[0001] The present invention relates to electroluminescent devices and in particular face
emission electroluminescent devices used in image recording devices.
[0002] Thin film electroluminescent devices are employed in a variety of applications. For
example, an array of electroluminescent (EL) devices can be used to form a printhead
or used in a facsimile machine. U.S. Patent No.4,535,341 to Kun et al. describes an
array of thin film electroluminescent devices in a printhead, the EL devices emitting
along an edge perpendicular to the common and control electrodes. U.S. Patent No.
5,325,207 to Leksell et al. describes an array of edge emitting electroluminescent
devices used in a facsimile machine for spot scanning.
[0003] Figure 1 shows an edge emitting EL device 100 comprised of an active semiconductor
layer 110 sandwiched between two dielectric layers 112, 114. Electrode layers 116,
118 are formed on the surface of the dielectric layers 112, 114 opposite to the active
semiconductor layer 110. Electroluminescence occurs in the active semiconductor layer
110 when the potential difference between the two electrode layers 116, 118 reaches
a threshold voltage.
[0004] In the past, the focus has been strongly on the use of edge emitting EL device applications
for printing/faxing. Edge emitting EL devices have the desirable property of emitting
from an edge, a thin layer (approximately 1 micron) of phosphor. Further, the length
of the edge emitting array can be easily defined by the user to the desired length
and further individually addressable pixels may be defined by fabricating along this
length. Applicant believes that edge emitting devices have been preferred in the past
because as stated in Kun et al., edge emission devices are typically 30 to 40 times
brighter than conventional face emission devices. However, there are problems associated
with the manufacturing edge emitting EL devices. Some of these problems relate to
the overall cost of manufacturing an emitting array and lens assembly.
[0005] Referring to Figure 1, the active semiconductor layer 110 is positioned between two
dielectric layers 112, 114. Typically, the active semiconductor layer 110 is ZnS doped
with manganese while the dielectric layers 112, 114 are comprised of silicon oxinitride
(SiON). There are difficulties in manufacturing an optically simple and electrically
stable ZnS edge whose emitting surface is aligned perpendicular to a first major surface
of the electrode layer 120. Figure 1 shows what is typically thought to be the ideal
ZnS active layer edge where the plane of the emitting edge and the plane of the dielectric
layers are both aligned perpendicular to the first major surface of the electrode
layer. It is difficult however to etch an "ideal" ZnS edge and typically the ZnS edge
124 and the glass substrate ledge 126 extend past the plane of the edge of the dielectric
layers, adversely affecting the optical properties of the edge emitting device. Further,
the optical properties of the edge emitting devices may be adversely effected by light
reflecting off the glass ledge. These added complexities to the optical properties
of the emitted light effect the ability to couple light into the lens array 130.
[0006] In a standard edge emitting printhead, the edge emitting devices are positioned in
a single row. Use of a single conventional lens in combination with an edge emitting
array is impractical since a conventional lens properly sized to center the sweet
spot of the lens along the light emitting edge would impose unacceptable size requirements
on the printhead. The sweet spot of the lens is the area of the lens where the optical
distortion of the lens produced is within specified limits. Further alternatives to
conventional lenses are the roof lens mirror array described in U.S. Patent No. 5,363,240
to Miyashita and the gradient index rod lens array sometimes referred to as a Selfoc
lens array. Both are refractive lens arrays that image more than one pixel an are
typically placed a predetermined distance from the light source. The roof lens mirror
array described in U.S. Patent No. 5,363,240 has the disadvantages of being optically
complex and difficult to align. The Selfoc lens, which has been used in combination
with an edge emitting printhead, although easy to align, is expensive.
[0007] Image quality is in part related to the number of dots per inch. In edge emitting
devices, increasing the number of dots per inch is limited in part by the number of
edge emitting devices and the spacing between them in the row. Increasing the number
of the edge emitting devices also requires increasing the number of electrical interconnections.
Currently the number of dots per inch is limited by semiconductor processing, the
spacing required to provide optical isolation, and the availability of lenses that
can image closely spaced emitters, and other system related constraints.
