(19)
(11) EP 0 704 906 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
17.04.1996 Bulletin 1996/16

(43) Date of publication A2:
03.04.1996 Bulletin 1996/14

(21) Application number: 95113928.6

(22) Date of filing: 05.09.1995
(51) International Patent Classification (IPC)6H01L 29/423, H01L 29/47, H01L 21/28
(84) Designated Contracting States:
DE FR GB

(30) Priority: 22.09.1994 JP 227735/94

(71) Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
Tokyo 100 (JP)

(72) Inventor:
  • Noda, Minoru, c/o Mitsubishi Denki K.K.
    1 Mizuhara 4-chome, Itami-shi, Hyogo 664 (JP)

(74) Representative: KUHNEN, WACKER & PARTNER 
Alois-Steinecker-Strasse 22
D-85354 Freising
D-85354 Freising (DE)

   


(54) Electrode of semiconductor device and method of fabricating thereof


(57) An electrode of a semiconductor device includes a semiconductor layer (6) having a surface, a laminated structure laminating a plurality of layers comprising conductive materials on the surface of the semiconductor layer (6) and having a side surface, and a side barrier layer disposed on the side surface of the laminated structure and comprising a conductive material which can prevent a conductive material of a specific layer constituting the laminated structure except a lowermost layer in contact with the semiconductor layer (6) reacting with the semiconductor layer (6) from diffusing into the semiconductor layer (6) through the side surface of the laminated structure. Therefore, the side barrier layer prevents the conductive material reacting with the semiconductor layer (6) from diffusing into the semiconductor layer (6) through the side surface of the laminated structure, and erosion of the semiconductor layer (6) and deterioration of a contact between the electrode (4) and the semiconductor layer (6) are not caused due to the reaction of the semiconductor layer (6) with the conductive material, whereby the reliability of the semiconductor device in which this electrode (4) is provided is improved.







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