|
(11) | EP 0 751 559 A1 |
| (12) | EUROPEAN PATENT APPLICATION |
|
|
|
|
||||||||||||||||
| (54) | Process for forming an integrated circuit comprising non-volatile memory cells and side transistors and corresponding IC |
(57) A process for forming an integrated circuit calls for the provision of at least one
matrix of non-volatile memory cells (1) having an intermediate dielectric multilayer
including at least a lower dielectric material layer (8) and an upper silicon oxide
layer (9) and the simultaneous provision in zones peripheral to the matrix of at least
one first transistor type (2) having gate dielectric of a first thickness. After formation
of the floating gate with a gate oxide layer (4) and a polycrystalline silicon layer
(5) and the formation of the lower dielectric material layer (8), the process in accordance
with the present invention calls for:
To provide additionally a second transistor type having gate dielectric of a second thickness, indicatively thinner than said first thickness, successive steps are added in accordance with the present invention. |
Field of application
[0001] The present invention relates to a process for forming an integrated circuit comprising non-volatile memory cells and peripheral transistors.
[0002] Specifically the present invention relates to a process providing for the implementation in a monocrystalline silicon substrate of at least one matrix of memory cells in each of which a floating gate and a control gate, both electroconductive, are mutually electrically insulated by means of an intermediate dielectric multilayer. There is also provided simultaneous formation in peripheral to the matrix zones of at least one first type of MOS transistor.
[0003] The present invention also relates to an integrated circuit of the above mentioned type comprising non-volatile memory cells having an intermediate dielectric multilayer and at least one type of peripheral transistors.
Prior art
[0004] As well known, in the field of electronic semiconductor technology, to reduce the area of integrated circuits there is a tendency towards ever greater integration scales with a reduction of component sizes. This has led to improvement of the quality of the materials used and to optimization of the processes for their formation.
[0005] The present invention falls in particular in the field of the development of the techniques of formation of dielectric materials which in a single integrated circuit and in the form of layers of different thickness and composition perform different functions. On the one hand they act as insulators providing electrical insulation of conductive layers and creating a barrier against contaminating substances coming from the outside ambient and on the other hand as active dielectrics allowing the passage of charges between layers of conductive materials.
[0006] In order to improve the quality and functionality of the above mentioned dielectrics it has been proposed in relatively recent times to provide multiple superimposed layers, in particular of silicon oxides and/or silicon nitrides.
[0007] In the specific field of application of the present invention there are provided integrated memory circuits including, in addition to a plurality of memory cells arranged in one or more matrixes, external or peripheral circuits in which components are structurally similar to the cells and are provided by the same technology. Specific reference is made to MOS transistors.
[0008] Non-volatile memories, to which specific reference will be made in the present invention, comprise different classes of devices or products which differ from each other by the structure of the individual memory cell and the type of application. Specifically reference is made to read-only memories which can be electrically programmed and erased (Erasable Programmable Read Only Memories) and specifically EPROM, EEPROM or FLASH. These can be distinguished as some of them are both erasable and electrically programmable while others require e.g. ultraviolet light to be erased. For data storage, memory cells comprise in all cases a floating-gate MOS transistor integrated on a substrate usually of monocrystalline silicon. The amount of charge contained in the floating gate determines the logical state of the cell. Non-volatile memory cells are programmed in a discrete number of logical states allowing memorization of one or more bits per cell. In standard cells for example programming is provided in two logical states, written and erased, with memorization of one bit per cell.
[0009] The floating gate of electroconductive material, normally polysilicon, i.e. polycrystalline silicon or more briefly 'poly', is completely surrounded by insulating material. In particular over the floating gate a dielectric layer, so-called intermediate dielectric or interpoly, insulates the floating gate from an overlying control gate also of electroconductive material. The control gate can consist alternatively of a single polysilicon layer or of a double polysilicon trasversale silicide layer and is coupled electrically to a programming terminal.