[0008] A problem with edge emitting devices is that optical isolation of pixels is difficult.
Optical isolation of adjacent pixels is important to prevent optical cross talk. Solutions
to optical cross talk are known. Figure 1 ofU.S. Patent No. 5,252,895 to Leksell shows
a series of longitudinal channels 20 and a transverse street 32 which serve to optically
isolate adjacent pixels in the edge emitter array. Although, the configuration shown
in Leksell decreases optical cross talk, the addition of these longitudinal channels
20 add processing steps, increasing manufacturing complexity and costs.
[0009] U.S. Patent 5,341,195 to Satoh describes an electrophotographic printer that uses
a surface emitting electroluminescent imaging head. The surface emitting electroluminescent
elements are arranged in two arrays; a first array for imaging in the fast scan direction
and a second array for imaging in the slow scan direction. The EL elements in the
first array and second array have different dimensions wherein the dimensions of the
elements in the slow scan direction are greater than the elements in the fast scan
direction. It is Applicant's understanding of the Satoh reference that a pair of corresponding
elements in the first and second array are used to image a single pixel. The elements
appear to be positioned immediately behind each other thus increasing difficulties
related to optical isolation and heat dissipation.
[0010] A printhead that reduces manufacturing complexity, decreases reliance on particular
lens system, reduces optical cross-talk and increases the amount of space available
for device interconnect is needed.
[0011] The present invention provides a face emission printhead that reduces manufacturing
complexity, decreases reliance on particular lens system, reduces optical cross-talk
and increases the amount of space available for device interconnect and heat dissipation.
The present invention is a face emission printing system including an array of face
emission electroluminescent devices coupled to an optical structure. The face emission
EL printhead is comprised of a substrate; and a plurality of layer stacks supported
on the substrate, each of the layer stacks including a thin film active layer which
generates light in response to conduction of electrical current, a first thin film
electrode layer and a second thin film electrode layer, where at least one of said
electrode layers is spaced apart from said active layer by a thin film dielectric
layer. The first thin film electrode layer is transparent and light is emitted through
the surface of the first thin film electrode layer, in contrast to standard edge emitting
device which light is emitted primarily from the edge perpendicular to the first and
second film electrodes. Typically, the emitted light is optically coupled to an optical
structure, the optical structure preferably formed on the surface of the plurality
of layer stacks. Further the plurality of layer stacks are typically staggered to
maximize the area available for placement of the integral lens systems.
[0012] The face emission printing system reduces design and manufacturing complexity. Because
the emphasis is on face emitted light and not the edge emitted light, the difficult
step of etching a high quality ZnS active layer that is substantially perpendicular
with the dielectric layers is eliminated. Further, printing engine design is simplified
in part because the complex light emission properties resulting from the non-ideal
ZnS edges and glass ledges are eliminated.
[0013] Further, the amount of space available for placement of the emitting region is increased
in face emission printheads. In conventional edge emitting array, the area available
for placement of the emitting region is defined by the boundary of the active region
along the plane generally perpendicular to the first and second electrode layers.
For an emitting array designed to image an 8 ½ inch recording media, this area typically
has a width of approximately 8 ½ inches and a thickness (the plane perpendicular to
the first and second electrode regions) of approximately 1 micron. To achieve an exposure
resolution of approximately 300 dpi, each edge emitting device in the array is approximately
80 microns. Because of the necessity to use the light emitted from the thin dimension
of the edge emitting devices, the devices must be aligned in a single row along the
8 ½ inch width of the print array.
[0014] In contrast, in a conventional face emitting array, the area available for placement
of the emitting region is limited only by the substrate surface area which can be
quite large. The active region is defined by the boundary of the active region along
the plane generally parallel to the first and second electrode regions. The active
regions may be placed in any logical arrangement across the surface of the substrate
that deliver the required dpi exposure resolution on the recording device. This is
in stark contrast to the edge emitting design which is forced to be arrayed along
one edge of the substrate. Further, it is believed that the area of the emitting pixel
can be expanded without significantly effecting the light transmission characteristics
ofthe array and without imposing unacceptable size requirements on the printhead.
