FLIP CHIP IN METAL ELECTRONIC PACKAGES - Patent 0719453

(19)

(11)

EP 0 719 453 A1

(12)

(43)	Date of publication:
	03.07.1996 Bulletin 1996/27

(21)	Application number: 94926028.0

(22)	Date of filing: 29.08.1994

(51)

International Patent Classification (IPC):

H01L 21/ 60^{( . )}
H01L 23/ 055^{( . )}
H01L 23/ 06^{( . )}
H01L 23/ 50^{( . )}

H01L 23/ 04^{( . )}
H01L 23/ 057^{( . )}
H01L 23/ 12^{( . )}

(86)	International application number:
	PCT/US1994/009612

(87)	International publication number:
	WO 1995/008188 (23.03.1995 Gazette 1995/13)

(84)	Designated Contracting States:
	DE FR GB IT

(30)

Priority:

13.09.1993 US 19930120609

(71)	Applicant: OLIN CORPORATION
	Cheshire, CT 06410-0586 (US)

(72)	Inventors:
	BRADEN, Jeffrey, S. Livermore, CA 94550 (US) MAHULIKAR, Deepak Madison, CT 06643 (US)

(74)	Representative: Klunker . Schmitt-Nilson . Hirsch
	Winzererstrasse 106 80797 München 80797 München (DE)

(54)	FLIP CHIP IN METAL ELECTRONIC PACKAGES