[0010] As known to those skilled in the art interpoly dielectric is particularly critical as concerns charge retention. This dielectric can consist of a silicon oxide layer in accordance with a well known technique. Development of the technology has also indicated as advantageous the use of a multilayer intermediate dielectric. This preserves the insulating characteristics of the intermediate layer while avoiding the problem of loss of charge by the floating gate to the control gate, whether in the long term or when a high programming potential is applied to the control gate. In particular, as known to those skilled in the art, this class of intermediate dielectrics comprises a triple layer of silicon oxide, silicon nitride and silicon oxide, the so-called ONO. As described e.g. in Patent US-5,104,819, advantageously after formation of an underlying silicon oxide layer and deposition of silicon nitride, an upper silicon oxide layer is formed by deposition instead of by the conventional oxidation of the underlying nitride. The dielectric achieved has good charge retention capability and increased capacitive coupling between floating gate and control gate.
[0011] As concerns the so-called external or peripheral transistors, they are incorporated in circuits outside the memory cell matrix, e.g. logical, or matrix control circuits. Specifically in the framework of the present invention reference is made, as indicated above, to MOS transistors.
[0012] These transistors include an active dielectric, the so-called gate dielectric, placed between the substrate and a gate of electroconductive material, normally polysilicon. Usually the active dielectric consists of a silicon oxide layer formed at high temperature by oxidation of the substrate.
[0013] To minimize the number of production process steps of the entire integrated circuit it is known that the memory cells and peripheral transistors are made simultaneously, as mentioned above. Specifically the present invention falls within a class of processes in which the polysilicon layer making up the gate of the transistors corresponds in the formation process step to the control gate polysilicon layer of the memory cells. In these processes furthermore the intermediate dielectric of the memory cells and the gate dielectric of the transistors of the circuitry are formed simultaneously.
[0014] Such a known process comprises essentially the following steps:
- formation in succession of a gate silicon oxide layer of the cells, of a first polysilicon layer of the floating gate and of the intermediate dielectric;
- removal of the above mentioned layers from the zones in which are formed the transistors of the circuitry;
- formation, by means of high-temperature substrate oxidation, of a silicon oxide layer in the areas in which are to be formed the peripheral transistors; and
- formation of a second polysilicon layer of the control gate of the cells and which also constitutes the gate of the peripheral transistors.
[0015] If it is necessary to form two peripheral transistor types with differentiated gate oxide thicknesses, before formation of the second polysilicon layer the process comprises the additional steps of:
- removal of the silicon oxide layer from the areas of the additional transistor type; and
- formation, again by substrate oxidation, of another silicon oxide layer in the areas of both transistor types.
[0016] Recently in the framework of the research for new types of dielectrics as concerns MOS transistors there was proposed use of a gate dielectric comprising, in addition to a silicon oxide layer achieved by high-temperature thermal oxidation, an overlying layer also of silicon oxide achieved however by deposition. The benefits of such a composite dielectric are described for example in an article entitled "Thin CVD stacked gate dielectric for ULSI technology" by Hsing-Huang Tseng et al, IEDM Technical Digest, pages 321-324, 1993.
[0017] In patent US-5,104,819 above mentioned there is indicated formation of a memory cell matrix having ONO type interpoly dielectric and peripheral transistors with gate dielectric including another deposited silicon oxide layer. The deposited silicon oxide layer of the intermediate dielectric multilayer of the cells also constitutes the gate dielectric upper layer of the peripheral transistors and is formed successively over a first gate thermal silicon oxide layer.
[0018] This manufacturing process however only permits formation of a single type of peripheral transistor. In addition the silicon oxide deposited to complete the gate dielectric is not good quality if its deposition is not followed by a so-called thermodynamic annealing process, as indicated to be necessary also in the above mentioned article.
[0019] The technical problem underlying the present invention is to conceive a process for the formation of non-volatile memory cells and peripheral transistors permitting achievement of a gate dielectric and an intermediate dielectric of good quality, to achieve an integrated circuit having characteristics of great reliability and functionality. This circuit should be provided while minimizing the number of process steps and thus the production costs.
[0020] The process which is the purpose of the present invention should also be particularly flexible and usable for example for the simultaneous formation of peripheral transistors having differentiated gate dielectrics.
[0021] Another purpose of the present invention is to provide a process usable either with intermediate dielectrics comprising only silicon oxide or consisting of the triple ONO layer.
Summary of the invention
[0022] In accordance with the present invention a process for the formation of an integrated circuit in a monocrystalline silicon substrate calls for the provision of at least one matrix of non-volatile memory cells in each of which a floating gate and a control gate, both electroconductive, are electrically insulated from each other by means of an intermediate dielectric multilayer including at least one lower dielectric material layer and one upper silicon oxide layer. The process also comprises simultaneous realization in zones peripheral to the matrix of at least a first transistor type having gate dielectric of a first thickness. There is considered in particular a process of the type in which the gate dielectric of the transistors is formed concomitantly with the intermediate dielectric multilayer of the memory cells.