For a dot size that has the same dimensions as a dot in the edge emitting array (300
dpi), a face emission array offers increased space available for pixel placement and
device interconnect, and allows for reduced optical cross-talk and improved heat dissipation.
Heat dissipation is important since the substrate, typically glass, does not dissipate
heat well, so that current edge emitting devices which are spaced closely together
cannot be driven to peak output levels. By increasing the placement between face emitting
devices for a given substrate, the devices may be driven harder increasing the brightness
of the pixel.
[0015] In the preferred embodiment of the present invention, each face emitting EL device
is used for imaging a single pixel and the face emission electroluminescent devices
are staggered. Preferably, the electrodes of the EL devices are staggered such that
the first thin film electrode layers of a first subset of the plurality of layer stacks
are aligned along a first line and the first thin film electrode layers of a second
subset of the plurality of layer stacks are aligned along a second line. The first
line is a predetermined distance from the second line, and the predetermined distance
should be large enough to prevent any area overlap of the thin film electrode layers
in the first subset with the thin film electrode layers of the second subset. Staggering
the array layout provides increased area to build the printhead structures including
the emitting pixels, optical structures, electrical interconnect, surface mount sites,
etc.
[0016] The planar surface of the light emitting surface allows for easier incorporation
of integrated optical structures such as micro lenses or other light collection structures.
In edge emitting devices, incorporation of integrated optical structures is difficult
since the ledge and overall geometry of the device interferes with the placement of
an integral lens and the linear array precludes the use of certain lens designs. It
is believed that integrated optical structures are more efficient light collection
structures. In one embodiment, the light collection structure formed on the surface
of the layer stack is a tubular structure having an external surface and an internal
surface, where the internal surface is reflective. The first end of the structure
has a first area A1, and the second end of the structure has an area A2, where the
second area A2 is less than the first area A1. The first end of the structure, the
widest end, is mechanically coupled to the surface of the layer stack. Applicant believes
this type of structure can be used to increase the power per unit area delivered to
the recording media.
[0017] A further understanding of the nature and advantages of the invention described herein
may be realized by reference to the remaining portions of the specification and the
attached drawings.
Figure 1 shows cross-sectional view of a conventional edge emission electroluminescent
device.
Figure 2A shows a partial side cross-sectional view of a staggered face emitting EL
printing system with integral micro lenses according to one embodiment of the present
invention.
Figure 2B shows a top view of a face emission EL printing system wherein the face
emitting EL devices are staggered according to the one embodiment of the present invention.
Figure 3A shows a top view of an integral light concentrator used in a face emission
EL printing system according to an alternative embodiment of the present invention.
Figure 3B shows a top view of an integral light concentrator used in a face emission
EL printing system where the light concentrators are staggered.
[0018] Referring to Figure 2A shows a cross-sectional view of an array 200 of face emission
electroluminescent device 210 according to the preferred embodiment of the present
invention. optically coupled to an optical structure 212. The array of face emission
electroluminescent devices are comprised of a substrate 214; and a plurality of layer
stacks 216 supported on the substrate 214, each of the plurality of layer stacks 216
including a thin film active layer 220 which generates light in response to conduction
of electrical current, a first thin film electrode layer 224 and a second thin film
electrode layer 226, where at least one of said electrode layers (224, 226) is spaced
apart from said thin film active layer 220 by a thin film dielectric layer 230. The
first thin film electrode layer 224 is transparent and light is emitted through the
surface of the first thin film electrode layer 224, in contrast to standard edge emitting
device which light is emitted primarily from the edge perpendicular to the first and
second film electrodes 224, 226. Typically, the emitted light is optically coupled
to an optical structure 212, the optical structure 212 preferably being formed on
an emitting surface 236 ofthe plurality of layer stacks 216.
