(19)
(11) EP 0 706 221 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
03.09.2008 Bulletin 2008/36

(45) Mention of the grant of the patent:
25.06.2008 Bulletin 2008/26

(21) Application number: 95307054.7

(22) Date of filing: 04.10.1995
(51) International Patent Classification (IPC): 
H01L 25/07(2006.01)
H01L 23/373(2006.01)
H01L 23/495(2006.01)

(54)

Semiconductor device comprising a plurality of semiconductor elements

Halbleiteranordnung mit einer Mehrzahl von Halbleiterelementen

Dispositif semi-conducteur comprenant une pluralité d'éléments semi-conducteurs


(84) Designated Contracting States:
DE FR GB

(30) Priority: 07.10.1994 JP 24365494
28.12.1994 JP 32663394
28.12.1994 JP 32664094
11.01.1995 JP 281895

(43) Date of publication of application:
10.04.1996 Bulletin 1996/15

(73) Proprietors:
  • Hitachi, Ltd.
    Chiyoda-ku, Tokyo 101 (JP)
  • HITACHI HARAMACHI ELECTRONICS CO., LTD.
    Hitachi-shi, Ibaraki 317-0072 (JP)

(72) Inventors:
  • Yamada, Kazuji
    Hitachi-shi, Ibaraki 316 (JP)
  • Tanaka, Akira
    Hitachi-shi, Ibaraki 316 (JP)
  • Saito, Ryuichi
    Hitachi-shi, Ibaraki 319-12 (JP)
  • Kurihara, Yasutoshi
    Hitachinaka-shi, Ibaraki 312 (JP)
  • Kushima, Tadao
    Naka-gun, Ibaraki 319-11 (JP)
  • Haramaki, Takashi
    Naka-gun, Ibaraki 319-11 (JP)
  • Koike, Yoshihiko
    Hitachi-shi, Ibaraki 319-12 (JP)
  • Hosokawa, Takashi
    Kodaira-shi, Tokyo 187 (JP)
  • Sawahata, Mamoru
    Hitachi-shi, Ibaraki 316 (JP)
  • Koizumi, Masahiro
    Hitachi-shi, Ibaraki 316 (JP)
  • Onuki, Jin
    Hitachi-shi, Ibaraki 319-12 (JP)
  • Suzuki, Kazuhiro
    Mito-shi, Ibaraki 310 (JP)
  • Kobayashi, Isao
    Naka-gun, Ibaraki 311-01 (JP)
  • Shimizu, Hideo
    Hitachi-shi, Ibaraki 316 (JP)
  • Higashimura, Yutaka
    Hitachi-shi, Ibaraki 316 (JP)
  • Sekine, Shigeki
    Hitachi-shi, Ibaraki 316 (JP)
  • Koike, Nobuya
    Takasaki-shi, Gunma 370 (JP)
  • Kokubun, Hideya
    Takahagi-shi, Ibaraki 318-01 (JP)

(74) Representative: Hackney, Nigel John et al
Mewburn Ellis LLP York House 23 Kingsway
London WC2B 6HP
London WC2B 6HP (GB)


(56) References cited: : 
EP-A- 0 277 546
EP-A- 0 459 283
EP-A- 0 546 731
EP-A- 0 588 094
DE-A- 4 330 070
EP-A- 0 309 920
EP-A- 0 468 475
EP-A- 0 553 981
EP-A- 0 609 528
US-A- 4 278 990
   
  • PROCEEDINGS OF THE 7TH. INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC'S. (ISPSD), YOKOHAMA, MAY 23 - 25, 1995, no. SYMP. 7, 23 May 1995, INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, pages 80-83, XP000594244 TANAKA A ET AL: "2000V 500A HIGH POWER IGBT MODULE"
  • TECHNISCHE RUNDSCHAU TRANSFER, vol. 80, no. 32, 5 August 1988, pages 38-41, 43, 45, XP000110807 BAYERER R ET AL: "LEISTUNGSHALBLEITERMODULE IN DIREKT-BONDING-TECHNIK"
  • SOLID STATE TECHNOLOGY, vol. 36, no. 2, 1 February 1993, page 59, 60, 62 XP000343999 NGON BINH NGUYEN: "USING ADVANCED SUBSTRATE MATERIALS WITH HYBRID PACKAGING TECHNIQUES FOR ULTRAHIGH-POWER ICS"
  • PATENT ABSTRACTS OF JAPAN vol. 008, no. 119 (E-248), 5 June 1984 & JP 59 031044 A (MITSUBISHI DENKI KK), 18 February 1984,
  • PATENT ABSTRACTS OF JAPAN vol. 095, no. 003, 28 April 1995 & JP 06 334070 A (SANYO ELECTRIC CO LTD), 2 December 1994,
  • PATENT ABSTRACTS OF JAPAN vol. 011, no. 244 (E-530), 8 August 1987 & JP 62 054944 A (MITSUBISHI ELECTRIC CORP), 10 March 1987,
  • PATENT ABSTRACTS OF JAPAN vol. 011, no. 400 (E-569), 26 December 1987 & JP 62 160746 A (FUJI ELECTRIC CO LTD), 16 July 1987,
  • PATENT ABSTRACTS OF JAPAN vol. 018, no. 199 (E-1534), 7 April 1994 & JP 06 005730 A (MITSUBISHI MATERIALS CORP), 14 January 1994,
  • PATENT ABSTRACTS OF JAPAN vol. 015, no. 425 (C-0879), 29 October 1991 & JP 03 177385 A (KAWASAKI STEEL CORP), 1 August 1991,
   
Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).