| (19) |
 |
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(11) |
EP 0 714 773 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
16.04.1997 Bulletin 1997/16 |
| (43) |
Date of publication A2: |
|
05.06.1996 Bulletin 1996/23 |
| (22) |
Date of filing: 29.11.1995 |
|
| (51) |
International Patent Classification (IPC)6: B41J 2/16 |
|
| (84) |
Designated Contracting States: |
|
DE FR GB |
| (30) |
Priority: |
01.12.1994 US 347634
|
| (71) |
Applicant: LEXMARK INTERNATIONAL, INC. |
|
Greenwich,
Connecticut 06836 (US) |
|
| (72) |
Inventors: |
|
- Christiansen, Robert Arnold
Salvisa,
Kentucky 40372 (US)
- Eisele, Peter Jon
Lexington,
Kentucky 40505 (US)
- Jackson, Tonya Harris
Nicholasville,
Kentucky 40356 (US)
- Williams, Gary Raymond
Lexington,
Kentucky 40517 (US)
|
| (74) |
Representative: Skailes, Humphrey John |
|
Frank B. Dehn & Co.
Imperial House
15-19 Kingsway
London WC2B 6UZ
London WC2B 6UZ (GB) |
|
| |
|
| (54) |
Bonding process for ink jet silicon chips |
(57) A process for bonding an ink jet silicon chip to the pen body of an ink jet printer
by first coating the chip with a silane adhesion promoter, then a high temperature
curing epoxy in a very thin layer, and finally attaching the coated chip to the pen
body with a low temperature curing epoxy.