(19)
(11) EP 0 707 741 A1

(12)

(43) Date of publication:
24.04.1996 Bulletin 1996/17

(21) Application number: 95918863.0

(22) Date of filing: 04.05.1995
(51) International Patent Classification (IPC): 
H01L 21/ 822( . )
H01L 23/ 367( . )
H01L 23/ 48( . )
H01L 27/ 04( . )
H01L 23/ 29( . )
H01L 23/ 373( . )
H01L 23/ 485( . )
(86) International application number:
PCT/US1995/005217
(87) International publication number:
WO 1995/031006 (16.11.1995 Gazette 1995/49)
(84) Designated Contracting States:
DE FR IT NL

(30) Priority: 05.05.1994 US 19940238552
12.10.1994 US 19940321937

(71) Applicant: SILICONIX INCORPORATED
Santa Clara, California 95054 (US)

(72) Inventors:
  • CHANG, Mike, F.
    Cupertino, CA 95014 (US)
  • OWYANG, King
    Atherton, CA 94026 (US)
  • HSHIEH, Fwu-Iuan
    Saratoga, CA 95070 (US)
  • HO, Yueh-Se
    Sunnyvale, CA 94086 (US)
  • DUN, Jowei
    San Jose, CA 95127 (US)
  • FÜSSER, Hans-Jürgen
    D-89547 Gerstetten-Dettingen (DE)
  • ZACHAI, Reinhard
    D-89312 Günzburg (DE)

(74) Representative: Freeman, Jacqueline Carol, et al 
W.P. THOMPSON & CO. Celcon House 289-293 High Holborn
London WC1V 7HU
London WC1V 7HU (GB)

   


(54) SURFACE MOUNT AND FLIP CHIP TECHNOLOGY