FIELD OF THE INVENTION
[0001] The present invention relates to inkjet printheads, and more particularly to an improved
fabrication technique for the nozzle structures for inkjet printheads.
BACKGROUND OF THE INVENTION
[0002] Printheads for inkjet printers are precisely manufactured so that the components
cooperate with an integral ink reservoir to achieve a desired print quality. Despite
the precision, the printheads containing the ink reservoir are disposed of when the
ink supply in the reservoir is exhausted. Accordingly, the components of the assembly
need to be relatively inexpensive so that the total per page printing cost, into which
the life of the assembly is factored, can be kept competitive in the marketplace with
other forms of printing.
[0003] Typically the ink, and the materials used to fabricate the reservoir and the printhead,
are not the greatest portion of the cost of manufacturing the printhead assembly.
Rather, it is the labor intensive steps of fabricating the printhead components themselves.
Thus, efforts which lower the cost of producing the printhead have the greatest effect
on the per page printing cost of the inkjet printer in which the printhead assembly
is used.
[0004] One method for lowering the cost for production of printheads is to use manufacturing
techniques which are highly automated. This saves the expense of paying highly skilled
technicians to manually perform each of the manufacturing steps. Another method for
reducing production costs is to improve the overall yield of the automated manufacturing
process. Using a higher percentage of the printheads produced reduces the price per
printhead thus spreading out the cost of manufacture over a greater number of saleable
pieces. Since process yields tend to increase as the number of process steps required
to manufacture a part decrease, it is desirable to reduce the number of process steps
required to manufacture the printhead, or replace complex, low yield process steps
with simpler, higher yield process steps.
[0005] Inkjet printheads are often formed from two or three major components including,
1) a substrate containing resistance elements to energize a component in the ink,
and 2) an integrated flow features/nozzle layer to direct the motion of the energized
ink. The flow features of the printhead may be contained in the nozzle layer or in
a separate layer attached to the nozzle layer or substrate. The individual features
which must cooperate during the printing step are contained in the components, which
are joined together before use. Typically, an adhesive is used to join the components
of the printhead into a unitary structure.
[0006] If the adhesive is applied to one of the components before the manufacturing steps
for that component are completed, then the adhesive layer may retain debris created
during subsequent manufacturing steps. Often the debris is difficult to remove, and
at the very least requires extra processing steps to remove, thus increasing the cost
of the printhead. Additionally, if the debris is not completely removed the adhesive
bond between the substrate and the nozzle layer may be impaired, resulting in a printhead
which either functions improperly, or does not exhibit the expected utility lifetime.
Therefore, the yield reduction caused by unremoved debris increases the cost of producing
the printheads.
[0007] If the adhesive is applied to one of the components after the features are formed
in that component, additional labor intensive steps are required to ensure that the
adhesive is positioned on the portions of the component that are to be used as bonding
surfaces, and that the adhesive is removed from those portions of the component whose
function will be inhibited by the presence of the adhesive. Not only do these extra
steps add to the cost of the printhead, but any error in positioning the adhesive
on the components will tend to reduce the yield of product from the printhead manufacturing
process.
[0008] For example, if adhesive is left in a portion of the component such as a flow channel
for the ink, then the proper function of that flow channel will be inhibited, and
the printhead will be unusable. Alternately, if the adhesive does not adequately cover
the bonding surfaces between the components, then the components may separate, allowing
ink to leak from the completed assembly. Both of these conditions will lower the product
yield, thereby increasing the cost of the printheads produced, as explained above.
[0009] It is an object of this invention, therefore, to provide a method for manufacturing
an inkjet printhead that is highly automated.
[0010] It is another object of this invention to provide an inkjet manufacturing method
that does not require additional process steps for the alignment and removal of adhesive.
[0011] It is a further object of this invention to provide a method for manufacturing an
inkjet printhead in which the adhesive used to join the components does not attract
and retain debris through subsequent process steps.
