Method and system for transporting substrate wafers

(19)

(11)

EP 0 809 284 B8

(12)	CORRECTED EUROPEAN PATENT SPECIFICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 B1)

(48)	Corrigendum issued on:
	13.06.2007 Bulletin 2007/24

(45)	Mention of the grant of the patent:
	31.01.2007 Bulletin 2007/05

(21)	Application number: 96942663.4

(22)	Date of filing: 27.12.1996

(51)

International Patent Classification (IPC):

H01L 21/68^(2006.01)

H01L 21/00^(2006.01)

(86)	International application number:
	PCT/JP1996/003852

(87)	International publication number:
	WO 1997/024760 (10.07.1997 Gazette 1997/30)

(54)	Method and system for transporting substrate wafers Verfahren und Anordnung zum Transport von Substratscheiben Procédé et dispositif de transfert de substrats en forme de plaques minces

(84)	Designated Contracting States:
	DE FR GB

(30)

Priority:

28.12.1995 JP 34408995
13.06.1996 JP 15269596

(43)	Date of publication of application:
	26.11.1997 Bulletin 1997/48

(73)	Proprietors:
	Taiyo Nippon Sanso Corporation Shinagawa-ku, Tokyo (JP) Toda, Masayuki Yonezawa-shi, Yamagata 992 (JP) Ohmi, Tadahiro Sendai-shi, Miyagi 980-0813 (JP)

(72)	Inventors:
	TODA, Masayuki Yamagata 992 (JP) OHMI, Tadahiro Sendai-shi,Miyagi 980 (JP) ISHIHARA, Yoshio-Nippon Sanso Corporation Ibaraki 300-26 (JP)

(74)	Representative: Munk, Ludwig
	Patentanwalt Prinzregentenstrasse 1 86150 Augsburg 86150 Augsburg (DE)

(56)

References cited: :

EP-A- 0 469 733
JP-A- 4 184 927
JP-A- 6 037 168
US-A- 4 293 249

EP-A- 0 557 523
JP-A- 4 242 952
JP-A- 8 139 156

Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).