[0019] The plurality of electroluminescent devices 210 are formed on a substrate 214 which
is typically glass. Although only a single dielectric layer is required, typically
the thin film active semiconductor layer 220 is sandwiched between a first dielectric
layer 230a and a second dielectric layer 230b. An acceptable material for forming
the active semiconductor layer 220 is zinc sulfide doped with manganese. The dielectric
layers 230a, 230b are typically be silicon oxinitride, but other materials may be
selected.
[0020] The active layer 220 and first and second dielectric layers 230a, 230b are positioned
between a first and second electrode layers 224, 226. The electrode layers are typically
formed of indium tin oxide (ITO) but may be formed of other materials. ITO is an electrically
conductive, optically transparent material. Although the second electrode 226 may
be opaque to the wavelength of light emitted, it is required that the first electrode
224 be transparent to the light being emitted, since in the face emission device light
is emitted from the surface of the first electrode 224.
[0021] A drive signal 240 is connected across electrode layers 224 and 226. Typically, the
electroluminescent device is driven by an alternating current drive signal. Electroluminescent
occurs in the active semiconductor layer when electrical current is passed through
the semiconductor layer. The electrical current excites the electrons of the dopant
material. The selection of the material and dopant concentration for forming the active
semiconductor layer determines the frequency of the light emitted.
[0022] In the embodiment shown in Figure 2A, the optical structure 212 coupled to the face
emitting EL layer stacks is a micro lenses. The micro lenses 212 are formed on the
emitting surface of the face emission devices so that they are integral to the face
emission devices. The planar surface of the light emitting surface of the face emission
array allow for easy incorporation of integrated optical structures such as micro
lenses or other light collection structures. It is believed that integrated optical
structures formed integral to the emitting surface of the face emission devices are
more efficient light collection structures.
[0023] Forming a conventional lenses on the surface of an edge emitting EL device is not
practical due to the space restrictions of the EL device. The edge emitting devices
are formed in a row, and placement of the sweet spot of conventional lenses directly
over the pixel would result in overlapping lens edges since the edge emitting devices
must be closely spaced. Further, as previously stated, use of a conventional lens
to encompass all of the edge emitting pixels would impose unacceptable size requirements
on the printhead. Use of a face emission array of devices increases the amount of
area available for placement of the emitting region since the area available for placement
of the emitting regions of the plurality of face emitting stacks is restricted only
by the surface area of the substrate. This is in comparison to the much smaller area
available for placement of emitting regions for edge emitting devices. This additional
area can be used to separate pixels or pixel groups so that optical systems can be
integrally coupled to the face emission devices without the deleterious effects which
would occur in edge emitting devices.
[0024] As can be seen in Figure 2B, a subset 244 of the plurality of layer stacks 216 is
optically coupled to a micro lens 212. Figure 2B shows a top view of a face emission
EL printing system wherein the face emitting EL devices are staggered according to
the one embodiment of the present invention. The sweet spot of the micro lens is represented
by the boundary 246. The outermost perimeter ofthe micro lens 212 formed on the emitting
surface of the array 220 is represented by the boundary 248.
[0025] The micro lens 212 is positioned on the emitting surface of the face emitting array
and is positioned such that the sweet spot 246 of the micro lens 212 is centered over
electrodes 224 of a the plurality of layer stacks 216. As can be seen in Figure 2B,
in order to position the sweet spot of the lens over the first electrode layer 224
of the subset of layer stacks 216, a first portion 250 of the micro lens extends past
the boundary of the sweet spot. This first portion 250 of the micro lens is the area
outside of the sweet spot of the lens. The first portion would result in optical distortions
or lens overlap in a conventional edge emitting array. In edge emitting arrays where
EL pixels must be closely spaced, allowing space between layer stacks so that no layer
stack would be positioned underneath the first portion of the microlens will result
in the absence of properly resolved pixels along the printed row. Further, an unacceptable
result would be the absence of pixels along the printed row. In contrast, in the face
emission arrays there is sufficient area for placement of the emitting regions that
the emitting regions can be positioned so that the first portion of the microlens
do not overlap or interfere with each other.
