INTEGRATED CIRCUIT PACKAGE ASSEMBLY INCLUDING A WINDOW AND METHODS OF MANUFACTURING - Patent 0734590

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EP 0 734 590 A1

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(43)	Date of publication:
	02.10.1996 Bulletin 1996/40

(21)	Application number: 95938152.0

(22)	Date of filing: 13.10.1995

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International Patent Classification (IPC):

H01L 31/ 0203^{( . )}

(86)	International application number:
	PCT/US1995/012766

(87)	International publication number:
	WO 1996/012303 (25.04.1996 Gazette 1996/18)

(84)	Designated Contracting States:
	DE FR GB

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Priority:

14.10.1994 US 19940324119

(71)	Applicant: NATIONAL SEMICONDUCTOR CORPORATION
	Sunnyvale, CA 94086-3737 (US)

(72)	Inventors:
	SATYA, Chillara San Jose, CA 95129 (US) SHAHRAM, Mostafazadeh San Jose, CA 95136 (US)

(74)	Representative: Bowles, Sharon Margaret, et al
	BOWLES HORTON Felden House Dower Mews High Street Berkhamsted Hertfordshire HP4 2BL Berkhamsted Hertfordshire HP4 2BL (GB)

(54)	INTEGRATED CIRCUIT PACKAGE ASSEMBLY INCLUDING A WINDOW AND METHODS OF MANUFACTURING