......DE....FRGB..................................JDIM350 (Ver 2.1 Jan 2001) 2100000/00775952EUROPEAN PATENT SPECIFICATIONB120020109EP96118364.7199611151999030120000112enenen3053579519951124JP200201092002021997052819972220020109200202200103017 7G 05B 19/418 AdeVerfahren und Gerät zur Werskstückzufuhr zum Gerät zur Serienverarbeitung von HalbleiterplattenenWork supplying method and apparatus to batch process apparatus for semiconductor waferfrMéthode et dispositif de chargement de pièces vers un dispositif de traitement par lots pour plaquettes semi-conductricesEP-A- 0 437 634US-A- 5 148 370US-A- 5 351 195US-A- 5 359 524US-A- 5 465 354PATENT ABSTRACTS OF JAPAN vol. 017, no. 154 (C-1040), 26 March 1993 & JP 04 318122 A (SUMITOMO METAL IND LTD), 9 November 1992,1Togashi, YoichiNEC Yamagata, Ltd., 12-12 Kitamachi 4-chomeYamagata-shi, YamagataJPNEC CORPORATION002366903600-X-17.9027-1, Shiba 5-chome, Minato-kuTokyoJPBaronetzky, Klaus, Dipl.-Ing.et al00057481Splanemann Reitzner Baronetzky Westendorp Patentanwälte Rumfordstrasse 780469 MünchenDEDEFRGB19980916199838

This invention relates generally to a diffusion apparatus, a chemical vapor deposition (CVD) apparatus or a like apparatus for processing a semiconductor wafer, and more particularly to a supplying method and a supplying apparatus wherein works are supplied in a batch to a batch process apparatus so as to be processed in a batch by the batch process apparatus.

In a semiconductor wafer process, an operation of forming works such as wafers into a batch is conventionally performed by an operator. In particular, from within a plurality of works transported to the batch process apparatus, those of the works for which processing conditions are same are selected by the operator, and a predetermined number of such works are put in order and formed into a batch and then supplied to the batch process apparatus by the operator. The conventional work supplying method just described has such problems as described below. In particular, since selection of works to be formed into a batch is performed based on determination by an operator in this manner, there is the possibility that wrong determination may be made, and in this instance, unacceptable goods processed by a process different from a required process are produced. Further, the burden to the operator is heavy in that the operator must form works into a batch after a preferential order of the works is recognized, and the presence of the operator makes an obstacle to save in labor. In addition, as the size of wafers to be handled increases, the number of works which can be prepared for a production line decreases, and as a result, the batch process apparatus fails in formation of a batch from a predetermined number of works. Even if the operation rate of the apparatus achieves an aimed rate, an aimed processing quantity cannot be achieved, and the stacking quantity decreases.

In order to eliminate the problems of the conventional work supplying method described above, a batch supplying method which exhibits an improved batch efficiency and allows automation of operation has been proposed in Japanese Patent Laid-Open Application No. Heisei 3-236213.

In particular, according to the batch supplying metod disclosed in the document mentioned above, a formation number of works to be formed into a batch is decided and feeding situations, processing conditions, processing times and a preferential order for processing of different works are grasped in advance, and those works which have same processing conditions are put in a descending order of the preferential degree. Then, if a number of works equal to the formation number are on hand, they are formed as they are into a batch to be supplied, but otherise if a number of works equal to the formation number are not at hand, than it is determinded based on arrival times, processing times and a preferential order of works predicted depending upon the feeding situations whether or not it should be waited that all of works to form one batch arrive, and based on a result of the determination, a batch to be supplied to the batch process apparatus is formed from works of a number either equal to or smaller than the formation number.

Document EP 0 437 634 discloses a complete control system for a manufacturing process in a complete automatic production facility. The systems provide a plurality of units to process through a plurality of processes a plurality of products in order to attain an improvement in productivity. It discloses further an automated production line to meet demands for multi-product/small lot production and shorter delivery time by comprising cell controllers. A detailed work schedule is made by a line control system imaging a short term out of a long term schedule, including a work-in-progress status and comparing estimated with result-by-process times of associated products on the line and actual events updated in real time. The processes are simulated in-the-loop and than sorted in the priority chain.

Document US 5,465,354 discloses a job execution control method and apparatus, where information on processing amounts of a plurality of parallelly executed jobs is periodically sampled during their execution in an operating system. The predicted execution end times of the jobs are calculated and compared on the basis of the discrete CPU time.

The conventional batch supply method described above, however, has such subjects to be solved as described below.

In particular, the first subject resides in that it sometimes occurs that those works whose delivery date is severe, that is, those works which have a comparatively higher preferential degree or degrees, are processed not preferentially but after processing of other works, resulting in failure in delivery of products on or prior to the delivery date.