[0026] Micro lenses 212 are made using techniques well known in the art and are typically
molded from a transparent material. The micro lens 212 is typically adhered to the
emitting surface of the layer stack so that it is integral to the array of EL devices.
The microlens is centered over a plurality of layer stacks. The number of layer stacks
216 positioned underneath the micro lens may vary and may even be one. Preferably,
the layer stacks are staggered as shown in Figure 1. In addition, addressing of the
staggered layer stacks is multiplexed so that a single row of print is formed.
[0027] The optical structures 212 are formed integral to the emitting surface. Although
in the embodiment shown in Figure 2A and 2B, the optical structure 212 is formed on
the surface of the first electrode, alternatively an intermediate layer or layers
may be formed on the surface of the first electrode. In this case, the optical structure
is formed on the surface of the uppermost intermediate layer.
[0028] Referring to Figure 2B, shows a preferred embodiment of the present invention where
the face emission electroluminescent devices are staggered. Preferably, the electrodes
of the EL devices are staggered such that the first thin film electrode layers of
a first subset 250a of the plurality of layer stacks 216 are aligned along a first
line and the first thin film electrode layers of a second subset 250b of the plurality
of layer stacks 216 are aligned along a second line. The first line is a predetermined
distance from the second line, and the predetermined distance should be large enough
to prevent any area overlap of the thin film electrode layers in the first subset
with the thin film electrode layers of the second subset.
[0029] Referring to Figure 2B, each layer stack 216 is directed towards imaging a single
pixel. Each layer stack 216 can be defined by a first position x
i and a second position y
j. In the preferred embodiment, the layer stacks are not aligned immediately behind
one another in the y direction. Thus, in the preferred embodiment, the emitting area
of each layer stack positioned at position x
i has a unique position y
j. In the case of the emitting structures shown in Figure 2B, the emitting area is
defined by the intersection of the first and second electrodes.
[0030] Referring to Figure 2B shows a top view of staggered face emission devices that are
optically coupled to a series of micro lens structures. Although in the preferred
embodiment the staggered pixels are optically coupled to integral lens systems such
as a micro lens or optical concentrator structure, the staggered layer stacks may
be alternatively be coupled to a conventional lens system such as a Selfoc lens array
without a micro lens or optical concentrator structure. Further, the staggered pixels
may be optically coupled to both an integral lens system and a conventional lens system.
[0031] Although the embodiment shown in Figure 2B shows groups of three layer stacks in
each subset 250 of devices, the number of layer stacks grouped beneath a single optical
structure may vary from 1 to n. In one embodiment, the number of layer stacks 216
grouped underneath a single micro lens is ten and the predetermined distance separating
the first and second subsets 250 is 200 microns. The number of subsets of layer stacks
in a row and the number of rows may vary. Further, although the predetermined distance
between subsets of layer stacks may vary, it is preferred that the distance between
subsets of layer stacks be equal and further it is preferred that the subsets of layer
stacks be generally parallel to the width of the printing medium.
[0032] Figures 3A and 3B show an alternative embodiment, where the optical structure 212
integrally coupled to the layer stack is an optical concentrator. The optical concentrator
212 shown in Figures 3A and 3B are non-imaging optic structure for concentrating the
light emitted from the surface of the EL device into a smaller area. In one embodiment,
the optical structure 212 formed on the emitting surface ofthe face emitting device
is a tubular structure. The optical structure may be tapered so that a first end of
the structure has a first area 270, and a second end of the structure has an area
272, where the second area 272 is less than the first area 270. In the case ofthe
emitting structure shown in Figures 3A and 3B, the emitting area of the EL device
is the area 272. The first end of the structure, the widest end, is mechanically coupled
to the surface of the layer stack. In one embodiment, the optical concentrator has
an external surface and an internal surface, where the internal surface is reflective.
[0033] In an alternative embodiment of the optical concentrator, the optical concentrator
is a tapered structure comprised of a solid material, such as an acrylic material.
The solid structure may be coated with a reflective layer, to reflect light generated
from the face emitting EL device.
