than 900, the compounds mentioned in JP-A-2-275955
as the general formula (I), the compounds mentioned in JP-A-4-50851 as the general
formula (I), the compounds mentioned in JP-A-3-179353 as the general formula (I) can
be mentioned.
[0022] As the solvent used for preparation of the positive resist composition(i), solvents
vaporizable at an appropriate rate and capable of giving a uniform and smooth coating
film after evaporation can be used. Examples of such solvent include glycol esters
such as propylene glycol monomethyl ether acetate, ethyl cellosolve acetate and methyl
cellosolve acetate, the solvents mentioned in JP-A-2-220056, esters such as ethyl
pyruvate, n-amyl acetate and ethyl lactate and ketones such as 2-heptanone, γ-butyrolactone.
These solvents are used either independently or in the form of a mixture of two or
more.
[0023] The o-quinonediazide compound is usually used in an amount of 10-50% by weight based
on the total solid component of the positive resist composition(i). The other ingredients,
preferably the alkali-soluble polyhydric phenol compound of which the molecular weight
is lower than 900, are usually used in an amount of 0-40% by weight, preferably 3-40%
by weight, based on the total solid component of the positive resist composition (i).
[0024] As preferred examples of the compound of the formula (IV), compounds represented
by the following formulae:

can be mentioned. As more preferred examples of the compound of the formula(IV), compounds
represented by the following formulae:

can be mentioned.
[0025] As preferable example of the phenol compound represented by the general formula(V),
at least one phenol compound selected from phenol, m-cresol, p-cresol, 2,5-xylenol,
3,5-xylenol, 3,4-xylenol, 2,3, 5-trimethylphenol, 2-cyclohexyl-5-methylphenol, 2-cyclopentyl-5-methylphenol
and 3-methyl-6-t-butylphenol can be mentioned. In Condensation 3, the molar ratio
of the compound of the formula(III) or the compound of the general formula(IV) to
the phenol compound of the formula(V) is preferably 0.5 : 99.5 - 40 : 60.
[0026] Examples of the aldehyde (1) used in Condensation 3 include saturated or unsaturated
aliphatic aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, n-butylaldehyde,
isobutylaldehyde, trimethylacetaldehyde, n-hexylaldehyde, acrolein and crotonaldehyde;
cyclohexanealdehyde; cyclopentanealdehyde; furfural; furylacrolein; and aromatic aldehydes
such as benzaldehyde, o-, p- or m-tolualdehyde, p-ethylbenzaldehyde, 2,4--dimethylbenzaldehyde,
2,5--dimethylbenzaldehyde, 3,4--dimethylbenzaldehyde, 3,5-dimethylbenzaldehyde, phenylacetaldehyde,
o-, p- or m-hydroxybenzaldehyde, cinnamaldehyde, o-, p- or m-anisaldehyde and vanillin.
As preferred examples of the aldehyde(1), formaldehyde can be mentioned.
[0027] In the condensation reaction of the aldehyde(1) with the compound of the formula(III)
or (IV) and the phenol compound of the formula(V), molar ratio of the aldehyde(1)
to the total amount of the compound of the formula(III) or (IV) and the phenol compound
of the formula(V) is preferably from 1 : 0.005 to 1 : 2. Other conditions of this
condensation reaction are same as those of Condensation 2.
[0028] Preferably, the novolac resin(2) produced by Condensation 3 is made, by a method
such as fractionation, into a novolac resin in which the areal ratio of the GPC pattern
of a range in that a molecular weight as converted to polystyrene is not higher than
900 is 25% or less based on the total pattern area excluding the pattern area of unreacted
phenol compounds, as measured by using UV 254 nm detector, as the novolac resin(1).
The novolac resin(2) can also be made into a novolac resin of which the weight average
molecular weight as converted to polystyrene is 2000 - 20000, which is the preferred
weight average molecular weight range of the novolac resin (2) as converted to polystyrene.
[0029] The o-quinonediazide compound used in the positive resist composition(ii) is the
same as in the positive resist composition(i).
[0030] The positive resist composition(ii) may contain other ingredients in addition to
the novolac resin(2) and the o-quinonediazide compound. For example, it may preferably
contain an alkali-soluble polyhydric phenol compound of which molecular weight is
lower than 900. The contents of the alkali-soluble polyhydric phenol compound of which
molecular weight is lower than 900, the novolac resin(2) and the o-quinonediazide
compound in the total solid content of the positive resist composition(ii) are the
same as in the positive resist composition(i) mentioned above.
