(19)
(11)
EP 0 765 529 A2
(12)
(43)
Date of publication:
02.04.1997
Bulletin 1997/14
(21)
Application number:
95937353.0
(22)
Date of filing:
13.10.1995
(51)
International Patent Classification (IPC):
H01L
23/
29
( . )
H01L
23/
31
( . )
(86)
International application number:
PCT/US1995/012808
(87)
International publication number:
WO 1996/013055
(
02.05.1996
Gazette 1996/20)
(84)
Designated Contracting States:
DE FR GB
(30)
Priority:
13.10.1994
US 19940322769
(71)
Applicant:
NATIONAL SEMICONDUCTOR CORPORATION
Sunnyvale, CA 95086-3737 (US)
(72)
Inventors:
CHEN, Andrea, Shu-hui
Mountain View, CA 94041 (US)
LO, Randy, Hsiao-Yu
Campbell, CA 95008 (US)
TAKIAR, Hem
Fremont, CA 94539 (US)
(74)
Representative:
Bowles, Sharon Margaret, et al
BOWLES HORTON Felden House Dower Mews High Street
Berkhamsted Hertfordshire HP4 2BL
Berkhamsted Hertfordshire HP4 2BL (GB)
(54)
PLASTIC ENCAPSULATION OF IC DEVICE BY TWO LEVEL EPOXY ENCAPSULATION