(19)
(11) EP 0 692 142 A1

(12)

(43) Date of publication:
17.01.1996 Bulletin 1996/03

(21) Application number: 94912859.0

(22) Date of filing: 24.03.1994
(51) International Patent Classification (IPC): 
H01L 23/ 36( . )
H01L 23/ 42( . )
H01L 23/ 373( . )
H01L 23/ 433( . )
(86) International application number:
PCT/US1994/003204
(87) International publication number:
WO 1994/023450 (13.10.1994 Gazette 1994/23)
(84) Designated Contracting States:
DE FR GB IT SE

(30) Priority: 31.03.1993 US 19930040732
18.03.1994 US 19940210527

(71) Applicant: UNISYS CORPORATION
Blue Bell, PA 19424 (US)

(72) Inventors:
  • LAYTON, Wilbur, Terry
    San Diego, CA 92129 (US)
  • MORANGE, Blanquita, Ortega
    San Diego, CA 92127 (US)
  • TORRES, Angela, Marie
    Vista, CA 92083 (US)

(74) Representative: Modiano, Guido, Dr.-Ing., et al 
Modiano, Josif, Pisanty & Staub, Baaderstrasse 3
D-80469 München
D-80469 München (DE)

   


(54) LIQUID METAL HEAT CONDUCTING MEMBER AND INTEGRATED CIRCUIT PACKAGE INCORPORATING SAME