The reason is that, when a number of works equal to the predetermined formation number are already prepared for the batch process apparatus, since a batch is formed only from the works currently prepared for the batch process apparatus, even if works having a higher preferential degree or degrees than the works prepared in the batch are prepared for the batch process apparatus before the prepared works are actually processed by the batch process apparatus, the works of the higher preferential degree are left without being supplied till a next timing for formation of a batch.

The second subject to be solved of the conventional batch supplying method described above resides in that, if works formed into a batch are processed as they are by the batch process apparatus, then there is the possibility that unacceptable products may be produced from the works.

The reason is that, although, when a number of works equal to the formation number are not on hand, an arrival time of a work is predicted and it is determined whether or not formation of a batch should be waited till such arrival time, if the formation should be waited till arrival time, such determination is made because it is not taken into consideration whether or not a time limitation between different steps is present, and if presence of such time limitation is not taken into consideration, then unacceptable products may possibly be produced.

It is an object of the present invention to provide a work supply method and apparatus for a batch process apparatus for semiconductor wafers by which works having the highest priority among the works being positioned by other work can be processed together with the highest priority work.

It is another object of the present invention to provide a work supplying method and apparatus for a batch process apparatus for semiconductor wafers by which processing in different steps is performed within a limited allowable time determined therfor.

In order to attain the objects decribed above, according to an aspect of the present invention, there is provided a work supplying method to a batch process apparatus for semiconductor wafers for forming a plurality of works prepared for processing by the batch process apparatus and a pre-batch process apparatus into a batch and supplying the works of the batch collectively to the batch process apparatus, comprising the steps of predicting a processing end time in response to a processing start report from the batch process apparatus, designating those of the works which satisfy a condition that the works can arrive at the batch process apparatus on or prior to the predicted processing end time and can be processed by the batch process apparatus as an object of batch formation, forming the designated works into a batch such that one of the works which must be processed first among the works is positioned at the top of the batch, and supplying all of the works formed into a batch to the batch process apparatus simultaneously when processing for one cycle of the batch process apparatus comes to an end.

Preferably, the prediction of a processing end time is performed by referring to a file in which past results (processing end times determined taking processing times and preparation times in the pre-batch processing step of the individual works, transportation times to the batch process time and so forth into consideration) are stored.

Preferably, after the designated works are formed into a batch temporarily, a maximum allowable time required for processing of the batch is confirmed, and if a sufficient time is available, then those of the works which can arrive at the batch process apparatus within the time are added as the object of batch formation and a new batch is formed using also the added works.

Preferably, the work supplying method to a batch process apparatus for semiconductor wafers is constructed such that, if there is a time limitation to a time interval after a time at which processing of works by the pre-batch process apparatus comes to an end till another time at which processing of the works by the batch process apparatus is started, transport means and the pre-batch process apparatus are controlled so that processing by the pre-batch process apparatus is started for works prepared for the pre-batch process apparatus in response to a request from the batch process apparatus.

According to another aspect of the present invention, there is provided a work supplying apparatus to a batch process apparatus for semiconductor wafers for forming a plurality of works prepared for processing by the batch process apparatus and a pre-batch process apparatus into a batch and supplying the works of the batch collectively to the batch process apparatus, comprising processing end time calculation means for referring to a history file in response to a processing start report from the batch process apparatus to predict a processing end time, work extraction means for referring to a step management file to extract those of the works which can arrive at the batch process apparatus on or prior to the processing end time predicted by the processing end time calculation means, batch formation means for forming, designating the works extracted by the work extraction means as an object of batch formation, the works into a batch such that one of the works which has the highest preferential degree is designated as a top work of the batch, and transport means for transporting the works formed into a batch by the batch formation means collectively to the batch process apparatus.

Preferably, the work supplying apparatus for a batch process apparatus for semiconductor wafers further comprises progress situation supervision means for supervising a progress situation, and the batch formation means first forms a batch temporarily and then inquires the progress situation supervision means for a maximum allowable time required for processing of the batch, and if a sufficient time is available, the batch formation means adds those of the works which can arrive at the batch process apparatus within the time as the object of batch formation and forms a new batch using also the added works.

In the conventional batch supplying method described hereinabove, if a number of works equal to a predetermined batch formation number are prepared for a batch process apparatus, then a batch is formed only from those works prepared for the batch process apparatus and is processed by the batch process apparatus. However, in the work supplying method and apparatus of the present invention, irrespective of whether a number of works equal to a predetermined batch formation number are prepared for the batch process apparatus, those of works prepared for the batch process apparatus and for other preceding steps which can arrive at the batch process apparatus on or prior to a processing end time of the batch process apparatus are all designated as an object of batch formation without fail. Accordingly, with the work supplying method and apparatus of the present invention, an otherwise possible disadvantage that processing for works which have a comparatively severe delivery date is performed after processing for other works whose delivery date is not severe is performed can be reduced or eliminated.