[0023] In accordance with the present invention, formation of the intermediate dielectric multilayer and the gate dielectric calls for, after formation of the floating gate with a gate oxide layer and a polycrystalline silicon layer, as well as formation of the lower dielectric material layer, the following process steps:
- removal from the matrix peripheral zones of the above mentioned layers;
- deposition of said upper silicon oxide layer over the memory cells and over the substrate in peripheral transistors areas; and
- formation of a first silicon oxide layer at least in the peripheral transistors areas.
[0024] In accordance with a preferred embodiment, formation of the first silicon oxide layer takes place by means of a high-temperature treatment in an oxidizing ambient. The gate dielectric layer is therefore composed of an underlying silicon oxide layer achieved by means of thermal treatment and an overlying silicon oxide layer deposited and densified by the above mentioned thermal treatment.
[0025] To provide an added second transistor type having gate dielectric of a second thickness, indicatively thinner than the first thickness, successive steps are added in accordance with the present invention.
[0026] The gate dielectrics formed can be advantageously nitridized at the end of their formation if desired.
[0027] On the basis of the solution idea underlying the present invention the technical problem is solved by a process for the formation of an integrated circuit comprising non-volatile memory cells and peripheral transistors of the type described above and defined in the characterizing part of claims 1 and following.
[0028] The technical problem is also solved by an integrated circuit comprising non-volatile memory cells and peripheral MOS transistors of at least one type, in accordance with the description contained in the characterizing part of claims 12 and following.
[0029] The characteristics and advantages of the formation process in accordance with the present invention are set forth in the description of embodiments thereof given below by way of non-limiting example with reference to the annexed drawings.
Brief description of the drawings
[0030] In the drawings:
FIGS. 1a-1c show diagrammatic cross section views of successive steps of a process in accordance with the present invention for the formation of non-volatile memory cells and peripheral transistors of a first type, and
FIGS. 2a-2e are diagrammatic cross section views of corresponding process steps in which another type of peripheral transistor is formed simultaneously.
Detailed description
[0031] The description of a formation process for memory cells and peripheral transistors in accordance with the present invention is given below with particular reference to a first preferred embodiment as shown in FIGS. 1a-1c. These figures show unscaled diagrammatic cross section views and illustrate in succession the steps of a formation process for a non-volatile memory cell and a peripheral MOS transistor of a first type. The partial structures of the cell and the transistor are indicated respectively by reference numbers 1 and 2. The regions R1 and R2 represent the zones in which are formed the cell 1 and the transistor 2. There are shown in detail only the process steps more significant for the present invention as regards formation of the intermediate dielectric of the cell and the gate dielectric of the transistor.
[0032] The diagrams shown refer to the preferred case wherein the intermediate dielectric of the memory cell consists as a whole of a triple layer comprising silicon oxide, silicon nitride and silicon oxide in succession.
[0033] The diagrammatic structure of the memory cell 1 is consistent with that of any non-volatile memory cell whether EPROM, EEPROM or FLASH, and consists of a floating gate MOS transistor. The peripheral transistor 2 is also the MOS type in accordance with the present invention. The process to which reference is made specifically in the following description is a MOS type process, preferably performed with CMOS technology.
[0034] The initial steps of a process of formation of memory cells and peripheral transistors, not shown in the figures because conventional, comprise definition on a substrate 3 of semiconductor material, usually monocrystalline silicon, insulation regions where a thick silicon oxide, so-called field oxide, is formed and which delimit active area regions. It is noted that the cross sections shown in the figures are contained entirely in active area regions and therefore the field oxide is not visible.
[0035] Successively both in active area regions in which the memory cells will be formed and in external regions in which the peripheral transistors will be formed, and in particular in regions R1 and R2, silicon oxide, indicated by 4 in the figures, is grown by means of high-temperature thermal oxidation of the substrate. The layer 4 represents the so-called gate oxide of the cells. The gate oxide layer of the cells is thin to allow transfer of the charge between the substrate and the floating gate by means of known physical mechanisms which depend on the type of non-volatile memory. Its thickness can vary indicatively between 70Å and 250Å, depending on the type of non-volatile memory cells and the associated programming and erasure mechanism.
