[0001] The present invention relates to a containing apparatus for electronic parts, and
particularly to an electronic part container used in an electroplating process, whereby
bending of lead wires of an electronic part may be prevented during the electroplating
operation and the deposition thickness is relatively even, and what is more the apparatus
is capable of being incorporated into an automatic production line so as to enhance
production efficiency and prevent hazards induced by manual operation.
[0002] Referring to FIG. 1, showing a conventional containing apparatus for electronic parts
used in an electroplating process, the conventional apparatus is provided with a plurality
of tanks "A" and a metal piece such as tin, lead, copper, silver, and the like, serving
as an anode.
[0003] Electronic parts are firstly put into a rolling barrel "C" and then the rolling barrel
"C" is disposed in the electroplating apparatus as shown in FIG. 1. As shown in FIG.
2, an electrically-conducting shaft "D" is provided along the central axis of the
conventional rolling barrel "C". The substantially cylindrical wall of the rolling
barrel "C" is composed of a number of covers "C1" on which a plurality of apertures
is formed so that the electrolyte can flow through the wall of the rolling barrel.
A large quantity of electronic parts are placed in the barrel "C" to be electroplated.
The rolling barrel "C" is rotatably connected to a cantilever "E" which is connected
with an actuating rod "F" which is able to rotate and/or vertically translate the
rolling barrel "C".
[0004] In such an apparatus, since the large quantity of electronic parts is inevitably
crowded in the rolling barrel "C", a phenomenon of bending of the lead wires of an
electronic part occurs during the electroplating operation. To overcome this disadvantage,
the electrically-conducting shaft is provided with a plurality of electrically-conducting
rings "D'" so as to avoid collisions between electronic parts in the rolling barrel.
However, the bending problem still cannot be solved effectively. This is because electronic
parts are randomly disposed in the rolling barrel "C" of the apparatus. Moreover,
since the space inside the barrel "C" is relatively large, the chance of collision
between electronic parts during the electroplating operation is very high. As a result,
close to the ends of an electronic part the lead wires will suffer from being bent,
and then the bent leads must be straightened manually. Consequently, human resources
are wasted.
[0005] Apart from the above disadvantages, the conventional apparatus has the following
disadvantages:
1. The material to be electroplated is remote from the anode. Therefore, the electroplating
thickness on the electronic part will be quite non-uniform. Especially, the electroplating
thickness of a low current zone will be unfavourably influenced.
With reference to FIG. 3 which is a schematic diagram of an electronic part, the reference
numeral "3" is used to designate the body of the electronic part such as a resistor,
a capacitor and the like. Two lead wires 31 extend outwardly longitudinally along
the body 3. Due to the point discharge effect, during the electroplating process a
lead wire 31 is divided into a low current density zone (L.C.D.), a medium current
density zone (M.C.D.) and a high current density zone (H.C.D.).
In general, the high current density zone (H.C.D.) will be cut off after the electroplating
process is finished, leaving only the low current density zone and/or a part of the
medium current density zone. Therefore, electroplating quality of the low current
density zone is an important factor influencing the quality of an electronic part.
