(19)
(11)
EP 0 702 775 A1
(12)
(43)
Date of publication:
27.03.1996
Bulletin 1996/13
(21)
Application number:
95911781.0
(22)
Date of filing:
15.02.1995
(51)
International Patent Classification (IPC):
C30B
25/
12
( . )
C30B
35/
00
( . )
C30B
31/
14
( . )
H01L
21/
00
( . )
(86)
International application number:
PCT/US1995/002008
(87)
International publication number:
WO 1995/023427
(
31.08.1995
Gazette 1995/37)
(84)
Designated Contracting States:
CH DE GB LI NL
(30)
Priority:
17.02.1994
KR 19940002820
(71)
Applicant:
VARIAN ASSOCIATES, INC.
Palo Alto, California 94304-1030 (US)
(72)
Inventors:
KYUNG, Hyun-Su
Kyungki-Do (KR)
CHOI, Won-Song
Kyungki-Do (KR)
SHIN, Jung-Ho
Kyungki-Do (KR)
(74)
Representative:
Cline, Roger Ledlie
EDWARD EVANS & CO. Chancery House 53-64 Chancery Lane
London WC2A 1SD
London WC2A 1SD (GB)
(54)
APPARATUS FOR THERMAL TREATMENT OF THIN FILM WAFER