[0036] Over this gate oxide layer 4 of the cells is formed a first layer of electroconductive material, indicated in FIG. 1a by 5 and which will constitute the floating gate of the cell 1. The layer 5 consists commonly of a first polycrystalline silicon layer, known briefly as poly 1, and is usually deposited over the entire silicon chip on which is integrated the circuit.
[0037] The process continues with conventional formation of the lower part of the intermediate dielectric layer of the memory cells. Preferably a silicon oxide layer 6 is formed alternatively by Chemical Vapor Deposition (CVD) or by means of high-temperature oxidation of the polysilicon layer 5. In addition a silicon nitride layer 7 is deposited by the CVD technique. The two layers 6 and 7 shown in the figures represent as a whole the lower dielectric layer 8 which is part of the intermediate dielectric. However the case where the lower layer 8 is entirely made up of a single silicon oxide layer, i.e. without overlaying thereon a silicon nitride layer, falls within the scope of the present invention.
[0038] Some steps which allow partial definition of the final cell structure, by means of removal in some zones of one or more layers from among those described above, are specific for each different non-volatile memory type. These are not described here for the sake of simplicity and are in any case conventional.
[0039] In accordance with the present invention, before formation of the upper part of the intermediate dielectric of the cells, the lower layer 8 of the intermediate dielectric, the polysilicon layer 5 and the gate oxide layer 4 of the cell 1 are removed in succession from the active peripheral areas, i.e. the region R2 in which the peripheral transistor is to be formed. Removal takes place by means of a photolithographic technique of masking and successive chemical etching, at the end of which the mask of photosensitive material, usually a resin, is removed. FIG. 1a shows the structure of the memory cell 1 and the region R2 assigned to the transistor 2 in this process step.
[0040] Advantageously removal of the mask used for the preceding etching is followed by a step of cleaning of the entire chip surface, preferably by means of acid etching, e.g. in hydrofluoric acid (HF). This step has the purpose of eliminating any possible residues of the mask which, being of organic material, introduces impurities, especially on the exposed surface of the substrate in the peripheral region R2. The cleaning can be done advantageously if the lower intermediate dielectric layer 8 includes the silicon nitride layer 7 as in the present embodiment. In this case the exposed cell surface, which consists in this step of silicon nitride, is not damaged by an etching of the specified type.
[0041] The intermediate dielectric of the cells is completed by formation by deposition of a silicon oxide layer 9 shown in FIG. 1b. The deposition can take place by means of any of the chemical vapor deposition techniques and preferably by means of a High Temperature Oxidation (HTO) technique, i.e. by means of any of the high-temperature CVD techniques. As chemical source the choice is between the conventional ones, e.g. tetraethylorthosilicate which is know to those skilled in the art as TEOS. The thickness of this deposited silicon oxide layer 9 is preferably between 50Å and 250Å. Its value depends on that of the intermediate dielectric layer 8.
[0042] As shown in FIG. 1b, the layer 9 is deposited not only in the region R1 of the matrix but also in the peripheral region R2 in which it constitutes the upper part of the gate dielectric of the peripheral transistor 2.
[0043] A silicon oxide layer is formed successively at least in the area R2 of the peripheral transistor. Preferably this step comprises an operation of high-temperature oxidation of the substrate in an oxidizing ambient. The oxidation increases the gate dielectric thickness of the transistor 2 to form a silicon oxide layer between the substrate and the deposited oxide layer 9. This silicon oxide layer is the so-called thermal type because achieved by means of a thermodynamic process of raising the temperature and is indicated in FIG. 1c by 10. This oxidation permits advantageously densification of the deposited silicon oxide layer 9.
[0044] The high-temperature treatment is preferably performed in an oxidizing ambient in an atmosphere containing oxygen (O2) and/or steam (H2O) and at a temperature between 750°C and 950°C.
[0045] Formation of the intermediate dielectric multilayer of the cell 1 and the gate dielectric of the transistor 2 in accordance with the present invention is completed if desired by a nitridizing process performed by means of annealing in an ambient containing N2O to further increase reliability of the gate dielectric of the transistor 2.