Further, the conventional batch supplying method described above is free from the recognition of an allowable limitation time between different steps. However, with the work supplying method of the present invention, where it is constructed such that, if there is a time limitation to a time interval after a time at which processing of works by the pre-batch process apparatus comes to an end till another time at which processing of the works by the batch process apparatus is started, transport means and the pre-batch process apparatus are controlled so that processing by the pre-batch process apparatus is started for works prepared for the pre-batch process apparatus in response to a request from the batch process apparatus, if such allowable limitation time is present, the pre-batch process apparatus does not perform its processing solely but performs its processing in cooperation with the batch process time. Consequently, the allowable limitation time can be observed strictly. For example, where the batch process apparatus performs diffusion processing for a semiconductor wafer and the pre-batch process apparatus performs washing processing prior to such diffusion for the semiconductor wafer, if a long time elapses after the washing processing, then the surface of the semiconductor wafer purified once by the washing is polluted again, and diffusion processing may disadvantageously be performed in this condition. With the work supplying method of the present invention, since processing after washing of a semiconductor wafer till starting of diffusion can be performed within an allowable limitation time determined therefor, no such disadvantage occurs.

In summary, the work supplying method and the work supplying apparatus of the present invention are improved or characterized in that, even if a batch can be formed only from those works prepared for the batch process apparatus, also other works which are prepared for a preceding step such as a step of the pre-batch process apparatus are designated as an object of batch formation, and consequently are advantageous in that processing for different works is performed in a preferential order and delivery dates for the works can be observed strictly. This is because, when a batch is to be formed, not a batch formation number is considered in prior, but works to be formed into a batch are determined in a descending order of the preferential degree after all of those lots which can be formed into a batch are extracted.

The work supplying method and the work supplying apparatus of the present invention are improved also in that it is taken into consideration whether or not there is a time limitation after processing is performed by the pre-batch process apparatus is performed until processing by the batch process apparatus is started, and consequently is advantageous in that prevention of production of an unacceptable product and suppression of a disturbance such as re-construction can be achieved and production as planned upon setting up can be realized. The reason is that a work with which a time limitation is produced if processing for it is performed by the pre-batch process apparatus is not processed solely by the pre-batch process apparatus but is performed in response to a request from the batch process apparatus.

The above and other objects, features and advantages of the present invention will become apparent from the following description and the appended claims, taken in conjunction with the accompanying drawings in which like parts or elements are denoted by like reference characters.

FIGS. 1 and 2 show a supplying apparatus to which the present invention is applied, and particularly, FIG. 1 shows a control system of the supplying apparatus and FIG. 2 shows a transport system and a processing system controlled by the control system of FIG. 1. It is to be noted that, in FIGS. 1 and 2, each of solid line arrow marks indicates a flow of information while each of blank arrow marks indicates a flow of a lot.

Referring first to FIG. 2, each of a plurality of batch process apparatus 1 and 1a is constructed so as to simultaneously process a plurality of sets each including a plurality of semiconductor wafers (not shown) as works. Prior to batch processing by the batch process apparatus 1 and 1a, semiconductor wafers are subject to pre-processing by a plurality of pre-batch process apparatus 5 and 5a. Between those apparatus, semiconductor wafers are transported by a plurality of in-step transport apparatus 2 and 2a, an inter-step transport apparatus 4 and a plurality of buffers 3 and 3a. A plurality of semiconductor wafers are accommodated in each carrier not shown and transported in units of a lot.

Referring now to FIG. 1, the control system shown includes a batch formation control section 6, a progress situation supervision section 7, a lot history management file 8, a lot step management file 9 and an apparatus management file 10. The batch formation control section 6 includes a processing end time calculation section 11, a work extraction section 12 and a batch formation section 13. The processing end time calculation section 11 refers to the lot history management file 8 in response to a start report from the batch process apparatus 1 or 1a and predicts a processing end time of the batch process apparatus 1 or 1a from past records of the lot history management file 8. The work extraction section 12 extracts, based on the lot step management file 9, a lot or lots which can arrive at and be processed by the batch process apparatus 1 or 1a before the predicted processing end time comes. It is to be noted that also the time required for each lot to arrive at a batch process apparatus is detected from past results by the work extraction section 12 referring to the lot history management file 8 and the lot step management file 9.