Summary of the Invention
[0012] The foregoing and other objects are provided by a method for making an inkjet printhead
nozzle member according to the present invention. In the present invention a composite
structure containing a nozzle layer and an adhesive layer is provided, and the adhesive
layer is coated with a polymeric sacrificial layer. The coated composite structure
is then laser ablated to form one or more nozzles in the structure. After forming
the nozzles, the sacrificial layer is removed.
[0013] The sacrificial layer is preferably a water soluble polymeric material, preferably
polyvinyl alcohol, which may be removed by directing jets of water at the sacrificial
layer until substantially all of the sacrificial layer has been removed from the adhesive
layer.
[0014] During the critical laser ablation step, slag and other debris created by laser ablating
the composite structure often adheres to the sacrificial layer rather than to the
adhesive layer. Since the sacrificial layer is water soluble, it may readily be removed
by a simple washing technique, and as a result of removal, will carry with it the
debris adhered thereto. In this manner the nozzle structure is freed of the debris
which may cause structural or operational problems without the use of elaborate cleaning
processes. Furthermore, the adhesive may be applied directly to the nozzle structure
before the nozzles are created by laser ablation, thus simplifying the manufacturing
process.
Brief Description of the Drawings
[0015] Further objects and advantages of the invention will become apparent by reference
to a detailed description of preferred embodiments when considered in conjunction
with the following drawings, in which like reference numerals denote like elements
throughout the several views, and wherein:
Fig. 1 is top plan view, not to scale, of a nozzle layer of a composite structure
of a printhead;
Fig. 2 is a diagrammatical representation of the manufacturing method of the present
invention;
Fig. 3 is a cross-sectional view, not to scale, of a composite structure in which
the nozzle layer is formed;
Fig. 4 is a cross-sectional view, not to scale, of the composite structure containing
a sacrificial layer;
Fig. 5 is a cross-sectional view, not to scale, of the nozzle configuration in the
composite structure after laser ablation of the nozzles; and
Fig. 6 is a cross-sectional view, not to scale, of the completed composite structure
after removal of the sacrificial layer.
Description of the Preferred Embodiments
[0016] Referring now to the drawings, there is depicted in Fig. 1 a plan view representation
of the major features of a nozzle layer 10 of a printhead composite structure. The
nozzle layer 10 is a polymeric material such as polyimide, polyester, fluorocarbon
polymer, or polycarbonate, which is preferably about 15 to about 200 microns thick,
and most preferably about 75 to about 125 microns thick.
[0017] The material from which the nozzle layer 10 is formed may be supplied in a continuous
elongate strip of polymeric material from which many nozzle layers may be formed,
one after another, in a continuous or semi-continuous process. To aid in handling
and providing for positive transport of the elongate strip of polymeric material through
the manufacturing steps, sprocket holes or apertures 12 may be provided in the strip.
[0018] Several important features may be formed in the nozzle layer 10, by processes that
will be more fully described below. There is an ink distribution channel 14, which
receives ink from an ink reservoir (not shown) and supplies the ink to flow channels
16. The flow channels 16 receive the ink from the ink distribution channel 14, and
supply it to resistance elements (not shown) below the bubble chambers 18.
[0019] Upon energizing one or more resistance elements, a component of the ink is vaporized,
imparting mechanical energy to a portion of the ink, thereby ejecting the ink through
a corresponding nozzle 20 of the nozzle layer 10. The ink exiting the nozzle 20 then
impacts the print medium, yielding a pre-defined pattern of ink spots which become
alpha-numeric characters and graphic images.
[0020] The strip of material in which the nozzle layer 10 is formed may be provided on a
large reel 22 such as that schematically illustrated in Fig. 2. Several manufacturers,
such as Ube (of Japan) and E.I. du Pont de Nemours & Co. of Wilmington, Delaware,
commercially supply materials suitable for the manufacture of the nozzle layer, under
the trademarks of UPILEX or KAPTON, respectively. The preferred nozzle layer materials
are formed from a polyimide tape, overlaid with an adhesive layer 24 as depicted in
Fig. 3.