[0046] The gate dielectric of the transistor 2 therefore comprises, in the preferred embodiment of the present invention, an underlying thermal silicon oxide layer 10 and an overlying deposited silicon oxide layer 9. The latter appears as an extension of the upper silicon oxide layer of the intermediate dielectric multilayer of the cell 1.
[0047] The process in accordance with the present invention can be further used also where it is necessary for the specific application to integrate in the same memory circuit peripheral transistors of at least two different types. In some applications for example both high-voltage and low-voltage transistors must be implemented. In this case it is the dielectric thickness which characterizes the transistor type as thickness is greater in high-voltage transistors than in low-voltage transistors. In the framework of the present invention we refer more generally to transistors having gate dielectric with different thickness.
[0048] A second embodiment of the present invention in which are formed simultaneously at least two transistor types having gate dielectric of different thickness is illustrated in FIGS. 2a-2e. In these figures, for structurally and functionally equal elements the same reference numbers as for FIG. 1a-1c are used.
[0049] The formation process in this second embodiment provides for formation of a memory cell 1, a first peripheral transistor which is indicated by reference number 2' and has a gate dielectric of a first thickness, and a second peripheral transistor 11 with gate dielectric of a second thickness, respectively in the regions R1, R2 and R3.
[0050] The first process steps are shown in FIGS. 2a-2c. As may be seen, these are similar to those described above in the corresponding FIGS. 1a-1c, and therefore are not further discussed, as regards formation of the cell 1 and the first transistor 2'. It should also be remembered that in this second embodiment the same process steps in the region R2 of the first transistor 2' are performed also in the region R3 where the second transistor 11 is to be formed.
[0051] Next, in accordance with this second embodiment there is performed a step of masking the regions R1 and R2, of cell 1 and the first transistor 2', to allow removal by means of a photolithographic technique and successive chemical etching of the deposited silicon oxide layer 9 and of the underlying deposited silicon oxide 10 from the region R3 assigned to formation of the second transistor 11. FIG. 2d shows the three regions as they appear after removal of the mask.
[0052] An additional silicon oxide layer is formed in the active areas both of the first transistor 2' and of the second transistor 11. The formation is performed in particular by means of an oxidation operation with a high-temperature treatment in oxidizing ambient to induce oxidation of the substrate surface. The silicon oxide layer achieved in this step is indicated by 12 in FIG. 2e.
[0053] Preferably growth of the additional silicon oxide layer 12 takes place by using parameters similar to those chosen above for formation of the silicon oxide layer 10. Therefore this step is performed preferably in an oxidizing ambient at a temperature between 750°C and 950°C and in an atmosphere containing at least one of the following gasses: oxygen (O2) and steam (H2O).
[0054] As shown in FIG. 2e, the gate dielectric of the first transistor 2' therefore comprises a triple silicon oxide layer in which the two underlying layers 12 and 10 are, in accordance with the preferred technique, thermal oxides and the overlying layer 9 is deposited oxide. The gate dielectric of the second transistor 11 includes only one thermal silicon oxide layer and specifically that indicated by 12 and which is formed last. In the figure the line of demarcation between the thermal oxide layers 12 and 10 is shown as a broken line since at the end of both the oxidations the two layers having the same composition and formation are indistinguishable in practice.
[0055] Before the second oxidation to form the layer indicated by 12 and after elimination of the mask for removal of the silicon oxide layers from the regions of the second transistor 11 it is also possible to perform an optional cleaning step with partial surface removal of the deposited silicon oxide layer 9 from the areas of the cell 1 and of the first transistor 2' which were exposed to contamination of the above mentioned mask. In this manner the surface of the layer 9, whose deposition parameters, or alternatively the growth parameters of the layer 10, must in this case be appropriately and previously chosen for achievement of a greater thickness, is adequately cleaned.
[0056] After growth of the last thermal silicon oxide layer 12 formation of the gate dielectric of the first and second peripheral transistors 2' and 11 is completed. The final oxidation can be followed if necessary by a nitridizing operation to improve the quality of the oxides already formed.
[0057] In accordance with the present invention the overall thicknesses of the gate oxides of both types of transistors and in both the embodiments described are indicatively between 70Å and 350Å. The thermal oxide thicknesses also fall within this range.
