(19)
(11) EP 0 686 076 A1

(12)

(43) Date of publication:
13.12.1995 Bulletin 1995/50

(21) Application number: 94909651.0

(22) Date of filing: 17.02.1994
(51) International Patent Classification (IPC): 
B24B 37/ 04( . )
(86) International application number:
PCT/US1994/001675
(87) International publication number:
WO 1994/019153 (01.09.1994 Gazette 1994/20)
(84) Designated Contracting States:
DE GB IT

(30) Priority: 23.02.1993 US 19930021215

(71) Applicant: MEMC Electronic Materials, Inc.
St. Peters, Missouri 63376 (US)

(72) Inventors:
  • LEONI, Fabrizio
    St. Peters, MO 63376 (US)
  • MORGANTI, Marco
    St. Peters, MO 63376 (US)
  • VESCO, Luigi
    St. Peters, MO 63376 (US)

(74) Representative: Eyles, Christopher Thomas 
W.P. THOMPSON & CO. Celcon House 289-293 High Holborn
London WC1V 7HU
London WC1V 7HU (GB)

   


(54) WAFER POLISHING APPARATUS AND METHOD