METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A SURFACE PROVIDED WITH A MULTILAYER WIRING STRUCTURE - Patent 0704105

(19)

(11)

EP 0 704 105 A1

(12)

(43)	Date of publication:
	03.04.1996 Bulletin 1996/14

(21)	Application number: 95910699.0

(22)	Date of filing: 17.03.1995

(51)

International Patent Classification (IPC):

H01L 21/ 00^{( . )}
H01L 21/ 768^{( . )}

H01L 21/ 306^{( . )}

(86)	International application number:
	PCT/IB1995/000180

(87)	International publication number:
	WO 1995/028000 (19.10.1995 Gazette 1995/45)

(84)	Designated Contracting States:
	DE FR GB IT NL

(30)

Priority:

07.04.1994 EP 19940200940

(71)	Applicant: PHILIPS ELECTRONICS N.V.
	NL-5621 BA Eindhoven (NL)

(72)	Inventors:
	PEEK, Hermanus, Leonardus NL-5621 BA Eindhoven (NL) VERBUGT, Daniel, Wilhelmus, Elisabeth NL-5621 BA Eindhoven (NL)

(74)	Representative: Rensen, Jan Geert, et al
	INTERNATIONAAL OCTROOIBUREAU B.V., Prof. Holstlaan 6 NL-5656 AA Eindhoven NL-5656 AA Eindhoven (NL)

(54)	METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A SURFACE PROVIDED WITH A MULTILAYER WIRING STRUCTURE