For an experiment performed by the conventional apparatus, with the parameter values
of:- 8K electronic parts in one barrel, an electroplating time of 10 minutes, and
a current density of 26.9 mamp/cm
2 (25ASF), the result is as follows:
| |
Thickness |
Alloy proportion
(percentage of tin in a tin-lead alloy) |
| H.C.D. |
Average: 14.03 µm (552.5 µinches) |
83.5% |
| |
STD. DEV (statistical error value: 4.87 µm (191.9 µinches) |
0.9 |
| |
MAX. Value: 21.41µm (882.6 µinches) |
85.1% |
| |
MIN. Value: 7.77 µm (305.9 µinches) |
82.3% |
| |
Range: 14.65 µm (576.7 µinches) |
2.8 |
| |
STD.DEV=standard deviation |
|
| |
Thickness |
Alloy proportion
(percentage of tin in a tin-lead alloy) |
| L.C.D. |
Average: 6.66 µm (262.2 µinches) |
86.6% |
| |
STD.DEV: 3.43 µm (135.0 µinches) |
3.4 |
| |
MAX. Value: 13.18 µm (518.9 µinches) |
94.3% |
| |
MIN. Value: 0.82 µm (32.6 µinches) |
82.8% |
| |
Range: 12.35 µm (486.3 µinches) |
11.5 |
| |
STD.DEV=standard deviation |
|
| |
Thickness |
Alloy proportion
(percentage of tin in a tin-lead alloy) |
| M.C.D. |
Average: 10.41 µm (410.0 µinches) |
82.3% |
| |
STD.DEV: 7.67 µm (119.0 µinches) |
1.0 |
| |
MAX. Value: 14.71µm (579.2 µinches) |
83.5% |
| |
MIN. Value: 6.56 µm (258.2 µinches) |
88.9% |
| |
Range: 8.15 µm (321.0 µinches) |
2.6 |
| |
STD.DEV=standard deviation |
|
The above data indicate that the difference between the MAX. Value and the MIN. Value
for L.C.D. is the largest, which means the quality is most variable. For H.C.D., the
difference between the MAX. Value and the MIN. Value is the smallest, which means
the quality in this zone is relatively stable. However, this H.C.D. will be cut off.
Therefore, it is no advantage for the quality to have such a H.C.D. In view of this,
it is the major object of the present invention to achieve a uniform distribution
of electroplating thickness in the L.C.D.
2. After electrolyte permeates through the cover C1 into the rolling barrel "C", the
flow rate of the electrolyte is lowered, namely the exchange rate between the electrolyte
inside the barrel "C" and the electrolyte outside the barrel is not high. As a result,
the electroplating effect is not high.
3. After the electroplating process is finished, the cover "C1" must be removed and
the rolling barrel moved so as to pour the electronic parts out of the rolling barrel
"C". Since there is a distance from the rolling barrel "C" to the container therebelow
the lead wires, especially those of the electronic parts close to the lower level
of the rolling barrel "C", will once again become bent because of the gravity induced
in the pouring process.
US-A-1367567 discloses an electroplating apparatus in which a rotating cage is formed
of a set of four containers of generally triangular shape with the truncated vertex
of each triangle of the container nearer the axis of rotation. Workpieces can then
be loosely placed in the containers and allowed to come in contact with electrolyte
in the surrounding tank, by virtue of openings defining liquid-permeable walls of
the containers.
SUMMARY OF THE PRESENT INVENTION
[0006] To overcome the above disadvantages, the present invention provides a containing
apparatus as defined in claim 1. The plurality of spikes enhance the probability of
contact between the electronic parts and the cathode. Furthermore, the electronic
parts have their lead wires kept from being bent so as to eliminate the necessity
of straightening bent wires. In addition, the containers are each positioned substantially
tangential to the shaft so the fluidity of electrolyte is increased and hence the
uniformity of the electroplating thickness is easily achieved.
[0007] The containers are preferably so spacious that the electronic parts therein will
not crowd together, so the coating on the surface of the electronic part is complete,
namely it is of better quality.
[0008] Having the containers substantially tangential to the shaft facilitates the circulation
of the electrolyte. Therefore, the coating is evenly distributed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The present invention may be performed in various ways and one specific embodiment
will be described by way of example with reference to the accompanying drawings, in
which:
FIG. 1 is a schematic diagram of a conventional electroplating tank;
FIG. 2 is a perspective view of a conventional rotating cage for electronic parts;
FIG. 3 is an elevational view of an electronic part;
FIG. 4 is a perspective view of a containing apparatus according to the present invention;
FIG. 5 is an exploded perspective view of a container for electronic parts, according
to the present invention;
FIG. 6 is a fragmentary top view of the container for electronic parts, according
to the present invention; and
FIG. 7 is a sectional view of the container for electronic parts, taken along the
sectional line 7-7, wherein electronic parts are accommodated in the container.