[0031] The positive resist composition(i) or (ii) of the present invention are excellent
in the balance among properties such as sensitivity, resolution, profile, heat resistance,
depth of focus, etc. and free from scum.
[0032] The present invention is explained in more detail with reference to the following
examples. In the examples, parts means part by weight.
Synthesis Example 1
[0033] A mixture of 113.4 g of 2-cyclohexyl-5-methylphenol, 210.8g of methanol, 3.6g of
p-toluenesulfonicacid and 18.3g of salicylaldehyde was allowed to react at 80°C for
4 hours. Then, the reaction product thus obtained was cooled and added to 50% aqueous
solution of methanol to obtain a white precipitate. The precipitate was filtrate,
washed and dried to obtain 40g of a white powdery compound(a) represented by the following
formula:

Purity of the white powdery compound(a) measured according to the areametric analysis
with liquid chromatography was 99.6%.
FD-MS : m/e = 484
Synthesis Example 2
[0034] A mixture of 48.9 g of 2-cyclohexyl-5-methylphenol, 105.6g of methanol, 2.7g of p-toluenesulfonicacid
and 17.1g of vanilline was allowed to react under the refluxing condition for 4 hours.
Then, the reaction product thus obtained was cooled to obtain a precipitate. The precipitate
was filtrate, washed with 50% aqueous solution of methanol and dried to obtain 41g
of a compound represented by the following formula:

FD-MS : m/e = 514
Synthesis Example 3
[0035] To a mixture of 80g of the compound(a) obtained in Synthesis Example 1, 250g of methyl
isobutyl ketone and 189. 2g of m-cresol, 135.6g of 37% aqueous solution of formaldehyde
was dropwise added over a period of 60 minutes, and the resulting mixture was allowed
to react at 90°C for 8 hours. Then, the reaction mixture was washed with water and
dehydrated to obtain a solution of a novolac rosin in methyl isobutyl ketone. To the
solution thus obtained, 1000g of 2-heptanon was added and then methyl isobutyl ketone
in the solution was distilled off by an evaporator to obtain a solution of a novolac
resin in 2-heptanon. As measured by GPC, the product had a polystyrene-converted weight
average molecular weight of 4300.
Synthesis Example 4
[0036] To a mixture of 80g of the compound(a) obtained in Synthesis Example 1, 250g of methyl
isobutyl ketone, 189.2g of m-cresol and 42.8g of 2,5-xylenol, 161.5g of 37% aqueous
solution of formaldehyde was dropwise added over a period of 60 minutes, and the resulting
mixture was allowed to react at 90°C for 8 hours. Then, the reaction mixture was washed
with water and dehydrated to obtain a solution of a novolac resin in methyl isobutyl
ketone. To the solution thus obtained, 1000g of 2-heptanon was added and then methyl
isobutyl ketone in the solution was distilled off by an evaporator to obtain a solution
of a novolac resin in 2-heptanon. As measured by GPC, the product had a polystyrene-converted
weight average molecular weight of 4270.
Synthesis Example 5
[0037] To a mixture of 53g of the compound(a) obtained in Synthesis Example 1, 150g of methyl
isobutyl ketone, 121.7g of m-cresol and 27.5g of 2,5-xylenol, 92.8g of 37% aqueous
solution of formaldehyde was dropwise added over a period of 60 minutes, and the resulting
mixture was allowed to react at 90 °C for 8 hours. Then, the reaction mixture was
washed with water and dehydrated to obtain a solution of a novolac resin in methyl
isobutyl ketone. To the solution thus obtained, 1000g of 2-heptanon was added and
then methyl isobutyl ketone in the solution was distilled off by an evaporator to
obtain a solution of a novolac resin in 2-heptanon. As measured by GPC, the product
had a polystyrene-converted weight average molecular weight of 7700.
Synthesis Example 6
[0038] Synthesis Example 5 was repeated except that the reaction time was changed to 5 hours
to obtain a solution of a novolac resin in 2-heptanon. As measured by GPC, the product
had a polystyrene-converted weight average molecular weight of 4800.
Synthesis Example 7
[0039] Synthesis Example 6 was repeated except that the amounts of m-cresol, 2,5-xylenol
and 37% aqueous solution of formaldehyde were changed to 120.6g, 54.5g and 114.3g
respectively to obtain a solution of a novolac resin in 2-heptanon. As measured by
GPC, the product had a polystyrene-converted weight average molecular weight of 3900.
