A binding machine using a tape and a binding tape

(19)

(11)

EP 0 695 648 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	02.10.1996 Bulletin 1996/40

(43)	Date of publication A2:
	07.02.1996 Bulletin 1996/06

(21)	Application number: 95305372.5

(22)	Date of filing: 01.08.1995

(51)	International Patent Classification (IPC)⁶: B42C 9/00

(84)	Designated Contracting States:
	CH LI SE

(30)

Priority:

03.08.1994 JP 182446/94

(71)	Applicant: PICARD Co.
	Suginami-Ku, Tokyo (JP)

(72)	Inventor:
	Sawada, Sueji, c/o Picard Co. Toyko (JP)

(74)	Representative: Votier, Sidney David
	CARPMAELS & RANSFORD 43, Bloomsbury Square London WC1A 2RA London WC1A 2RA (GB)

(54)	A binding machine using a tape and a binding tape

(57) The binding machine (1) using the tape employs the binding tape (6) having the bonding tape (7) coated on its rear surface with the adhesive and consists of the boring mechanism (2) for boring the aperture (h) through the papers (P) to be bound and the binding mechanism (3) which winds the bonding tape (7) around or halfway around the portion between the bored aperture (h) and the end surface (p₁) of the papers (P) and so on to be bound and bonds the bonding tape (7) thereto.

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