Then, the batch formation section 13 of the batch formation control section 6 determines all of the thus extracted lots as an object of batch formation, puts one of the lots which has the highest preferential degree and one or more lots which can be processed together with the one lot in order and forms the lots thus put in order into a temporary batch. Then, the batch formation section 13 inquires the progress situation supervision section 7 for a maximum allowable time for processing for the batch, and if a sufficient time is available, then a lot or lots which can arrive at and be processed by the batch process apparatus 1 or 1a are extracted again by the work extraction section 12. Thereafter, addition to and replacement of the members of the lots produced once is performed to decide batch formation lots.

Thereafter, the batch formation control section 6 refers to the lot step management file 9 and the apparatus management file 10 to detect whether or not the thus decided batch formation lots include a lot for which processing must be performed by a batch process apparatus within a fixed time after the processing by the pre-batch process apparatus 5 or 5a, and if such lot is present, a processing starting instruction for the lot is developed. The lots formed into the batch are collected to the buffer 3, and then supplied to the batch process apparatus 1 or 1a simultaneously when processing is completed by the batch process apparatus 1 or 1a.

Subsequently, a batch supplying procedure according to the present invention will be described with reference to the flow charts shown in FIGS. 3 and 4. It is to be noted that, in FIGS. 3 and 4, each solid line arrow mark indicates a flow of information.

First, the batch process apparatus 1 or 1a notifies a processing start report to the batch formation control section 6 when it starts its processing (step S1). In response to the processing start report, the processing end time calculation section 11 of the batch formation control section 6 refers to the lot history management file 8 to determine a time required for batch processing from past results of the lot history management file 8 (step S2) and places a resulting processing end time into a TIME variable (step S3). Further, the processing end time calculation section 11 places "1" into a COUNT variable (step S4). Thereafter, the work extraction section 12 of the batch formation control section 6 extracts those lots which can arrive at and be processed by the batch process apparatus 1 on or prior to the determined processing end time from among all of lots present not only in the buffer 3, inter-step transport apparatus 4, buffer 3a, in-step transport apparatus 2a and pre-batch process apparatus 5 and 5a but also in all other production apparatus based on the lot step management file 9 (step S5). It is to be noted that times required for individual lots to arrive at the batch process apparatus 1 are determined by the batch formation control section 6 referring to the lot history management file 8 and the lot step management file 9 and adding, from past results of them, processing times and preparation times required by the pre-batch process apparatus 5 and 5a and the other production apparatus and transportation times required for transportation, and from the times thus determined, it is determined whether or not the lots can arrive on or prior to the processing end time. Further, it is determined by referring to the lot step management file 9 whether or not processing is possible.

Thereafter, the batch formation section 13 of the batch formation control section 6 puts, designating all of the thus extracted lots as an object of batch formation, a lot which has the highest preferential degree and a lot or lots which can be processed together with the lot in order to form a temporary batch (steps S6 and S7). Then, the batch formation section 13 inquires the progress situation supervision section 7 for a maximum allowable time required for processing for the temporary batch and places a reply to the inquiry into the TIME variable (step S8), and places "2" into the COUNT variable (step S9). If a sufficient time is available, then one or more lots which can arrive at and be processed by the batch process apparatus 1 are extracted by the work extraction section 12 (step S5), and those lots of the conditions in which they can be processed together with the lots of the temporary batch are detected from among the thus extracted lots (step S10).

If such lots which can be processed together are detected (step S11), then if the number of the lots of the temporary batch is smaller than the batch formation number of the batch process apparatus 1, the newly found out lots are added to the lots of the temporary batch and a new batch is formed from the resulting lots (from step S12 to step S16 via step S13).

On the other hand, if the lots of the temporary batch satisfy the batch formation number of the batch process apparatus 1 or 1a, then if some lots have a higher preferential degree or degrees than the lots of the temporary batch, they are replaced with those lots which have lower preferential degrees to re-form a new batch (from step S12 to step S16 via steps S14 and S15).

If a lot which can be processed together is not detected in step S10, then a batch is determined only from the lots of the temporary batch (step S11 or S16). Or, if a lot or lots which can be processed together are detected but have lower preferential degrees or the number of lots of the temporary batch satisfies the batch formation number, then a batch is formed only from the lots of the temporary batch similarly (from step S11 to step S16 via steps S12 and S14).

Then, the batch formation control section 6 refers to the lot step management file 9 and the apparatus management file 10 to detect whether or not the lots of the thus formed batch (step S16) include a lot for which processing must be performed by the batch process apparatus 1 or 1a within a fixed interval of time after pre-processing by the pre-batch process apparatus 5 or 5a is completed. If such lot is detected, then the batch formation control section 6 instructs the in-step transport apparatus 2a and the pre-batch process apparatus 5 or 5a so that the lot may be processed within the fixed interval of time by the batch process apparatus 1 or 1a (from step S17 to step S18).

The lots determined to form a batch are collected to the buffer 3 and then supplied to the batch process apparatus 1 or 1a simultaneously when an end time for one cycle processing of the batch process apparatus 1 or 1a comes (from step S19 to step S20).