Synthesis Example 8
[0040] To a mixture of 53g of the compound(a) obtained in Synthesis Example 1, 150g of methyl
isobutyl ketone, 122.7g of m-cresol and 55.5g of 2,5-xylenol, 115g of 37% aqueous
solution of formaldehyde was dropwise added over a period of 60 minutes, and the resulting
mixture was allowed to react at 90°C for 6 hours. Then, the reaction mixture was washed
with water and dehydrated to obtain a solution of a novolac resin in methyl isobutyl
ketone. To the solution thus obtained, 1000g of 2-heptanon was added and then methyl
isobutyl ketone in the solution was distilled off by an evaporator to obtain a solution
of a novolac resin in 2-heptanone. As measured by GPC, the product had a polystyrene-converted
weight average molecular weight of 4800.
Synthesis Example 9
[0041] 100g of a solution of a novolac resin in methyl isobutyl ketone obtained according
to the same manner as in Synthesis Example 3, in which the content of novolac resin
was 39.2 % by weight, was charged to a 1-liter separable flask equipped with a drain
pipe at its bottom. To the flask, 50.7g of methyl isobutyl ketone and 95g of n-heptane
were further added. The content of the flask was stirred at 60 °C for 30 minutes and
then left to stand until it separated into two layers. To the under layer thus obtained,
300g of 2-heptanone was added, and then the methyl isobutyl ketone and n-heptane were
removed by means of an evaporator to obtain a solution of novolac resin in 2-heptanone.
As measured by GPC, the product thus obtained had a polystyrene-converted weight average
molecular weight of 7000, and the areal ratio of the range in which the molecular
weight as converted to polystyrene was 900 or less to the total pattern area was 15%.
Synthesis Example 10
[0042] 100g of a solution of a novolac resin in methyl isobutyl ketone obtained according
to the same manner as in Synthesis Example 4, in which the content of novolac resin
was 42 % by weight, was charged to a 1-liter separable flask equipped with a drain
pipe at its bottom. To the flask, 61.4g of methyl isobutyl ketone and 101.7g of n-heptane
were further added. The content of the flask was stirred at 60°C for 30 minutes and
then left to stand until it separated into two layers. To the under layer thus obtained
300g of 2-heptanone was added and then the methyl isobutyl ketone and n-heptane were
removed by means of an evaporator to obtain a solution of novolac resin in 2-heptanone.
As measured by GPC, the product thus obtained had a polystyrene-converted weight average
molecular weight of 7200, and the areal ratio of the range in which the molecular
weight as converted to polystyrene was 900 or less to the total pattern area was 16%.
Synthesis Example 11
[0043] A mixture of 76.1 g of 2-cyclohexyl-5-methylphenol, 155.9g of methanol, 4.2g of p-toluenesulfonicacid
and 21.4g of salicylaldehyde was allowed to react at 80 °C for 4 hours. After the
reaction was completed, 317.9g of methyl isobutyl ketone was added to the reaction
product and the resulting solution was distilled until the inner temperature rose
to 85 °C in order to remove methanol. After 189.2g of m-cresol was added thereto,
135.6g of 37% aqueous solution of formaldehyde was dropwise added over a period of
60 minutes, and the resulting mixture was allowed to react at 90°C for 8 hours. Then,
the reaction mixture was washed with water and dehydrated to obtain a solution of
a novolac resin in methyl isobutyl ketone. To the solution thus obtained, 1000g of
2-heptanon was added and then methyl isobutyl ketone in the solution was distilled
off by an evaporator to obtain a solution of a novolac resin in 2-heptanon. As measured
by GPC, the product had a polystyrene-converted weight average molecular weight of
4250.
Synthesis Example 12
[0044] A mixture of 76.1 g of 2-cyclohexyl-5-methylphenol, 155.9g of methanol, 4.2g of p-toluenesulfonicacid
and 21.4g of salicylaldehyde was allowed to react at 80 °C for 4 hours. After the
reaction was completed, 317.9g of methyl isobutyl ketone was added to the reaction
product and the resulting solution was distilled until the inner temperature rose
to 85 °C to remove methanol. After 189.2g of m-cresol and 42.8g of 2,5-xylenol were
added thereto, 161.5g of 37% aqueous solution of formaldehyde was dropwise added over
a period of 60 minutes, and the resulting mixture was allowed to react at 90 °C for
8 hours. Then, the reaction mixture was washed with water and dehydrated to obtain
a solution of a novolac resin in methyl isobutyl ketone. To the solution thus obtained,
1000g of 2-heptanon was added and then methyl isobutyl ketone in the solution was
distilled off by an evaporator to obtain a solution of a novolac resin in 2-heptanon.
