Charge plate fabrication process

(19)

(11)

EP 0 744 290 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	04.03.1998 Bulletin 1998/10

(43)	Date of publication A2:
	27.11.1996 Bulletin 1996/48

(21)	Application number: 96303395.6

(22)	Date of filing: 14.05.1996

(51)	International Patent Classification (IPC)⁶: B41J 2/085

(84)	Designated Contracting States:
	DE FR GB

(30)

Priority:

26.05.1995 US 452326

(71)	Applicant: SCITEX DIGITAL PRINTING, Inc.
	Dayton, Ohio 45420-4099 (US)

(72)	Inventors:
	Morris, Brian Dayton, Ohio 45419-2556 (US) Harrison, James, Jr. Dayton, Ohio 45404-1730 (US) Ridgley, Greggory Oregonia, Ohio 45054 (US) Lind, Kenneth Cincinnati, Ohio 45236-2719 (US) Sexton, Richard Huber Heights, Ohio 45424 (US)

(74)	Representative: Hillier, Peter et al
	Reginald W. Barker & Co., Chancery House, 53-64, Chancery Lane London, WC2A 1QU London, WC2A 1QU (GB)

(54)	Charge plate fabrication process

(57) A charge plate fabrication process uses conventional methods to fabricate the charge plate. Initially, a non-conductive charge plate substrate is provided, the substrate having an edge and a top. The substrate is then edge patterned to define a charging face on the edge of the non-conductive charge plate substrate. The conductive path from the charging face to the top of the non-conductive charge plate substrate is completed to create a charge plate. The charge plate is then top patterned.

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