DETAILED DESCRIPTION OF THE INVENTION
[0010] Referring to FIGS. 4-6, the containing apparatus 1 of the present invention for electronic
parts mainly comprises a rotating cage 4 and a plurality of electronic part containers
2. Each of the connecting seats 42 comprises a guiding slot 45 for guiding and receiving
the respective electronic part container 2 therein and a knob 43 for fixing the container
2 in the guiding slot 45. After the connection of the containers 2 with the guiding
slots 45, the containers 2 are arranged in a tangential direction. The rotating cage
4 is provided with a plurality of connecting seats 42 which are substantially tangential
to a rotation axis (as indicated by phantom line 41') thereof. By the provision of
the connecting seats 42, the rotating cage 4 is able to receive containers 2. The
connecting seat 42 is further provided with an electrically-conducting copper piece
44 which is capable of being in contact with electrically-conducting copper pieces
on two ends of the container 2 so as to form a current path. During an electroplating
process, the rotating cage 4 is connected to the conventional actuating rod "F" so
as to move around in the tank "A".
[0011] As shown in FIG. 5, the container 2 takes the form of a thin rectangular box. The
thin box 2 is provided with a plurality of baffle plates 22 which are evenly spaced
so as to define a plurality of compartments 21. Spikes are provided on the side walls
of each compartment 21 so as to form spiky walls 23 made of electrically-conducting
material. The spiky walls 23 are connected to the electrically-conducting copper pieces
24 on the two ends of the container 2. The container 2 has a cap 25 which is able
to keep electronic parts therein from dropping out. The cap 25 has a liquid-permeable
screen 26 thereon and the bottom of the container 2 is also liquid-permeable. By means
of the water-permeable characteristics of the container 2, the electrolyte is easily
circulated.
[0012] As shown in FIG. 7, the orientation of each electronic part 3 is perpendicular to
the spiky walls such that the lead wires of each electronic part are able to contact
with the spiky walls 23. Since the orientation of every electronic part 3 is the same,
and no collision with another occurs, the lead wires 31 of the electronic parts 3
will be almost clear of risk of being bent. Furthermore, the probability of contact
between the electronic parts and the cathode is greatly increased.
[0013] Summing up the above, the electroplating apparatus of the present invention is able
to achieve the following advantages:
1. The probability of lead wire bending is greatly reduced. Since the orientations
of electronic parts are the same, the electronic parts are not crowded together and
hence the lead wires are securely kept straight.
2. The coating on the surface of the electronic part is more uniform. Since the current
in the present invention is well-distributed, the electroplating apparatus of the
present invention is capable of providing an even and high current density to the
electronic part, especially to zone L.C.D. thereof. Furthermore, the coating thickness
of zone H.C.D. produced by the conventional method is reduced by the design of the
spiky walls so as to achieve a more evenly distributed coating along the entire lead
wires. Particularly, for the zone L.C.D. which in application is used as an effective
welding zone, the present invention is capable of greatly increasing the weldability
of an electronic part (according to the test method of MIL-STD-208 METHOD 202F).
3. The orientations of the thin boxes are such that the circulation of the electrolyte
flowing through the screen is easily achieved. Meanwhile, the electrolyte circulation
inside the thin box is comparatively ameliorated. Therefore, the coating thickness
and the uniformity thereof are well under control.
4. The body 1 is made according to standard specifications so as to facilitate the
automatic loading, transporting and unloading.