 A work supplying method to a batch process apparatus (1, 1a) for semiconductor wafers for forming a plurality of works prepared for processing by said batch process apparatus (1, 1a) and a pre-batch process apparatus (5, 5a) into a batch and supplying the works of the batch collectively to said batch process apparatus (1, 1a), characterized in that it comprises the steps of: predicting a processing end time in response to a processing start report from said batch process apparatus (1, 1a) ; designating those of the works which satisfy a condition that the works can arrive at said batch process apparatus (1, 1a) on or prior to the predicted processing end time and can be processed by said batch process apparatus (1, 1a) as an object of batch formation; forming the designated works into a batch such that one of the works which has the highest priority among the works is positioned at the top of the batch followed by other work which can be processed together with the highest priority work; determining a maximum allowable time for processing said temporary batch; if the number of works in the temporary batch is smaller than a batch formation number indicative of the number of works which may be processed at one time by said batch apparatus, adding additionals works to said temporary bacthc said additionaal works arriving at and being processed by said batch processing apparatus during said maximum allowable time; if the number of works in the temporary batch is equal to the batch formation number, than replacing works in said temporary batch with alternate works having a higher priority than works in said temporary batch, said alternate works arriving at the end being processed by said batch processing apparatus during said maximum allowable time; and supplying all of the works formed into a batch to said batch process apparatus (1, 1a) simultaneously when processing for one cycle of said batch process apparatus (1, 1a) comes to an end. A work supplying method to a batch process apparatus for semiconductor wafers as set forth in claim 1, characterized in that the prediction of a processing end time is performed by referring to a file in which past results are stored. A work supplying method to a batch process apparatus for semiconductor wafers as set forth in claim 1, characterized in that, after the designated works are formed into a batch temporarily, a maximum allowable time required for processing of the batch is confirmed, and if a sufficient time is available, then those of the works which can arrive at said batch process apparatus (1, 1a) within the time are added as the object of batch formation and a new batch is formed using also the added works. A work supplying method to a batch process apparatus (1, 1a) for semiconductor wafers as set forth in claim 1, characterized in that, if there is a time limitation to a time interval after a time at which processing of works by said pre-batch process apparatus (5, 5a) comes to an end till another time at which processing of the works by said batch process apparatus (1, 1a) is started, transport means and said pre-batch process apparatus (5, 5a) are controlled so that processing by said pre-batch process apparatus (5, 5a) is started for works prepared for said pre-batch process apparatus (5, 5a) in response to a request from said batch process apparatus (1, 1a). A work supplying apparatus to a batch process apparatus (1, 1a) for semiconductor wafers for forming a plurality of works prepared for processing by said batch process apparatus (1, 1a) and a pre-batch process apparatus (5, 5a) into a batch and supplying the works of the batch collectively to said batch process apparatus (1, 1a), characterized in that it comprises: processing end time calculation means (11) responsive to a processing start report from said batch process apparatus (1, 1a) and to a history file for predicting a processing end time; work extraction means (12) responsive to a step management file (9) to extract those of the works which can arrive at said batch process apparatus (1, 1a) on or prior to the processing end time predicted by said processing end time calculation means (11); batch formation means (13) for forming the works into a temorary batch such that one of the works which has the highest preferential degree is designated as a top work of the batch; transport means (4) for transporting the works formed into a batch by said batch formation means (13) collectively to said batch process apparatus (1, 1a), wherein said apparatus (1, 1a) further comprises progress situation supervision means (7) for supervising a progress situation, and wherein said batch formation means (13) first forms a batch temporarily and then accesses said