THERMAL PACKAGING UNIT FOR BIOCOMPATIBLE IMPLANTS

(19)

(11)

EP 0 731 674 A1

(12)

(43)	Date of publication:
	18.09.1996 Bulletin 1996/38

(21)	Application number: 94905916.0

(22)	Date of filing: 23.11.1993

(51)

International Patent Classification (IPC):

A61F 2/ 00^{( . )}
A61F 7/ 02^{( . )}
A61L 27/ 18^{( . )}
F24J 1/ 00^{( . )}
A61F 2/ 02^{( . )}
A61F 2/ 36^{( . )}

A61F 2/ 30^{( . )}
A61F 7/ 03^{( . )}
A61L 27/ 50^{( . )}
A61B 19/ 02^{( . )}
A61F 2/ 32^{( . )}
A61F 2/ 46^{( . )}

(86)	International application number:
	PCT/US1993/011432

(87)	International publication number:
	WO 1995/015129 (08.06.1995 Gazette 1995/24)

(84)	Designated Contracting States:
	AT CH DE DK ES FR GB IT LI

(71)	Applicant: BIOMET, INC.
	Warsaw, IN 46580 (US)

(72)	Inventors:
	WILEY, Roy, C. Warsaw, IN 46580 (US) SARVER, David, R. Logansport, IN 46947 (US)

(74)	Representative: Webb, Andrew John, et al
	J.A. Kemp & Co., 14 South Square, Gray's Inn London WC1R 5LX London WC1R 5LX (GB)

(54)	THERMAL PACKAGING UNIT FOR BIOCOMPATIBLE IMPLANTS