[0014] To demonstrate the quality of electronic parts, an experiment is performed using
the same parameter values as the conventional ones except that the quantity of electronic
parts is 4K per barrel. The following is the result:
| |
Thickness |
Alloy proportion
(percentage of tin in a tin-lead alloy) |
| H.C.D. |
Average: 11.43 µm (450.5 µinches) |
88.6% |
| |
STD. DEV (statistical error value: 6.99 µm (275 µinches) |
3.3 |
| |
MAX. Value: 30.48 µm (1200 µinches) |
93.8% |
| |
MIN. Value: 5.08 µm (200 µinches) |
80.9% |
| |
Range: 24.9 µm (980 µinches) |
12.9 |
| |
STD.DEV=standard deviation |
|
| |
Thickness |
Alloy proportion
(percentage of tin in a tin-lead alloy) |
| M.C.D. |
Average: 12.14 µm (478 µinches) |
84.2% |
| |
STD.DEV: 4.32 µm (170 µinches) |
1.1 |
| |
MAX. Value: 23.37 µm (920 µinches) |
86.4% |
| |
MIN. Value: 5.72 µm (225 µinches) |
82.2% |
| |
Range: 17.78 µm (700 µinches) |
4.2 |
| |
STD.DEV=standard deviation |
|
| |
Thickness |
Alloy proportion
(percentage of tin in a tin-lead alloy) |
| L.C.D. |
Average: 10.29 µm (405 µinches) |
86.4% |
| |
STD.DEV: 3.81 µm (150 µinches) |
1.5 |
| |
MAX. Value: 18.8 µm (740 µinches) |
90.01% |
| |
MIN. Value: 3.81µm (150 µinches) |
83.2% |
| |
Range: 15.24 µm (600 µinches) |
6.8 |
| |
STD.DEV=standard deviation |
|
[0015] As indicated by the above data, the present invention makes the thickness of the
zone L.C.D. and that of the H.C.D. zone almost equal. Therefore, the quality of the
electronic part can be improved.
1. A containing apparatus for electronic parts (3) used in an electroplating process
which is disposed in a tank (A) comprising:-
a rotating cage (4) capable of moving around in the tank and having a plurality of
connecting seats (42), each of said connecting seats having thereon an electrically-conducting
piece (44) and being tangent to a central axis (41') of said rotating cage; and
a plurality of containers (2) each having a respective electrically-conducting piece
(24) provided on the two ends of said container to contact said electrically-conducting
piece (44) of said rotating cage (4) when each of said containers (2) is received
in a respective said connecting seat (42), each said container having a thin box having
each end provided with an electrically-conducting copper piece and a screen provided
thereon as a cap, and being received in said rotating cage, the bottom of said box
including a bottom screen (26);
characterized in that :
said thin box has a plurality of baffle plates (22) which are so placed that a
plurality of compartments (21) are formed therein, and in that each of said compartments
has two side walls which are provided with a plurality of electrically-conducting
spikes (23) so as to form an electrically-conducting spiky wall on each of said ends,
each of said spiky walls being respectively in contact with each of said electrically-conducting
copper pieces (24) of said box.
2. A container as claimed in claim 1, wherein said rotating cage has a plurality of guiding
slots (45), each capable of receiving a said container and provided with a said electrically-conducting
piece (44)of copper, and wherein a knob is provided at the open end of said guiding
slots.
3. A container as claimed in claim 1 or 2, wherein each spike (23) of said spiky walls
is in the shape of a pyramid, and said spikes are not in contact with one another.
1. Eine Aufnahmevorrichtung für elektronische Teile (3), wobei die Aufnahmevorrichtung
bei einem Elektroplattierverfahren verwendet wird und in einem Tank (A) angeordnet
ist, aufweisend:
einen drehbaren Käfig (4), der dazu befähigt ist, sich in dem Tank herumzubewegen,
und eine Mehrzahl von Verbindungssitzen (42) aufweist, wobei jeder der genannten Verbindungssitze
an ihm ein elektrisch leitendes Teil (44) aufweist und in Bezug auf eine mittlere
Achse (41') des genannten drehbaren Käfigs tangential ist; und
eine Mehrzahl von Behältern (2), von denen jeder ein entsprechendes elektrisch leitendes
Teil (24) aufweist, das an den zwei Enden des genannten Behälters vorgesehen ist,
um das genannte elektrisch leitende Teil (44) des genannten drehbaren Käfigs (4) zu
berühren, wenn jeder der genannten Behälter (2) in einem entsprechenden, genannten
Verbindungssitz (42) aufgenommen ist, wobei jeder genannte Behälter einen dünnen Kasten,
bei dem jedes Ende mit einem elektrisch leitenden Kupferstück versehen ist, und ein
Sieb aufweist, das an ihm als eine Abdeckung vorgesehen ist, wobei jeder genannte
Behälter in dem genannten drehbaren Käfig aufgenommen ist und wobei der Boden des
genannten Kastens ein Bodensieb (26) aufweist;
dadurch gekennzeichnet, daß
der genannte dünne Kasten eine Mehrzahl von Scheidewänden (22) aufweist, welche so
angeordnet sind, daß eine Mehrzahl von Abteilen (21) hierin gebildet ist, und daß
jedes der genannten Abteile zwei Seitenwände aufweist, welche mit einer Mehrzahl von
elektrisch leitenden Spitzen (23) versehen sind, so daß eine elektrisch leitende,
Spitzen aufweisende Wand an jedem der genannten Enden gebildet ist, wobei jede der
genannten, Spitzen aufweisenden Wände in Berührung mit jedem der genannten, elektrisch
leitenden Kupferstücke (24) des genannten Kastens ist.