progress situation supervision means (7) to determine a maximum allowable time required for processing of the temporary batch, and if the number of works in the temporary batch is smaller than a batch formation number of works which may be processed at one time by said batch processing apparatus, adding additional works to a temporary batch, said additional works arriving at and being processed by said batch processing apparatus during said maximum allowable time; and if the number of works in the temporary batch is equal to the batch formation number, than replacing works in said temporary batch which alternate works having a higher preferential degree than works in said temporary batch, said alternate works arriving at and being passed by said batch processing apparatus during said maximum allowable time. Verfahren zur Werkstückzufuhr für eine Stapelverarbeitungsvorrichtung (1, 1a) von Halbleiter-Wafern zur Bildung einer Vielzahl von Werkstücken, welche für die Verarbeitung durch die Stapelverarbeitungsvorrichtung (1, 1a) sowie eine Vor-Stapelverarbeitungsvorrichtung (5, 5a) zu einem Stapel vorbereitet werden, und zur gesammelten Werkstückzufuhr des Stapels zur Stapelverarbeitungsvorrichtung (1, 1a), dadurch gekennzeichnet, daß das Verfahren die folgenden Schritte aufweist: die Vorhersage einer Verarbeitungsendezeit ansprechend auf einen Verarbeitungs-Startbericht von der Stapelverarbeitungsvorrichtung (1, 1a); die Bestimmung der Werkstücke, welche eine Bedingung erfüllen, daß die Werkstücke zu der Stapelverarbeitungsvorrichtung (1, 1a) zu der oder vor der vorhergesagten Verarbeitungsendezeit gelangen können und mit Hilfe der Stapelverarbeitungsvorrichtung (1, 1a) als ein Ziel der Stapelbildung verarbeitet werden können; die Bildung eines Stapels aus den bestimmten Werkstücken, so daß ein Werkstück, welches die höchste Priorität unter diesen Werkstücken aufweist, am obersten Ende des Stapels angeordnet ist, gefolgt von einem weiteren Werkstück, welches zusammen mit dem Werkstück mit der höchsten Priorität verarbeitet werden kann; die Bestimmung einer maximal zulässigen Zeit für die Verarbeitung des temporären Stapels; falls die Anzahl der Werkstücke im temporären Stapel geringer als eine Stapelbildungszahl ist, welche die Anzahl von Werkstücken wiedergibt, die gleichzeitig durch die Stapelvorrichtung verarbeitet werden können, die Hinzunahme von zusätzlichen Werkstücken zum temporären Stapel, wobei die zusätzlichen Werkstücke der Stapelverarbeitungsvorrichtung während der maximal zulässigen Zeit zugeführt werden und von dieser verarbeitet werden; falls die Anzahl der Werkstücke im temporären Stapel mit der Stapelbildungszahl identisch ist, der Austausch von Werkstücken im temporären Stapel durch andere Werkstücke mit höherer Priorität als die der Werkstücke im temporären Stapel, wobei die Austausch-Werkstücke, welche am Schluß zugeführt werden, von der Stapelverarbeitungsvorrichtung während der maximal zulässigen Zeit verarbeitet werden; und die gleichzeitige Zufuhr aller zu einem Stapel ausgebildeten Werkstücke zur Stapelverarbeitungsvorrichtung (1, 1a), wenn die Verarbeitung für eine Periode der Stapelverarbeitungsvorrichtung (1, 1a) beendet wird. Verfahren zur Werkstückzufuhr zu einer Stapelverarbeitungsvorrichtung für Halbleiter-Wafer gemäß Anspruch 1, dadurch gekennzeichnet, daß die Vorhersage einer Bearbeitungsendezeit durch Zugriff auf eine Datei, in welcher frühere Ergebnisse gespeichert sind, durchgeführt wird. Verfahren zur Werkstückzuführ zu einer Stapelverarbeitungsvorrichtung für Halbleiter-Wafer nach Anspruch 1, dadurch gekennzeichnet, daß nach der temporären Ausbildung der bestimmten Werkstücke in einen Stapel eine maximal zulässige Zeit, welche für die Verarbeitung des Stapels erforderlich ist, bestätigt wird, und falls ausreichend Zeit zur Verfügung steht, dann diejenigen Werkstücke, welche der Stapelverarbeitungsvorrichtung (1, 1a) innerhalb der Zeit zugeführt werden können, als Gegenstand der Stapelbildung hinzugefügt werden, und ein neuer Stapel gebildet wird, welcher auch die hinzugefügten Werkstücke verwendet. Verfahren zur Werkstückzufuhr zu einer Stapelverarbeitungsvorrichtung (1, 1a) für Halbleiter-Wafer gemäß Anspruch 1, dadurch gekennzeichnet, daß bei einer Zeitbegrenzung auf ein Zeitintervall nach einer Zeit, bei welcher die Verarbeitung der Werkstücke durch die Vor-Stapelverarbeitungsvorrichtung (5, 5a) beendet ist, bis zu einer weiteren Zeit, bei der die Verarbeitung der Werkstücke durch die Stapelverarbeitungsvorrichtung (1, 1a) beginnt, eine Transportvorrichtung und die Vor-Stapelverarbeitungsvorrichtung (5, 5a) derart gesteuert werden, daß die Verarbeitung durch die Vor-Stapelverarbeitungsvorrichtung (5, 5a) für Werkstücke, welche