[0021] The adhesive layer 24 is preferably any B-stageable material which may include thermoplastic
macromolecular materials. Examples of B-stageable thermal cure resins include phenolic
resins, resorcinol resins, urea resins, epoxy resins, ethylene-urea resins, furane
resins, polyurethanes, and silicon resins. Suitable macromolecular thermoplastic,
or hot melt, materials include ethylene-vinyl acetate, ethylene ethylacrylate, polypropylene,
polystyrene, polyamides, polyesters and polyurethanes.
[0022] In the most preferred embodiment, the adhesive layer 24 is a phenolic butyral adhesive
such as that used in the laminate RFLEX R1100 or RFLEX R1000, commercially available
from Rogers of Chandler, Arizona. At the position labeled "A" in Fig. 2, the composite
structure of nozzle layer 10 and adhesive layer 24 has the cross-sectional configuration
depicted in Fig. 3. For most applications, the adhesive layer 24 is about 1 to about
25 microns in thickness.
[0023] The adhesive layer 24 is coated with a sacrificial layer 28 as depicted in Fig. 4.
The sacrificial layer 28 may be any polymeric material that is both coatable in thin
layers and removable by a solvent that does not interact with the adhesive layer 24
or the nozzle layer 10. The preferred solvent is water, and polyvinyl alcohol is just
one example of a suitable water soluble sacrificial layer 28.
[0024] Commercially available polyvinyl alcohol materials which may be used as the sacrificial
layer include AIRVOL 165, available from Air Products Inc., EMS1146 from Emulsitone
Inc., and various polyvinyl alcohol resins from Aldrich. The sacrificial layer 28
is most preferably at least about 1 micron in thickness, and is preferably coated
onto the adhesive layer 24, which is on the polyimide carrier sheet which forms the
nozzle layer 10.
[0025] Methods such as extrusion, roll coating, brushing, blade coating, spraying, dipping,
and other techniques known to the coatings industry may be used to coat the composite
strip 26 with the sacrificial layer 28.
[0026] As illustrated by Fig. 2, the sacrificial layer 28 may be coated onto the composite
strip 26 such as by coating roller 34. At position B (Fig. 2), the composite strip
26 now has a cross-sectional dimension as depicted in Fig. 4, with the adhesive layer
24 disposed between the nozzle layer 10 and the sacrificial layer 28.
[0027] The features of the nozzle layer 10, such as distribution channel 14, flow channels
16, bubble chambers 18, and nozzles 20 as depicted in Fig. 1, are preferably formed
by laser ablating the composite strip 26 in a predetermined pattern. A laser beam
36 for creating flow features in the nozzle layer 10 may be generated by a laser 38,
such as an F
2, ArF, KrCl, KrF, or XeCl excimer or frequency multiplied YAG laser.
[0028] Laser ablation of the composite structure of Fig. 4 is accomplished at a power of
from about 100 millijoules per cm
2 to about 5,000 millijoules per cm
2, and preferably about 1,500 millijoules per cm
2. During the laser ablation process, a laser beam with a wavelength of from about
150 nanometers to about 400 nanometers, and most preferably about 248 nanometers,
is applied in pulses lasting from about one nanosecond to about 200 nanoseconds, and
most preferably about 20 nanoseconds.
[0029] Specific features of the nozzle layer 10 are formed by applying a predetermined number
of pulses of the laser beam 36 through a mask 40 which is used for accurately positioning
the flow features in the nozzle layer. Many energy pulses may be required in those
portions of the nozzle layer 10 from which a greater cross-sectional depth of material
is removed, such as the nozzles 20, and fewer energy pulses may be required in those
portions of the nozzle layer 10 which require that only a portion of the material
be removed from the cross-sectional depth of the nozzle layer 10, such as the flow
channels 16, as will be made more apparent hereafter.
[0030] The side boundaries of the features of the nozzle layer 10 are defined by the mask
40 which allows the laser beam 36 to pass through holes in the mask 40 in certain
portions of the mask 40 and inhibits the laser beam 36 from reaching the composite
strip 26 in other portions of the mask 40. The portions of the mask 40 which allow
the laser beam 36 to contact the strip 26 are disposed in a pattern which corresponds
to the shape of the features desired to be formed in the nozzle layer 10.