2. Eine Aufnahmevorrichtung, wie in Anspruch 1 beansprucht, bei welcher der genannte
drehbare Käfig eine Mehrzahl von Führungsschlitzen (45) aufweist, von denen jeder
dazu befähigt ist, einen genannten Behälter aufzunehmen, und mit einem genannten elektrisch
leitenden Stück (44) aus Kupfer versehen ist, und bei welcher an dem offenen Ende
der genannten Führungsschlitze ein Knopf vorgesehen ist.
3. Eine Aufnahmevorrichtung, wie in Anspruch 1 oder 2 beansprucht, bei welcher jede Spitze
(23) der genannten, Spitzen aufweisenden Wände in der Gestalt einer Pyramide ist und
die genannten Spitzen nicht in Berührung miteinander sind.
1. Équipement pour contenir des composants électroniques (3) utilisé dans un processus
de galvanoplastie, qui est disposé dans une cuve (A), comprenant :
- une cage tournante (4) propre à tourner dans la cuve et ayant une multiplicité de
sièges de raccordement (42), chacun desdits sièges de raccordement ayant sur lui une
pièce électriquement conductrice (44) et étant tangent à un axe central (41') de ladite
cage tournante ; et
- une multiplicité de récipients (2) ayant chacun une pièce conductrice de l'électricité
(24) prévue sur les deux extrémités dudit récipient pour être en contact avec ladite
pièce électriquement conductrice (44) de ladite cage tournante (4), lorsque chacun
desdits récipients (2) est reçu dans l'un desdits sièges de raccordement respectifs
(42), chacun desdits récipients étant un mince bac ayant chaque extrémité équipée
d'une pièce de cuivre électriquement conductrice et ayant chacun une fine grille prévue
sur lui comme chapeau, et étant reçu dans ladite cage tournante, le fond de ladite
cage comprenant une fine grille de fond (26) ;
caractérisé en ce que :
ledit mince bac a une multiplicité de chicanes (22) qui sont disposées de telle
sorte qu'une multiplicité de compartiments (21) y sont formés, et en ce que chacun
desdits compartiments a deux parois latérales qui sont équipées d'une multiplicité
de dents électriquement conductrices (23) de façon à former une paroi crénelée conductrice
de l'électricité sur chacune desdites extrémités, chacune desdites parois crenelée
étant respectivement en contact avec chacune desdites pièces de cuivre électriquement
conductrices (24) dudit bac.
2. Récipient selon la revendication 1, dans lequel ladite cage tournante a une multiplicité
de fentes de guidage (45), chacune pouvant recevoir l'un desdits récipients et étant
équipée d'une desdites pièces de cuivre électriquement conductrices (44) et dans lequel
un bouton est prévu au niveau de l'extrémité ouverte desdites fentes de guidage.
3. Récipient selon la revendication 1 ou la revendication 2, dans lequel chaque dent
(23) desdites parois crénelées a la forme d'une pyramide, et lesdites dents ne sont
pas en contact les unes avec les autres.