As measured by GPC, the product had a polystyrene-converted weight average molecular
weight of 4300.
Synthesis Example 13
[0045] A mixture of 32.8 g of 2-cyclohexyl-5-methylphenol, 67.2g of methanol, 1.8g of p-toluenesulfonicacid
and 9.2g of salicylaldehyde was allowed to react at 80 °C for 4 hours. After the reaction
was completed, 177g of methyl isobutyl ketone was added to the reaction product and
the resulting solution was distilled until the inner temperature rose to 85 °C in
order to remove methanol. After 121.7g of m-cresol and 27.5g of 2,5-xylenol were added
thereto, 92.8g of 37% aqueous solution of formaldehyde was dropwise added over a period
of 60 minutes, and the resulting mixture was allowed to react at 90 °C for 8 hours.
Then, the reaction mixture was washed with water and dehydrated to obtain a solution
of a novolac resin in methyl isobutyl ketone. To the solution thus obtained, 1000g
of 2-heptanon was added and then methyl isobutyl ketone in the solution was distilled
off by an evaporator to obtain a solution of a novolac resin in 2-heptanon. As measured
by GPC, the product had a polystyrene-converted weight average molecular weight of
7800.
Synthesis Example 14
[0046] A mixture of 32.8 g of 2-cyclohexyl-5-methylphenol, 67.2g of methanol, 1.8g of p-toluenesulfonicacid
and 9.2g of salicylaldehyde was allowed to react at 80 °C for 4 hours. After the reaction
was completed, 177g of methyl isobutyl ketone was added to the reaction product and
the resulting solution was distilled until the inner temperature rose to 85 °C in
order to remove methanol. After 121.7g of m-cresol and 27.5g of 2,5-xylenol were added
thereto, 92.8g of 37% aqueous solution of formaldehyde was dropwise added over a period
of 60 minutes, and the resulting mixture was allowed to react at 90 °C for 5 hours.
Then, the reaction mixture was washed with water and dehydrated to obtain a solution
of a novolac resin in methyl isobutyl ketone. To the solution thus obtained, 1000g
of 2-heptanon was added and then methyl isobutyl ketone in the solution was distilled
off by an evaporator to obtain a solution of a novolac resin in 2-heptanon. As measured
by GPC, the product had a polystyrene-converted weight average molecular weight of
4900.
Synthesis Example 15
[0047] A mixture of 32.5 g of 2-cyclohexyl-5-methylphenol, 66.6g of methanol, 1.8g of p-toluenesulfonicacid
and 9.1g of salicylaldehyde was allowed to react at 80 °C for 4 hours. After the reaction
was completed, 177g of methyl isobutyl ketone was added to the reaction product and
the resulting solution was distilled until the inner temperature rose to 85 °C in
order to remove methanol. After 120.6g of m-cresol and 54.5g of 2,5-xylenol were added
thereto, 114.3g of 37% aqueous solution of formaldehyde was dropwise added over a
period of 60 minutes, and the resulting mixture was allowed to react at 90°C for 5
hours. Then, the reaction mixture was washed with water and dehydrated to obtain a
solution of a novolac resin in methyl isobutyl ketone. To the solution thus obtained,
1000g of 2-heptanon was added and then methyl isobutyl ketone in the solution was
distilled off by an evaporator to obtain a solution of a novolac resin in 2-heptanon.
As measured by GPC, the product had a polystyrene-converted weight average molecular
weight of 3850.
Synthesis Example 16
[0048] A mixture of 33.1 g of 2-cyclohexyl-5-methylphenol, 67.8g of methanol, 1.8g of p-toluenesulfonicacid
and 9.3g of salicylaldehyde was allowed to react at 80 °C for 4 hours. After the reaction
was completed, 177g of methyl isobutyl ketone was added to the reaction product and
the resulting solution was distilled until the inner temperature rose to 85 °C in
order to remove methanol. After 122.7g of m-cresol and 55.5g of 2,5-xylenol were added
thereto, 115g of 37% aqueous solution of formaldehyde was dropwise added over a period
of 60 minutes, and the resulting mixture was allowed to react at 90°C for 6 hours.