[0058] With reference to both the embodiments in accordance with the present invention, after the above described formation of the intermediate dielectric multilayer of the cell and the gate dielectric of one or both of the peripheral transistors, completion of the cell and the transistors takes place through standard process steps. In particular a second polysilicon layer, or poly 2, and if desired a silicide layer are deposited and then patterned for simultaneous formation of the control gate of the cell and of the gate of the transistors. The process is completed by appropriate implantations, formation of a passivation layer and of the interconnections by means of opening of contacts, and deposition of one or more metal layers.
[0059] Therefore in the process in accordance with the present invention the gate dielectric at least of the first type of transistor is not formed at the end of formation of the intermediate dielectric of the cells. Deposition of the last silicon oxide layer of the intermediate dielectric allows to achieve simultaneously also the gate dielectric upper layer of the first type of transistors. Advantageously in accordance with the present invention in the first type of peripheral transistors, respectively 2 in FIGS. 1a-1c and 2' in FIGS. 2a-2e, the underlying thermal oxide layer 10, and if required also the layer 12, is formed after the overlying deposited oxide layer 9. This permits formation of the thermal oxide layer and simultaneous densification, as mentioned above, of the layer 9 without further steps such as thermodynamic annealing processes which are essential in accordance with the prior art for curing the deposited layer and to ensure operation of the device.
[0060] The proposed solution, in which the deposited silicon oxide layer is then densified in at least one successive oxidation step, thus provides gate dielectrics with better quality both in terms of defects and in terms of electrical qualities.
[0061] The use of a double layer for formation of the gate dielectric of the first transistor type whose upper part is deposited prevents formation of defects in the gate dielectric if considered as a whole. Indeed, a defect in one of the layers is covered by the other and the simultaneous presence of two defects at exactly the same point in the layer is highly improbable.
[0062] Furthermore the upper layer being deposited is conformal to the underlying structures, so allowing to cover irregular oxide growth in critical positions, e.g. of the field oxide layer at its edges.
[0063] It should be remembered that the thermal oxide and the oxide deposited in accordance with the present invention are distinguishable by means of electrical, physical and optical measurements because they have different dielectric constants.
[0064] It is noted that the process in accordance with the present invention has the advantage of allowing formation of distinct layers of silicon oxide whose thicknesses can be chosen independently. In the preferred cases illustrated in the above description in which the intermediate dielectric layer of the memory cells consists of a triple oxide-nitride-oxide layer the only fixed value for formation of the layers making up the gate dielectric of the transistors is that of the deposited oxide layer. Its thicknesses should be determined, as known to those skilled in the art, on the basis of the relative thickness of the other two layers contained in the intermediate dielectric to ensure good operation thereof.
[0065] The process in accordance with the present invention is particularly simple and its embodiment does not present manufacturing difficulties.
[0066] Another advantage of the described process is the flexibility in particular in the use of optional cleaning steps, described above in the explanation of the individual process steps, for optimization of the functionality of the dielectrics.
[0067] It should be remembered that although a process for manufacturing a memory cell with triple interpoly dielectric layer is described, the present invention is also applicable to the case of intermediate dielectric containing only silicon oxide.
[0068] Of course to the process for the embodiment of non-volatile memory cells and peripheral transistors in accordance with the present invention described above can be made modifications and variations all however falling within the scope of the present invention as defined in the following claims.
1. Process for forming an integrated circuit in a monocrystalline silicon substrate (3)
providing for the implementation of at least one matrix of non-volatile memory cells
(1) in each of which a floating gate and a control gate, both electroconductive, are
electrically insulated from each other by means of an intermediate dielectric multilayer
including at least one lower dielectric material layer (8) and one upper silicon oxide
layer (9) and simultaneous implementation in zones peripheral to the matrix of at
least one first transistors type (2) having gate dielectric of a first thickness and
characterized in that formation of the intermediate dielectric multilayer and the
gate dielectric, after formation of the floating gate with a gate oxide layer (4)
and a polycrystalline silicon layer (5) as well as formation of the lower dielectric
material layer (8), comprises the steps of:
- removal of said layers from the zones peripheral (R2)to the matrix;
- deposition of said upper silicon oxide layer (9) over the memory cells (1) and over the substrate (3) in areas (R2) of the peripheral transistors (2); and
- formation of a first silicon oxide layer (10) at least in the areas (R2) of the peripheral transistors (2).