[0034] The embodiment shown in Figure 3B shows a top view of a plurality of integral light
concentrator used in a face emission EL printing system where the light concentrators
are staggered. Comparing Figure 3B to Figure 3A, the staggered arrangement of optical
concentrators 212 in Figure 3B produce a larger number of pixels in a given area,
thus increasing the pixel density. Further, the area 270 of the optical concentrators
in Figure 3B is larger than in Figure 3A. If the area 270 is defined in both Figures
3A and 3B by the intersection of the first and second electrodes, Applicant believes
that the optical concentrator in Figure 3B outputs a brighter pixel.
[0035] The tapered optical concentrator design is believed to be more optically efficient
than a straight walled edge emitter design that is presently proposed for the edge
emitter in the case entitled "Capped Edge Emitter", filed on October 27, 1994, having
Serial No. 08/330,152. A tapered collector/concentrator could also be designed for
the present edge emitter. This assumes that multiple fraction count pixel density
arrays are used to provide enough space to build the tapered collectors shown here.
[0036] It is understood that the above description is intended to be illustrative and not
restrictive. The scope of the invention should therefore be determined not with reference
to the above description, but instead should be determined with reference to the appended
claims, along with the full scope of equivalents to which such claims are entitled.
1. A face emission electroluminescent printhead comprising:
a substrate [214];
a plurality of layer stacks [216] supported on the substrate, each layer stack [216]
including a thin film active layer [220] which generates light in response to conduction
of electrical current, a first thin film electrode layer [224] and a second thin film
electrode layer [226] , at least one of the electrode layers [224, 226] being spaced
apart from the active layer by a thin film dielectric layer [230], the first thin
film electrode layer [224] being transparent to the generated light, such that a portion
of the light generated is emitted through the first thin film electrode layer, wherein
the layer stacks are staggered so that each layer stack having a position xi has a unique position yj; and
an optical structure [212] for collecting light emitted through the first thin film
electrode layer.
2. The face emission printing system recited in claim 1
wherein the optical structure [212] is formed on the emitting surface [236] of
the layer stack [216].
3. The face emission printhead recited in claim 1 wherein the first thin film electrode
layers of a first subset of the plurality of layer stacks are aligned along a first
line and the first thin film electrode layers of a second subset of the plurality
of layer stacks are aligned along a second line, the first line being a predetermined
distance from the second line, the predetermined distance being large enough to prevent
any area overlap of the first subset of thin film electrode layers with the second
subset of thin film electrode layers.
4. The face emission printhead recited in claim 3 wherein the first line is parallel
to the second line.
5. The face emission printhead recited in claim 3 wherein addressing of the plurality
of layer stacks is multiplexed.
6. The face emission printhead recited in claim 2 wherein the optical structure [212]
is a micro lens.
7. The face emission printhead recited in claim 6 wherein the micro lens is adhered to
the surface of the layer stack.
8. The face emission printhead recited in claim 2, wherein the optical structure [212]
is a light concentrating means having a tubular structure, the tubular structure having
an extemal surface and an intemal surface, wherein the intemal surface is reflective.
9. The face emission printhead recited in claim 8, the first end of the tubular structure
having a first area A1, the second end of the structure having an area A2, wherein
the second area A2 is less than the first area A1, the first end of the structure
being mechanically coupled to the surface of the layer stack.
10. A face emission electroluminescent printhead comprising:
a substrate [214];
a plurality of layer stacks [216] supported on the substrate, each layer stack [216]
including a thin film active layer [220] which generates light in response to conduction
of electrical current, a first thin film electrode layer [224] and a second thin film
electrode layer [226], at least one of the electrode layers [224, 226] being spaced
apart from the active layer by a thin film dielectric layer [230], the first thin
film electrode layer [224] being transparent to the generated light, such that a portion
of the light generated is emitted through the first thin film electrode layer; and
an optical structure [212] for collecting light emitted through the first thin film
electrode layer, the optical structure being formed integral to the emitting surface.