für die Vor-Stapelverarbeitungsvorrichtung (5, 5a) vorbereitet sind, ansprechend auf eine Anforderung der Stapelverarbeitungsvorrichtung (1, 1a) gestartet wird. Vorrichtung zur Werkstückzufuhr zu einer Stapelverarbeitungsvorrichtung (1, 1a) für Halbleiter-Wafer zur Ausbildung eines Stapels aus einer Vielzahl von Werkstücken, welche zur Verarbeitung durch die Stapelverarbeitungsvorrichtung (1, 1a) sowie durch eine Vor-Stapelverarbeitungsvorrichtung (5, 5a) und zur gesammelten Zufuhr der Werkstücke des Stapels zu der Stapelverarbeitungsvorrichtung (1, 1a) vorbereitet werden, dadurch gekennzeichnet, daß die Vorrichtung folgendes aufweist: eine Bearbeitungsendezeit-Berechnungsvorrichtung (11), welche auf einen Bearbeitungsstartbericht von der Stapelverarbeitungsvorrichtung (1, 1a) und auf eine History-Datei zur Vorhersage einer Verarbeitungsendezeit anspricht; eine Vorrichtung zur Werkstückentnahme (12), welche auf eine Schrittmanagement-Datei (9) zur Entnahme derjenigen Werkstücke anspricht, welche der Stapelverarbeitungsvorrichtung (1, 1a) in der oder vor der von der Verarbeitungsendezeit-Berechnungsvorrichtung (11) vorhergesagten Zeit zugeführt werden kann; eine Stapelerzeugungsvorrichtung (13) zur Erzeugung eines temporären Stapels aus den Werkstücken, so daß eines der Werkstücke, welches den höchsten Vorzugsgrad aufweist, als ein oberstes Werkstück des Stapels bestimmt wird; eine Transportvorrichtung (4) für den gesammelten Transport der mit Hilfe der Stapelerzeugungsvorrichtung (13) in einen Stapel gebildete Werkstücke zu der Stapelverarbeitungsvorrichtung (1, 1a), wobei die Vorrichtung (1, 1a) darüberhinaus eine Fortschreitsituations-Überwachungsvorrichtung (7) zur Überwachung einer Fortschreitsituation aufweist, und wobei die Stapelerzeugungsvorrichtung (13) zunächst vorübergehend einen Stapel erzeugt und dann auf die Fortschreitsituations-Überwachungsvorrichtung (7) zur Bestimmung einer maximal zulässigen Zeit, welche für die Verarbeitung des temporären Stapels erforderlich ist, Zugriff nimmt, und falls die Anzahl der Werkstücke im temporären Stapel kleiner als eine Stapelbildungszahl der Werkstücke ist, welche gleichzeitig durch die Stapelverarbeitungsvorrichtung verarbeitet werden können, die zusätzlich Werkstücke zu einem temporären Stapel hinzufügt, wobei die zusätzlichen Werkstücke der Stapelverarbeitungsvorrichtung während der maximal zulässigen Zeit zugeführt werden und von dieser verarbeitet werden; und falls die Anzahl der Werkstücke im temporären Stapel mit der Stapelbildungszahl identisch ist, dann der Austausch von Werkstücken im temporären Stapel durch andere Werkstücke mit höherer Priorität als die der Werkstücke im temporären Stapel erfolgt, wobei die Austausch-Werkstücke einen höheren Vorzugsgrad als die Werkstücke in dem temporären Stapel aufweisen und der Stapelverarbeitungsvorrichtung in der maximal zulässigen Zeit zugeführt werden und von dieser weitergeleitet werden. Procédé d'amenée de pièces à un dispositif de traitement par lots (1, 1a) pour des plaquettes en semi-conducteur, destiné à former une pluralité de pièces préparées en vue de leur traitement par ledit dispositif de traitement par lots (1, 1a) et un dispositif de pré-traitement par lots (5, 5a) en un lot et à amener, collectivement, les pièces du lot audit dispositif de traitement par lots (1, 1a), caractérisé en ce qu'il comprend les étapes consistant : à prédire une heure de fin de traitement en réponse à un rapport de début de traitement délivré par ledit dispositif de traitement par lots (1, 1a) ; à désigner celles des pièces qui satisfont à une condition selon laquelle les pièces peuvent arriver audit dispositif de traitement par lots (1, 1a) avant ou à l'heure de fin de traitement prédite, et peuvent être traitées par ledit dispositif de traitement par lots (1, 1a) en tant qu'objet de la formation du lot ; à former les pièces désignées en un lot de telle sorte qu'une des pièces ayant la priorité la plus élevée parmi les pièces est positionnée au-dessus du lot, suivie d'une autre pièce qui peut être traitée conjointement avec la pièce ayant la priorité la plus élevée ; à déterminer une durée admissible maximale allouée au traitement dudit lot temporaire ; lorsque le nombre de pièces du lot temporaire est inférieur à un nombre de formation du lot indicatif du nombre de pièces qui peuvent être traitées à la fois par ledit dispositif de traitement par lots, à ajouter des pièces additionnelles audit lot temporaire, lesdites pièces additionnelles arrivant audit dispositif de traitement par lots et étant traitées par celui-ci au cours de ladite durée admissible maximale ; lorsque le nombre de pièces du lot temporaire est égal au nombre de formation du lot, à remplacer des