......DE....FRGB........NL..........................................................................*EPregister to ST.36 EBD process v 1.0 kbaumeister@epo.org (15 Jan 2013)0705485A119960410EP94920207.01994061319960123enenen1993008212219930623US1993016961719931217US1996041019961519960410199615

H01L 23/ 12 A I

H01L 23/ 057 A I

H01L 23/ 16 A I

H01L 23/ 36 A I

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enELECTRICALLY AND THERMALLY ENHANCED PACKAGE USING A SEPARATE SILICON SUBSTRATEfrBOITIER AMELIORE ELECTRIQUEMENT ET THERMIQUEMENT A SUBSTRAT EN SILICIUM SEPAREdeELEKTRISCH UND THERMISCH VERBESSERTE PACKUNG DURCH BENUTZUNG EINES SEPARATEN SILIZIUMSUBSTRATSVLSI TECHNOLOGY, INC.1109 McKay DriveSan Jose California 95131USGROOVER, Richard3776 Pinewood PlaceSanta Clara, CA 95054USSHU, William132 Carson CourtSunnyvale, CA 94086USLEE, Sang, S.878 S. Mary AvenueSunnyvale, CA 94087USFUJIMOTO, George2430 South Park LaneSanta Clara, CA 95051USKahler, Kurt, Dipl.-Ing.Patentanwälte Kahler, Käck, Fiener & Sturm P.O. Box 12 49D-87712 MindelheimDEDEFRGBNLUS199400673919940613enWO199500097319950105199502