Polishing apparatus and polishing method for silicon wafers

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EP 0 798 079 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	25.03.1998 Bulletin 1998/13

(43)	Date of publication A2:
	01.10.1997 Bulletin 1997/40

(21)	Application number: 97104697.4

(22)	Date of filing: 19.03.1997

(51)	International Patent Classification (IPC)⁶: B24B 55/03, B24B 37/04

(84)	Designated Contracting States:
	DE FR GB

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Priority:

25.03.1996 JP 67997/96
10.03.1997 JP 54504/97

(71)	Applicant: SHIN-ETSU HANDOTAI COMPANY LIMITED
	Chiyoda-ku Tokyo (JP)

(72)	Inventors:
	Fukami, Teruaki, C-304, Aza Ohhira 150-5 Nishishirakawa-gun, Fukushima-ken (JP) Suzuki, Kiyoshi, Aza Uenohara 186 Nishishirakawa-gun, Fukushima-ken (JP) Azito, Toshio, Azaue Uenohara 2 Nishishirakawa-gun, Fukushima-ken (JP)

(74)	Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
	Maximilianstrasse 58 80538 München 80538 München (DE)

(54)	Polishing apparatus and polishing method for silicon wafers

(57) A polishing apparatus and a polishing method of semiconductor wafers are provided, whereby heavy metal contamination of semiconductor wafers can be prevented effectively in a polishing process.
A polishing apparatus of semiconductor wafers including a turn table assembly having a rotatably fixed turn table and a polishing slurry tank for storing polishing slurry to be supplied onto the turn table with a polishing slurry supplying member, wherein the polishing slurry supplying member is provided with means for eliminating heavy metal ions from the polishing slurry.

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