Then, the reaction mixture was washed with water and dehydrated to obtain a solution
of a novolac resin in methyl isobutyl ketone. To the solution thus obtained, 1000g
of 2-heptanon was added and then methyl isobutyl ketone in the solution was distilled
off by an evaporator to obtain a solution of a novolac resin in 2-heptanon. As measured
by GPC, the product had a polystyrene-converted weight average molecular weight of
4700.
Synthesis Example 17
[0049] 100g of a solution of a novolac resin in methyl isobutyl ketone obtained according
to the same manner as in Synthesis Example 11, in which the content of novolac resin
was 39.2% by weight, was charged to a 1-liter separable flask equipped with a drain
pipe at its bottom. To the flask, 50.7g of methyl isobutyl ketone and 95g of n-heptane
were further added. The content of the flask was stirred at 60 °C for 30 minutes and
then left to stand until it separated into two layers. To the under layer thus obtained
300g of 2-heptanone was added, after which the methyl isobutyl ketone and n-heptane
were removed by means of an evaporator to obtain a solution of novolac resin in 2-heptanone.
As measured by GPC, the product thus obtained had a polystyrene-converted weight average
molecular weight of 7050, and the areal ratio of the range in which the molecular
weight as converted to polystyrene was 900 or less to the total pattern area was 15%.
Synthesis Example 18
[0050] 100g of a solution of a novolac resin in methyl isobutyl ketone obtained according
to the same manner as in Synthesis Example 12, in which the content of novolac resin
was 42% by weight, was charged to a 1-liter separable flask equipped with a drain
pipe at its bottom. To the flask, 61.4g of methyl isobutyl ketone and 101.7g of n-heptane
were further added. The content of the flask was stirred at 60°C for 30 minutes and
then left to stand until it separated into two layers. To the under layer thus obtained
300g of 2-heptanone was added, after which the methyl isobutyl ketone and n-heptane
were removed by means of an evaporator to obtain a solution of novolac resin in 2-heptanone.
As measured by GPC, the product thus obtained had a polystyrene-converted weight average
molecular weight of 7300, and the areal ratio of the range in which the molecular
weight as converted to polystyrene was 900 or less to the total pattern area was 16%.
Examples
[0051] According to the formulation shown in the following Table 1, 2 and 3, a novolac resin
(in Table 1, 2 and 3, simply referred to as "resin"), a 1,2-naphthoquinonediazide
compound (in Table 1, 2 and 3, simply referred to as "photo sensitizer") and an alkali-soluble
polyhydric phenol compound of which molecular weight is less than 900(in Table 1,
2 and 3, simply referred to as "additive B") were mixed and dissolved in 50 parts
of 2-heptanone.
[0052] The solution thus obtained was filtered through a Teflon filter having a pore size
of 0.2 µm to prepare a resist solution. A silicon wafer washed in a conventional manner
was coated with the resist solution up to a thickness of 1.06 µm by means of a spin
coater and baked on a hot plate at 90°C for one minute. Subsequently, the wafer was
exposed to light by using a reduction projection exposing machine having an exposure
wavelength of 365 nm (i-line) (NSR1755i7A, NA=0.5, manufactured by Nikon Corp.) while
stepwise changing the amount of exposure.
[0053] Subsequently, the wafer was baked on a hot plate at 110 °C for one minute. Then,
it was developed for one minute with SOPD (alkaline developing solution; product of
Sumitomo Chemical Co., Ltd.) to obtain a positive pattern. A resolution was evaluated
by measuring, with a scanning electron microscope, the dimension of the minimum line-and-space
pattern which could be resolved without film thickness decrease at an exposure amount
giving 1:1 line-and-space(effective sensitivity).
[0054] Profile and scum were evaluated by observing, with a scanning electron microscope,
the cross-sectional shape of a 0.50 µm line-and-space pattern at the effective sensitivity.
[0055] Heat resistance was evaluated by observing the extent of sagging of the resist pattern
after being heated on a hot plate at 124 °C for 5 minutes.
[0056] The depth of focus was determined by observing, with a scanning electron microscope,
a degree of focus shifting where a 0.50 µm line-and-space pattern could be resolved
at the effective sensitivity without film thickness decrease.
[0058] FIG.1 shows a ¹H-NMR spectrum of the compound obtained in Synthesis Example 1.
[0059] FIG.2 shows a ¹H-NMR spectrum of the compound obtained in Synthesis Example 2.