[0031] During the laser ablation process of the composite strip 26 containing a sacrificial
layer 28, slag and other debris 42 are formed. At least a portion of the debris 42
may land on and adhere to strip 26. In the present invention, since the top layer
of the strip 26 contains the sacrificial layer 28, the debris 42 lands on and adheres
to the sacrificial layer 28 rather than to the adhesive layer 24.
[0032] If the composite strip 26 did not have the sacrificial layer 28, then the debris
42 would land on and adhere to the adhesive layer 24. Once adhered to the adhesive
layer 24, the debris 42 may be difficult to remove, requiring complicated cleaning
procedures or resulting in unusable product. The present invention not only makes
removal of the debris 42 easier, but may also increase yield due to a reduction in
non-usable product.
[0033] After the laser ablation of the composite strip 26 is completed, the strip 26 at
position C has the cross-sectional configuration shown in Fig. 5, as taken through
one of the bubble chambers 18. As can be seen in Fig. 5, the nozzle layer 10 still
contains adhesive layer 24 which is protected by sacrificial layer 28. Debris 42 is
depicted on the exposed surface of the sacrificial layer 28. The relative dimensions
of the flow channel 16, bubble chamber 18, and nozzle 20 are also illustrated in Fig.
5.
[0034] When the sacrificial layer 28 is a water soluble material, removal of the sacrificial
layer 28 and debris 42 thereon is may be accomplished by directing water jets 44 toward
the strip 26 from water sources 46. Alternately, the sacrificial layer 28 may be removed
by soaking the strip 26 in water for a period of time sufficient to dissolve the sacrificial
layer 28. The temperature of the water used to remove the sacrificial layer 28 may
range from about 20°C to about 90°C. Higher water temperatures tend to decrease the
time required to dissolve a polyvinyl alcohol sacrificial layer 28. The temperature
and type of solvent used to dissolve the sacrificial layer 28 is preferably chosen
to enhance the dissolution rate of the material chosen for use as the sacrificial
layer 28.
[0035] The debris 42 and sacrificial layer 28 removed from the adhesive layer are contained
in an aqueous waste stream 48 that is removed from the strip 26. After removal of
the sacrificial layer 28, the adhesive coated composite structure at position D has
a cross-sectional configuration illustrated in Fig. 6. As can be seen in Fig. 6, the
structure contains the nozzle layer 10 and the adhesive layer 24, but the sacrificial
layer 28 which previously coated the adhesive layer 24 has been removed. Sections
50 of the nozzle layer 10 are separated one from another by cutting blades 56 and
are then subsequently attached to silicon heater substrates. The adhesive layer 24
is used to attach the nozzle layer 10 to the silicon substrate.
[0036] Since the debris 42 formed during laser ablation of the nozzle layer 10 was adhered
to the sacrificial layer 28, removal of the sacrificial layer 28 also removed substantially
all of the debris 42 formed during the laser ablation step. Because a water soluble
sacrificial layer 28 is used, removal of the sacrificial layer 28 and debris 42 does
not require elaborate or time consuming operations. Furthermore, the presence of the
sacrificial layer 28 during the laser ablation process effectively prevents debris
42 from contacting and adhering to the adhesive layer 24. Accordingly, with the foregoing
procedure, the adhesive layer 24 may be attached to the nozzle layer 10, rather than
the substrate, prior to laser ablation, thus simplifying the printhead manufacturing
process.
[0037] Before attaching the nozzle layer 10 to the silicon substrate, it is preferred to
coat the silicon substrate with an extremely thin layer of adhesion promoter. The
amount of adhesion promoter should be sufficient to interact with the adhesive of
the nozzle layer 10 throughout the entire surface of the substrate, yet the amount
of adhesion promoter should be less than an amount which would interfere with the
function of the substrate's electrical components and the like. The nozzle layer 10
is preferably adhered to the silicon substrate by placing the adhesive layer 24 against
the silicon substrate, and pressing the nozzle layer 10 against the silicon substrate
with a heated platen.