pièces dudit lot temporaire par d'autres pièces ayant une priorité plus élevée que les pièces dudit lot temporaire, lesdites autres pièces arrivant à la fin étant traitées par ledit dispositif de traitement par lots au cours de ladite durée admissible maximale ; et à amener toutes les pièces formées en un lot audit dispositif de traitement par lots (1, 1a) au même moment où le traitement relatif à un cycle dudit dispositif de traitement par lots (1, 1a) se termine. Procédé d'amenée de pièces à un dispositif de traitement par lots pour des plaquettes en semi-conducteur selon la revendication 1, caractérisé en ce que la prédiction d'une heure de fin de traitement est réalisée en se référant à un fichier dans lequel des résultats antérieurs sont enregistrés. Procédé d'amenée de pièces à un dispositif de traitement par lots pour des plaquettes en semi-conducteur selon la revendication 1, caractérisé en ce que, après que les pièces désignées aient été temporairement formées en un lot, une durée admissible maximale requise par le traitement du lot est confirmée, et lorsqu'une durée suffisante est disponible, alors, celles des pièces qui peuvent arriver audit dispositif de traitement par lots (1, 1a) au cours de cette durée sont ajoutées en tant qu'objet de la formation du lot et un nouveau lot est formé en utilisant également les pièces ajoutées. Procédé d'amenée de pièces à un dispositif de traitement par lots (1, 1a) pour des plaquettes en semi-conducteur selon la revendication 1, caractérisé en ce que, lorsqu'une limite temporelle est imposée sur un intervalle de temps qui s'écoule entre une heure à laquelle se termine le traitement des pièces par ledit dispositif de pré-traitement par lots (5, 5a) et une heure à laquelle débute le traitement par ledit dispositif de traitement par lots (1, 1a), des moyens de transport et ledit dispositif de pré-traitement par lots (5, 5a) sont commandés de telle sorte que le traitement par ledit dispositif de pré-traitement par lots (5, 5a) de pièce préparées par ledit dispositif de pré-traitement par lots (5, 5a) débute en réponse à une requête délivrée par ledit dispositif de traitement par lots (1, 1a). Dispositif d'amenée de pièces à un dispositif de traitement par lots (1, 1a) pour des plaquettes en semi-conducteur, destiné à former une pluralité de pièces préparées en vue de leur traitement par ledit dispositif de traitement par lots (1, 1a) et un dispositif de pré-traitement par lots (5, 5a) en un lot et à amener, collectivement, les pièces du lot audit dispositif de traitement par lots (1, 1a), caractérisé en ce qu'il comprend : des moyens de calcul d'heure de fin de traitement (11) sensibles à un rapport de début de traitement délivré par ledit dispositif de traitement par lots (1, 1a) et à un fichier d'historique, et destinés à prédire une heure de fin de traitement ; des moyens d'extraction de pièces (12) sensibles à un fichier de gestion pas à pas (9) pour extraire celles des pièces qui peuvent arriver audit dispositif de traitement par lots (1, 1a) avant ou à l'heure de fin de traitement prédite par lesdits moyens de calcul d'heure de fin de traitement (11) ; des moyens de formation du lot (13) destinés à former les pièces en un lot temporaire de telle sorte qu'une des pièces ayant le degré préférentiel le plus élevé est désignée comme pièce au-dessus du lot ; des moyens de transport (4) destinés à transporter, collectivement, les pièces formées en un lot par lesdits moyens de formation du lot (13) audit dispositif de traitement par lots (1, 1a), dans lequel ledit dispositif (1, 1a) comprend, en outre, des moyens de supervision de situation en cours (7) destinés à superviser une situation en cours, et dans lequel lesdits moyens de formation du lot (13) forment d'abord, temporairement, un lot, puis accèdent auxdits moyens de supervision de situation en cours (7) afin de déterminer une durée admissible maximale requise par le traitement du lot temporaire, et lorsque le nombre de pièces du lot temporaire est inférieur à un nombre de formation du lot de pièces qui peuvent être traitées à la fois par ledit dispositif de traitement par lots, à ajouter des pièces additionnelles à un lot temporaire, lesdites pièces additionnelles arrivant audit dispositif de traitement par lots et étant traitées par celui-ci au cours de ladite durée admissible maximale ; et lorsque le nombre de pièces du lot temporaire est égal au nombre de formation du lot, à remplacer des pièces dudit lot temporaire par d'autres pièces ayant un degré préférentiel plus élevé que les pièces dudit lot temporaire, lesdites autres pièces arrivant audit dispositif de traitement par lots et étant traitées par celui-ci au cours de ladite durée admissible maximale.