(19)
(11) EP 0 708 982 A1

(12)

(43) Date of publication:
01.05.1996 Bulletin 1996/18

(21) Application number: 95918082.0

(22) Date of filing: 10.05.1995
(51) International Patent Classification (IPC): 
H01L 21/ 312( . )
H01L 21/ 316( . )
(86) International application number:
PCT/GB1995/001057
(87) International publication number:
WO 1995/031823 (23.11.1995 Gazette 1995/50)
(84) Designated Contracting States:
AT BE CH DE ES FR GB IE IT LI NL SE

(30) Priority: 14.05.1994 GB 19940009713

(71) Applicant: ELECTROTECH EQUIPMENTS LIMITED
Bristol BS12 1NP (GB)

(72) Inventors:
  • DOBSON, Christopher, David
    Bristol BS12 3AA (GB)
  • KIERMASZ, Adrian
    Avon Bristol BS12 7UW (GB)

(74) Representative: Dunlop, Brian Kenneth Charles, et al 
c/o Wynne-Jones, Lainé & James 22 Rodney Road
Cheltenham Gloucestershire GL50 1JJ
Cheltenham Gloucestershire GL50 1JJ (GB)

   


(54) A METHOD OF TREATING A SEMI-CONDUCTOR WAFER