(19)
(11) EP 0 799 118 A1

(12)

(43) Date of publication:
08.10.1997 Bulletin 1997/41

(21) Application number: 95943034.0

(22) Date of filing: 07.12.1995
(51) International Patent Classification (IPC): 
B29B 11/ 08( . )
B29C 45/ 02( . )
B29L 31/ 34( . )
B29C 45/ 00( . )
B29C 45/ 46( . )
(86) International application number:
PCT/US1995/015939
(87) International publication number:
WO 1996/020075 (04.07.1996 Gazette 1996/30)
(84) Designated Contracting States:
DE FR GB IT NL

(30) Priority: 23.12.1994 US 19940363117

(71) Applicant: AMOCO CORPORATION
Chicago, IL 60680-0703 (US)

(72) Inventors:
  • KARUNARATNE, Palitha, Mahendra, S.
    Singapore 2159 (SG)
  • SRINIVASAN, Visveswaran
    Singapore 2264 (SG)
  • CHUA, Manuel, Alameda, Jr.
    Singapore 2264 (SG)
  • CHIN, Neep, Hing
    Singapore 2264 (SG)
  • ROUNDS, Nicholas, Andrew
    Roswell, GA 30075 (US)

(74) Representative: Ritter, Stephen David 
Mathys & Squire 100 Grays Inn Road
London WC1X 8AL
London WC1X 8AL (GB)

   


(54) IMPROVED PROCESS FOR MAKING PREFORMS USEFUL FOR ENCAPSULATING SEMICONDUCTORS