1. A positive resist composition which comprises;
an o-quinonediazide compound; and
a novolac resin which is obtained by allowing aldehydes containing
an aromatic aldehyde represented by the following formula (I)

wherein R ₄ to R₆ each independently represents hydrogen, alkyl having 6 or less
carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon
atoms, alkenyl having 6 or less carbon atoms or aryl having 10 or less corbon atoms,
k' represents an integer not smaller than 0 and p represents 1, 2 or 3, provided that
k' and p satisfy

,
to react with a phenol compound represented by the following formula(II)

wherein R ₇ to R₉ each independently represents hydrogen, hydroxy, alkyl having 6
or less carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or
less carbon atoms, alkenyl having 6 or less carbon atoms or aryl having 10 or less
corbon atoms, provided that at least one of R₇ to R₉ is cycloalkyl having 6 or less
carbon atoms, in the presence of an acid catalyst to obtain a reaction product(1)
containing low molecular weight ingredients; and then allowing the reaction product
(1) or the low molecular weight ingredients isolated from the reaction product (1)
to further react with a phenol compound (1) and formaldehyde in the presence of an
acid catalyst.
2. A positive resist composition according to Claim 1 in which the phenol compound represented
by the formula (II) is at least one compound selected from 2-cyclohexyl-5-methylphenol
and 2-cyclopentyl-5-methylphenol.
3. A positive resist composition according to Claim 1 or 2 in which the phenol compound(1)
is at least one phenol compound selected from phenol, m-cresol, p-cresol, 2,5-xylenol,
3,5-xylenol, 3,4-xylenol, 2,3,5-trimethylphenol, 2-cyclohexyl-5-methylphenol, 2-cyclopentyl-5-methylphenol
and 3-methyl-6-t-butylphenol.
4. A positive resist composition according to any of claims 1 to 3 in which the reaction
of the aldehyde containing the aromatic aldehyde represented by the formula(I) and
the phenol compound represented by the formula(II) is carried out in the presence
an organic solvent having the boiling temperature of 50-160°C.
5. A positive resist composition according to any of claims 1 to 4 in which the novolac
resin(1) is the one in which the areal ratio of the GPC pattern of a range in that
a molecular weight as converted to polystyrene is not higher than 900 is 25% or less
based on the total pattern area excluding the pattern area of unreacted phenol compounds,
as measured by using UV 254 nm detector.
6. A positive resist composition which comprises;
an o-quinonediazide compound; and
a novolac resin which is obtained by allowing a compound represented by the following
formula(III)

wherein R ₁₀ to R₁₂ each independently represents hydrogen, alkyl having 6 or less
carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon
atoms or alkenyl having 6 or less carbon atoms, provided that at least one of R ₁₀
to R ₁₂ is cycloalkyl having 6 or less carbon atoms, and n is 1 or 2; or
a compound represented by the following formula(IV):

wherein R ₁₃ to R₁₈ each independently represents hydrogen, alkyl having 6 or less
carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon
atoms or alkenyl having 6 or less carbon atoms, R₁₉ represents hydrogen, alkyl having
6 or less carbon atoms or aryl having 10 or less corbon atoms, p and q each independently
represents 1 or 2 and r represents 0 or 1, provided that at least one of R ₁₃ to R
₁₅ is cycloalkyl having 6 or less carbon atoms;
to condensate with a phenol compound represented by the following formula(V):

wherein R ₂₀ to R₂₂ each independently represents hydrogen, alkyl having 6 or less
carbon atoms, cycloalkyl having 6 or less carbon atoms, alkoxy having 6 or less carbon
atoms or alkenyl having 6 or less carbon atoms and k represents 1 or 2; and an aldehyde
(1).
7. A positive resist composition according to Claim 6 in which the compound of the formula(IV)
is one of the compounds represented by the following formulas:
8. A positive resist composition according to Claim 6 or 7 in which the phenol compound
of the formula(V) is at least one phenol compound selected from
phenol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, 3,4-xylenol, 2,3,5-trimethylphenol,
2-cyclohexyl-5-methylphenol, 2-cyclopentyl-5-methylphenol and 3-methyl-6-t-butylphenol.
9. A positive resist composition according to any of claims 6 to 8 in which the molar
ratio of the compound of the formula (III) or the compound of the general formula(IV)
to the phenol compound of the formula(V) is from 0.5:99.5 to 40: 60.
10. A positive resist composition according to any of claims 6 to 9 in which the weight
average molecular weight of the novolac resin as converted to polystyrene is 2,000
to 20,000.
11. A positive resist composition according to any of claims 1 to 10 which further contains
an alkali-soluble polyhydric phenol compound, the molecular weight of which is lower
than 900.