[0038] In the alternative, the adhesion promoter may be applied to the exposed surface of
the adhesive layer 24 before application of the sacrificial layer 28, or after removal
of the sacrificial layer 28. Well known techniques such as spinning, spraying, roll
coating, or brushing may be used to apply the adhesion promoter to the silicon substrate
or the adhesive layer. A particularly preferred adhesion promoter is a reactive silane
composition, such as DOW CORNING Z6032 SILANE, available from Dow Corning of Midland,
Michigan.
[0039] While preferred embodiments of the present invention are described above, it will
be appreciated by those of ordinary skill in the art that the invention is capable
of numerous modifications, rearrangements and substitutions of parts without departing
from the spirit of the invention.
1. A method for making an inkjet printhead nozzle member comprising:
providing a composite structure containing a nozzle layer and an adhesive layer,
coating the adhesive layer with a polymeric sacrificial layer,
laser ablating the coated composite structure to form one or more nozzles therein,
and
removing the polymeric sacrificial layer from the composite structure.
2. The method of Claim 1 wherein the nozzle layer is a polymeric material.
3. The method of Claim 2 wherein the nozzle layer is selected from the group consisting
of polyimide, polyester, fluorocarbon polymer, and polycarbonate materials.
4. The method of Claim 1 wherein the nozzle layer is from about 15 microns to about 200
microns thick.
5. The method of Claim 1 wherein the adhesive layer is selected from the group consisting
of phenolics, resorcinols, ureas, epoxies, ethylene-ureas, furanes, polyurethanes,
silicones, ethylene-vinyl acetate, ethylene ethylacrylate, polypropylene, polystyrene,
polyamides, polyesters, polyurethanes, and acrylics.
6. The method of Claim 5 wherein the adhesive layer is phenolic butyral.
7. The method of Claim 1 wherein the sacrificial layer is soluble by a solvent that does
not react with and dissolve the adhesive layer and the nozzle layer.
8. The method of Claim 7 wherein the sacrificial layer is a water soluble polymer.
9. The method of Claim 8 wherein the sacrificial layer is polyvinyl alcohol.
10. The method of Claim 8 further comprising removing the sacrificial layer from the composite
by soaking the composite in water for a period of time sufficient to dissolve the
sacrificial layer.
11. The method of Claim 8 further comprising removing the sacrificial layer from the composite
by directing jets of water at the sacrificial layer until the sacrificial layer is
substantially removed from the adhesive layer.
12. The method of Claim 1 wherein the polymeric sacrificial layer is from about one micron
to about five microns thick.
13. The method of Claim 1 wherein the laser ablation is accomplished with a laser selected
from the group consisting of excimer and frequency multiplied YAG lasers.
14. The method of Claim 1 wherein the laser ablation is accomplished at a power of from
about 100 millijoules per cm2 to about 5,000 millijoules per cm2.
15. The method of Claim 1 wherein the laser ablation is accomplished at a wavelength of
from about 150 nanometers to about 400 nanometers.
16. The method of Claim 1 wherein the laser ablation is accomplished by applying the laser
energy in pulses lasting from about one nanosecond to about 200 nanoseconds.
17. The method of Claim 1 wherein the nozzle layer comprises nozzles and flow features.
18. The method of Claim 1 further comprising applying an adhesion promoter to the adhesive
layer prior to coating the adhesive layer with the sacrificial layer.
19. The method of Claim 18 wherein the adhesion promoter is a reactive silane composition.
20. A method of attaching the nozzle member formed by the method of Claim 1 to a silicon
substrate comprising:
applying an adhesion promoter to the silicon substrate, and
attaching the nozzle member to the silicon substrate by placing the adhesive layer
against the silicon substrate, and pressing the nozzle member against the silicon
substrate with a heated platen.
21. The method of Claim 20 wherein the adhesion promoter is a reactive silane composition.