2. Process in accordance with claim 1 and characterized in that the step of formation
of said first silicon oxide layer (10) comprises an oxidation operation by means of
high-temperature treatment in an oxidizing ambient allowing growth of a thermal silicon
oxide in the areas of the peripheral transistors (R2) between the deposited oxide
layer (9) and the substrate (3).
3. Process in accordance with claim 2 and characterized in that the oxidation operation
is performed in an oxidizing ambient at a temperature between 750°C and 950°C in an
atmosphere containing at least one of the following compounds O2 and H2O.
4. Process in accordance with claim 1 and characterized in that it comprises a step of
high-temperature nitridizing of said first silicon oxide layer (10).
5. Process in accordance with claim 1 in which is included for the further implementation
of at least one second transistors type (3) having gate dielectric of a second thickness,
thinner than said first thickness, and characterized in that it comprises successively:
- removal of said deposited silicon oxide layer (9) and said first silicon oxide layer (10) from the areas (R3) of said second type of peripheral transistors; and
- formation of an additional silicon oxide layer (12) in both the areas (R2,R3) of the first (2) and the second (11) type of peripheral transistors.
6. Process in accordance with claim 5 and characterized in that formation of the additional
silicon oxide layer (12) takes place by means of an oxidation operation comprising
a high-temperature treatment in oxidizing ambient.
7. Process in accordance with claim 6 and characterized in that the oxidation operation
is performed in an oxidizing ambient at a temperature between 750°C and 950°C and
in an atmosphere containing at least one of the following compounds O2 and H2O.
8. Process in accordance with claim 5 and characterized in that it comprises a high-temperature
nitridizing step for said additional silicon oxide layer (12).
9. Process in accordance with claim 5 and characterized in that it comprises a partial
surface removal of the silicon oxide layer (9) deposited and remaining in the areas
(R1) of the cells and of the first transistors type (R2) after removal of said deposited
silicon oxide layer (9) and said first silicon oxide layer (10) from the areas (R3)
of the second peripheral transistor type (11).
10. Process in accordance with claim 1 and characterized in that it is provided in CMOS
technology.
11. Process in accordance with claim 1 or 5 and characterized in that the thickness of
said deposited silicon oxide layer (9) is between 50Å and 250Å and said first (10,9;10,12,9)
and/or said second thickness (12) of the gate dielectric are between 70Å and 350Å.
12. Integrated circuit on a monocrystalline silicon substrate, of the type comprising
at least one matrix of non-volatile memory cells (1) in each of which a floating gate
and a control gate, both electroconductive, are electrically insulated from each other
by means of an intermediate dielectric multilayer including at least one upper silicon
oxide layer (9) and comprising additionally in zones peripheral to the matrix at least
one first transistor type (2) having gate dielectric of a first thickness and characterized
in that the multilayer gate dielectric of the peripheral transistors includes an underlying
layer (10;10,12) of silicon oxide formed by means of thermal treatment and an overlying
deposited silicon oxide layer (9) densified by the above mentioned thermal treatment.
13. Integrated circuit in accordance with claim 12 and characterized in that said deposited
silicon oxide layer (9) of the gate dielectric constitutes the extension of the upper
silicon oxide layer of the intermediate dielectric multilayer.
14. Integrated circuit in accordance with claim 12 further comprising a second type of
transistors (11) having gate dielectric of a second thickness and characterized in
that the gate dielectric comprises a single thermal silicon oxide layer (12).
15. Integrated circuit in accordance with claim 14 and in which said transistors of the
first and second types (2,11) are transistors for high voltage and low voltage respectively
and characterized in that said second thickness of the gate dielectric of the second
transistor type is less than said first thickness of the gate dielectric of the first
transistors type.
16. Integrated circuit in accordance with claim 14 and characterized in that the thickness
of the thermal silicon oxide layer (12) of the gate dielectric of the second transistor
type is less than that of the thermal silicon oxide (10,12) of the first transistors
type.
17. Integrated circuit in accordance with claim 12 or 14 and characterized in that at
least one of the gate dielectric layers is nitridized.
18. Integrated circuit in accordance with claim 12 or 14 and characterized in that the
thickness of said deposited silicon oxide layer (9) is between 50Å and 250Å and said
first (10,9;10,12,9) and/or said second gate dielectric thickness (12) are between
70Å and 350Å.